Abstract: A method of forming an electrically conductive path through a portion of a semiconductor material, wherein the semiconductor material abuts a substrate and wherein the semiconductor material comprises multiple electronic devices, involves forming an annular trench in the portion, forming an island of semiconductor material within the annular trench, filling the annular trench with an electrically insulating material, removing at least some of the island of semiconductor material to create an exposed inner surface, metalizing at least a portion of the exposed inner surface with a material, and thinning an outer surface side of the substrate until at least the material from the metalizing is exposed on the outer surface side of the substrate.

Abstract: A chip unit has a stack of at least two electronic chips stacked one on top of the other, a through-chip connection within the stack, the through chip connection including a bounding material having an inner and outer perimeter, the inner perimeter defining an interior volume longitudinally extending through at least one of the at least two chips and at least partially into another of the at least two chips so as to form a tube extending between the one and the other of the chips, and an amount of working fluid hermetically sealed within the tube, the working fluid having a volume and being at a pressure such that the working fluid and tube will operate as a heat pipe and transfer heat from the stack of chips to the working fluid.

Abstract: A method of creating a unified chip involves performing front-end processing on a first wafer, the front end processing creating multiple devices on the wafer, performing back-end processing on a second wafer, the back end processing creating layers of interconnected metal traces arranged to interconnect at least some of the multiple devices to each other, and bonding the first wafer to the second wafer such that the multiple devices on the first wafer are interconnected to each other by the metal traces of the second wafer.

Abstract: A semiconductor chip, having IC pads, the semiconductor chip having a device, electrically connected to at least one electrical contact through the IC pad, the electrical contact having a height and a cross sectional profile, through the height, configured to facilitate penetration of at least a portion of the electrical contact into a malleable contact on a second semiconductor chip.

Abstract: An apparatus for use with multiple individual chips having a rigid plate, and a deformable membrane located on the plate, the deformable membrane having a thickness sufficient to allow the deformable membrane to peripherally conform to each of the individual multiple chips irrespective of any difference in height among the multiple individual chips and to prevent each of the multiple individual chips from moving in a lateral direction, the deformable membrane being configured to uniformly transfer a vertical force, applied to the rigid plate, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded during a connect and release cycle without causing damage to the individual chips or bonding surface.

Abstract: A unit has an array of lasers having an emission surface through which beams can be emitted in a substantially vertical direction so as to define an emission side, drive electronics connected to a side opposite to the emission side of the array of lasers, and an array of modulators, located on the emission side of the array of lasers and connected to the drive electronics.

Abstract: An apparatus to accurately hold an optical fiber within a commercial fiber optic connector. The connector has a first high precision slice having multiple holes of a first area and a first alignment opening and a second high precision slice having multiple holes of a second area and a second alignment opening. The holes of the first high precision slice are arranged relative to the first alignment opening so that, when the second high precision slice and the first high precision slice are juxtaposed with one another and the first alignment opening and the second alignment opening are aligned, the holes of the first high precision slice and the holes of the second high precision slice will be offset relative to each other and will define an opening having an area less than a smaller of the first area and second area. The opening is capable of closely constraining an optical fiber inserted therethrough.

Abstract: A unit is made up of an electronic integrated circuit, a MEMS device, and an active optical device, electrically coupled to the electronic integrated circuit and located between the electronic integrated circuit and the MEMS device. Tthe MEMS device is electrically coupled to the electronic integrated circuit and positioned to affect the behavior of light, relative to the active optical device, based upon the position of an element in the MEMS device as controlled by the electronic integrated circuit.

Abstract: A multi-wavelength optical communication system includes a number of emitters each of which emits radiation at a different wavelength; a plurality of the detectors each of which senses radiation at a different wavelength corresponding to the radiation from one of the emitters and a shared waveguide including a scattering medium to transmit emitted radiation to the detectors.

Abstract: A long-throw, tight focussing optical coupler has a first passive optical element capable of coupling light between an optical source and an optical destination and a second passive optical element, capable of coupling light between the optical source and the optical destination, located between the first passive optical element and one of the optical source or the optical destination such that, a light beam from the optical source will be transferred to the optical destination when the optical source and optical destination are spaced apart by a distance.

Abstract: A multi-wavelength optical communication system includes a number of emitters each of which emits radiation at a different wavelength; a plurality of the detectors each of which senses radiation at a different wavelength corresponding to the radiation from one of the emitters and a shared waveguide including a scattering medium to transmit emitted radiation to the detectors.

