Patents by Inventor John Cooper

John Cooper has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12135323
    Abstract: Disclosed herein is a multiplex microarray having serially attached non-functionalized biomolecules attached to a polymer coating covering each electrode of an array of electrodes for assays and a method of making the multiplex microarray. The method comprises serially blocking the electrodes of the microarray with a blocking protein, electropolymerizing pyrrole or a functionalized pyrrole on the electrodes where the biomolecule is not present during polymerization, exposing the microarray to a biomolecular solution containing a non-functionalized biomolecule for attachment to the polymer coating, and then repeating the steps to form the multiplex microarray.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: November 5, 2024
    Assignee: CustomArray, Inc.
    Inventor: John Cooper
  • Publication number: 20240279828
    Abstract: Functionalized aryldiazonium salts and films formed by electrografting of functionalized aryldiazonium salts are provided. Methods for purifying functionalized aryldiazonium salts and for coating solid support systems with functionalized aryldiazonium salts are also provided. These coated solid support systems can be used, for example, in methods of oligonucleotide synthesis.
    Type: Application
    Filed: May 31, 2022
    Publication date: August 22, 2024
    Inventors: Feichi HU, Michael W. REED, John COOPER, Jackson KELLOCK, Cheng-Hsien WU
  • Publication number: 20240209018
    Abstract: Provided herein are methods and compositions for oligonucleotide synthesis utilizing universal linker phosphoramidites. Methods and reagents are described with DNA synthesis using controlled pore glass (CPG) solid supports, and on platinum coated electrodes for electrochemical DNA synthesis. The universal linkers can be used as spacers in single-column PCR primer synthesis to generate 2 strands with free 3?-hydroxy termini after cleavage. The methods and compositions utilize a solid support system for synthesis of oligonucleotides, wherein the support has platinum electrodes and a universal linker, optionally wherein the platinum electrode is coated with an amine. The methods and compositions further describe use of universal linker phosphoramidites and the platinum electrode is coated with a monosaccharide, or a disaccharide.
    Type: Application
    Filed: March 22, 2022
    Publication date: June 27, 2024
    Inventors: Michael W. REED, Cheng-Hsien WU, John COOPER, Robert O. DEMPCY
  • Patent number: 11908763
    Abstract: An apparatus includes a semiconductor-based substrate with a functional structure that is formed in or on the semiconductor-based substrate. The apparatus includes a frame structure surrounding the functional structure and includes a coating that covers the functional structure and is delimited by the frame structure.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: February 20, 2024
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Prashanth Makaram, John Cooper, Joerg Ortner, Stephan Pindl, Caterina Travan, Alexander Zoepfl
  • Patent number: 11714942
    Abstract: A method to store the shapes of an electrical circuit design in a hierarchical set of arrays that inverts the layout size order by area includes defining a plurality of storage levels. Each level corresponds to a two-dimensional projection of the three-dimensional volume of the circuit layout. Accordingly, each level subsumes the entire physical space of the circuit layout. Each level may include a respective grid of slots. The slots may be rectangular. Each slot within any single level may be the same size and dimensions as every other slot in this level. Shapes are added to this storage technique based upon size, not based upon physical layer. Each slot can contain shapes from any physical layer as long as that shape fits entirely within the slot.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: August 1, 2023
    Assignee: FRONTIER DESIGN AUTOMATION, LLC
    Inventors: John Cooper, Edward Gernert
  • Patent number: 11610817
    Abstract: A method of processing a semiconductor wafer includes: forming a first metal layer or metal layer stack on a backside of the semiconductor wafer; forming a plating preventative layer on the first metal layer or metal layer stack, the plating preventative layer being formed at least over a kerf region of the semiconductor wafer and such that part of the first metal layer or metal layer stack is uncovered by the plating preventative layer, wherein the kerf region defines an area for dividing the semiconductor wafer along the kerf region into individual semiconductor dies; and plating a second metal layer or metal layer stack on the part of the first metal layer or metal layer stack uncovered by the plating preventative layer, wherein the plating preventative layer prevents plating of the second metal layer or metal layer stack over the kerf region.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: March 21, 2023