Abstract: A method of integrating a chip with a topside active optical chip is described. The topside active optical chip has at least one optical laser device, having an active side including an optically active region, a laser cavity having a height, an optically inactive region, a bonding side opposite the active side, and a device thickness. The method involves bonding the optical chip to the electronic chip; applying a substrate to the active side, the substrate having a substrate thickness over the active region in the range of between a first amount and a second amount, and applying an anti-reflection without a special patterning or distinguishing between the at least one optical laser device and any other device. A hybrid electro-optical chip is also described as having an electronic chip; and a topside active optical chip. The hybrid electro-optical chip having been created by one of the methods herein. A module is also described.

Abstract: A method of making A fiber optic connector adapted to receive a fiber bearing unit involves coupling at least one high precision piece, having holes configured to accept an array of optical fibers, to a low precision piece to form a unit, inserting optical fibers into the unit and housing the unit within a fiber optic connector housing. A commercial fiber optic connector of a style constructed to accept a ferrule-like unit therein has a connector housing, at least 36 optical fibers, a low precision piece, and at least one high precision slice having at least 36 fiber holes each adapted to accept one of the optical fibers, the low precision piece and the at least one high precision slice being contained substantially within the connector housing and forming the ferrule like unit.

Abstract: An apparatus for use in a commercial fiber optic connector is made up of an assembly of a set of slices. Each of the slices having multiple through holes of a specified arrangement. At least some of the through holes on any two adjoining slices are aligned with respect to each other so as to define a conduit between them. A transmission medium is within the holes. A method of making a fiber optic connector adapted to receive a fiber bearing unit is also described. The method involves coupling at least two high precision pieces together, the at least two high precision pieces having holes configured with an optical medium inserted therein after the coupling and cured to form a waveguide structure, coupling the at least two high precision pieces to a low precision piece to form a unit, and housing the unit within a fiber optic connector housing.

Abstract: A detector is disposed on the passive side of a laser to detect photon leakage through the passive side mirror and measure as current created in the detector via a Schottkey contact.

Abstract: An optical transmission device configured as a central node, wherein each central node has dedicated pixels for receiving data and transmitting optical data so destination addressing is not required. The network is configured such that transmission on any particular receiver reserved pixels results in data being sent to a predetermined node. In particular, the star topology is configured as a receiver reserved scheme. The device is formed by constructing central node of transmitters and receivers that are attached to a silicon substrate with a processing means, and the optical interface to the transmitters and detectors on the central node establish a one-to-one correspondence with an individual fiber optic cable. The fiber optic cables are reconfigurable to different topologies or interconnections as each fiber optic cable has a known destination on the central node. Various topologies are possible using a star node as the building block.

Abstract: A ferrule has a body, peripherally dimensioned for receipt within a commercially available fiber optic connector, the body has a forward portion comprising a front side and a rear side, the front side defining a face of the ferrule, the rear side defining an inner surface. The forward portion has a large format array of fiber holes, each of the fiber holes in the array extending between the front side and the rear side and being sized to accept an optical fiber inserted therein, and the forward portion having a thickness, T, less than 3000 microns but at least a minimum thickness sufficient to support optical fibers inserted into the fiber holes. An optical connector, having a ferrule, and a fiber optic cable assembly are also described.

Abstract: An optical unit has multiple optical devices, a collimated coupler disposed relative to the multiple optical devices so that laser light can be transferred between at least two of the multiple optical devices and the collimated coupler without crosstalk, and a fused glass collimator, disposed within the collimated coupler, having multiple optical fibers arranged in a predetermined arrangement relative to the multiple optical devices so that the number of optical fibers is always equal or greater than the number of optical devices on a use basis.

Abstract: An apparatus for use in a commercial fiber optic connector is made up of an assembly of a set of slices. Each of the slices having multiple through holes of a specified arrangement. At least some of the through holes on any two adjoining slices are aligned with respect to each other so as to define a conduit between them. A transmission medium is within the holes. A method of making a fiber optic connector adapted to receive a fiber bearing unit is also described. The method involves coupling at least two high precision pieces together, the at least two high precision pieces having holes configured with an optical medium inserted therein after the coupling and cured to form a waveguide structure, coupling the at least two high precision pieces to a low precision piece to form a unit, and housing the unit within a fiber optic connector housing.

Abstract: An apparatus to accurately hold an optical fiber within a commercial fiber optic connector. The connector has a first high precision slice having multiple holes of a first area and a first alignment opening and a second high precision slice having multiple holes of a second area and a second alignment opening. The holes of the first high precision slice are arranged relative to the first alignment opening so that, when the second high precision slice and the first high precision slice are juxtaposed with one another and the first alignment opening and the second alignment opening are aligned, the holes of the first high precision slice and the holes of the second high precision slice will be offset relative to each other and will define an opening having an area less than a smaller of the first area and second area. The opening is capable of closely constraining an optical fiber inserted therethrough.