    Assignee: Infineon Technologies Austria AG
    Inventors: Andreas Kitzler, John Cooper, Jakob Simon Dohr, Michael Knabl, Matic Krivec, Daniel Pieber
  • Patent number: 11475139
    Abstract: A computer-implemented method for securing a user device is disclosed. A signed device authentication key is requested and received from a user application executing on the user device. The signed device authentication key is obtained via a software module installed on the user device and associated with a secure data processing provider. A device setup request is transmitted from the user device to the secure data processing system using the signed device authentication key. The device setup request comprises the signed device authentication key. The authenticity of the device setup request is verified at the secure data processing system based on the signed device authentication key.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: October 18, 2022
    Assignee: Barclays Execution Services Limited
    Inventors: John Cooper, David Fulton, Jeremy Goldstone
  • Publication number: 20220301933
    Abstract: A method of processing a semiconductor wafer includes: forming a first metal layer or metal layer stack on a backside of the semiconductor wafer; forming a plating preventative layer on the first metal layer or metal layer stack, the plating preventative layer being formed at least over a kerf region of the semiconductor wafer and such that part of the first metal layer or metal layer stack is uncovered by the plating preventative layer, wherein the kerf region defines an area for dividing the semiconductor wafer along the kerf region into individual semiconductor dies; and plating a second metal layer or metal layer stack on the part of the first metal layer or metal layer stack uncovered by the plating preventative layer, wherein the plating preventative layer prevents plating of the second metal layer or metal layer stack over the kerf region.
    Type: Application
    Filed: March 19, 2021
    Publication date: September 22, 2022
    Inventors: Andreas Kitzler, John Cooper, Jakob Simon Dohr, Michael Knabl, Matic Krivec, Daniel Pieber
  • Publication number: 20220058324
    Abstract: A method to store the shapes of an electrical circuit design in a hierarchical set of arrays that inverts the layout size order by area includes defining a plurality of storage levels. Each level corresponds to a two-dimensional projection of the three-dimensional volume of the circuit layout. Accordingly, each level subsumes the entire physical space of the circuit layout. Each level may include a respective grid of slots. The slots may be rectangular. Each slot within any single level may be the same size and dimensions as every other slot in this level. Shapes are added to this storage technique based upon size, not based upon physical layer. Each slot can contain shapes from any physical layer as long as that shape fits entirely within the slot.
    Type: Application
    Filed: August 18, 2021
    Publication date: February 24, 2022
    Inventors: John Cooper, Edward Gernert
  • Publication number: 20220013424
    Abstract: An apparatus includes a semiconductor-based substrate with a functional structure that is formed in or on the semiconductor-based substrate. The apparatus includes a frame structure surrounding the functional structure and includes a coating that covers the functional structure and is delimited by the frame structure.
    Type: Application
    Filed: September 23, 2021
    Publication date: January 13, 2022
    Inventors: Prashanth Makaram, John Cooper, Joerg Ortner, Stephan Pindl, Caterina Travan, Alexander Zoepfl
  • Patent number: 11189539
    Abstract: An apparatus includes a semiconductor-based substrate with a functional structure that is formed in or on the semiconductor-based substrate. The apparatus includes a frame structure surrounding the functional structure and includes a coating that covers the functional structure and is delimited by the frame structure.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: November 30, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Prashanth Makaram, John Cooper, Joerg Ortner, Stephan Pindl, Caterina Travan, Alexander Zoepfl
  • Publication number: 20210269302
    Abstract: Transport vessel filling systems, methods and apparatus are described. Some embodiments include liquid fill nozzle assemblies. Some liquid fill nozzle assemblies are in fluid communication with a sprayfill standpipe. Some liquid fill nozzle assemblies include a plurality of liquid fill nozzle assemblies configured to extend to on one or both lateral sides of a vessel.
    Type: Application
    Filed: February 24, 2021
    Publication date: September 2, 2021
    Inventors: Mike Hennen, John Cooper
  • Publication number: 20200311289
    Abstract: A computer-implemented method for securing a user device is disclosed. A signed device authentication key is requested and received from a user application executing on the user device. The signed device authentication key is obtained via a software module installed on the user device and associated with a secure data processing provider. A device setup request is transmitted from the user device to the secure data processing system using the signed device authentication key. The device setup request comprises the signed device authentication key. The authenticity of the device setup request is verified at the secure data processing system based on the signed device authentication key.
    Type: Application
    Filed: March 26, 2020
    Publication date: October 1, 2020
    Applicant: Barclays Execution Services Limited
    Inventors: John Cooper, David Fulton, Jeremy Goldstone
  • Patent number: 10668884
    Abstract: A vehicle seat restraint system includes a control system and a second-row restraint system. The control system receives a first-row seat value and a second-row seat value from seat sensors. The control system generates relative position data for a first-row seat and a second-row seat based upon the first-row seat value and the second-row seat value. The control system selects a load limiter setting value using a multidimensional load limiter model based upon body impact values as a function of load limiter setting values and the relative position data, a selected load limiter setting value outside a value avoidance zone for the body impact values. The second-row restraint system is configured by the control system with the selected load limiter setting value. The control system may also determine an occupant weight value and select the load limiter setting value using the occupant weight value.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: June 2, 2020
    Assignee: Tesla, Inc.
    Inventors: John Cooper, Madan Gopal, Bruno A. Luz, Honglu Zhang
  • Patent number: 10591476
    Abstract: Disclosed herein is a multiplex microarray having serially attached non-functionalized biomolecules attached to a polymer coating covering each electrode of an array of electrodes for assays and a method of making the multiplex microarray. The method comprises serially blocking the electrodes of the microarray with a blocking protein, electropolymerizing pyrrole or a functionalized pyrrole on the electrodes where the biomolecule is not present during polymerization, exposing the microarray to a biomolecular solution containing a non-functionalized biomolecule for attachment to the polymer coating, and then repeating the steps to form the multiplex microarray.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: March 17, 2020
    Assignee: CustomArray, Inc.
    Inventor: John Cooper
  • Publication number: 20190378776
    Abstract: An apparatus includes a semiconductor-based substrate with a functional structure that is formed in or on the semiconductor-based substrate. The apparatus includes a frame structure surrounding the functional structure and includes a coating that covers the functional structure and is delimited by the frame structure.
    Type: Application
    Filed: June 6, 2019
    Publication date: December 12, 2019
    Inventors: Prashanth Makaram, John Cooper, Joerg Ortner, Stephan Pindl, Caterina Travan, Alexander Zoepfl
  • Patent number: 10093591
    Abstract: A method of characterizing the structure of a void sensitized liquid energetic material, which method comprises defining the material in terms distribution function, the distribution function representing the fraction of liquid energetic material that occurs at a given point within the void sensitized liquid energetic material.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: October 9, 2018
    Assignee: Orica International Pte Ltd
    Inventors: John Cooper, Ian John Kirby, Vladimir Sujansky, Sek K Chan
  • Patent number: 10081579
    Abstract: An explosive composition comprising a liquid energetic material and sensitizing voids, wherein the sensitizing voids are present in the liquid energetic material with a non-random distribution, wherein the liquid energetic material comprises (a) regions in which the sensitizing voids are sufficiently concentrated to render those regions detonable and (b) regions in which the sensitizing voids are not so concentrated and wherein the explosive composition does not contain ammonium nitrate prill.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: September 25, 2018
    Assignee: ORICA INTERNATIONAL PTE LTD
    Inventors: John Cooper, Ian John Kirby, Richard Goodridge, Vladimir Sujansky, Simon James Ferguson
  • Patent number: D878781
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: March 24, 2020
    Assignee: The Wise Company, Inc.
    Inventors: Mike Monroe, Frans Weterrings, John Cooper, Butch Dingler, Bruce Whitmer, Matt Wood, Rocky Martini
  • Patent number: D896538
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: September 22, 2020
    Assignee: The Wise Company
    Inventors: Mike Monroe, Frans Weterrings, John Cooper, Butch Dingler, Bruce Whitmer, Matt Wood, Rocky Martini