Patents by Inventor John Knickerbocker

John Knickerbocker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11049841
    Abstract: A interposer sandwich structure comprises a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes means for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: June 29, 2021
    Assignee: International Business Machines Corporation
    Inventors: William Emmett Bernier, Bing Dang, Mario J. Interrante, John Knickerbocker, Son Kim Tran
  • Patent number: 10964925
    Abstract: Vertical via connections to a battery are hermetically sealed to prevent environmental factors (e.g. moisture, oxygen, and nitrogen) from entering the internals of the battery through porous conductive material filling the vias resulting in reduced battery performance and battery failure.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: March 30, 2021
    Assignees: International Business Machines Corporation, Front Edge Technology, Inc
    Inventors: Bing Dang, Qianwen Chen, Yu Luo, John Knickerbocker, Jae-Woong Nah, Kai Liu, Po-wen Cheng, Tung-hsiu Shih, Mengnian Niu, Kai-wei Nieh
  • Patent number: 10903153
    Abstract: Die stacks and methods of making die stacks with very thin dies are disclosed. The die surfaces remain flat within a 5 micron tolerance despite the thinness of the die and the process steps of making the die stack. A residual flux height is kept below 50% of the spacing distance between adjacent surfaces or structures, e.g. in the inter-die spacing.
    Type: Grant
    Filed: November 18, 2018
    Date of Patent: January 26, 2021
    Assignee: International Business Machines Corporation
    Inventors: John Knickerbocker, Bing Dang, Raymond Horton, Joana Maria
  • Patent number: 10892643
    Abstract: Systems, devices, and techniques facilitating wirelessly charging and/or communicating with one or more electronic devices (e.g., electronic wearable devices) are provided. A device can comprise a memory and a storage component that can be operatively coupled to the memory. The storage component can comprise one or more recesses that can receive a second device that can be charged by the storage component. The storage component can comprise a charging circuit and an inductive circuit that can be coupled to the charging circuit. The storage component can harvest energy from one or more energy sources to charge the charging circuit. Based on the energy harvested, the inductive circuit can inductively couple to the second device having a second inductive circuit and positioned in at least one of the recesses and the inductive circuit can charge a power source of the second device.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: January 12, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Bing Dang, Duixian Liu, Jean-Olivier Plouchart, John Knickerbocker
  • Patent number: 10878231
    Abstract: Writing recognition using a wearable pressure sensing device includes receiving pressure measurement data from a pressure sensor disposed upon a body part of a user. The pressure measurement data is indicative of a change in pressure of the body part due to an interaction of the body part with a medium indicative of a writing gesture by the user. A start boundary and end boundary for each of a plurality of writing symbols is detected based upon the pressure measurement data. At least one feature of the pressure measurement data associated with the plurality of writing symbols is extracted. A symbol pattern is detected based upon the extracted features, and at least one letter is detected based upon the symbol pattern. A word is detected based upon the detected at least one letter.
    Type: Grant
    Filed: May 10, 2018
    Date of Patent: December 29, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Katsuyuki Sakuma, Stephen J. Heisig, John J. Rice, John Knickerbocker, Gaddi Blumrosen
  • Publication number: 20200395115
    Abstract: A drug delivery form includes a drug and electronics. The electronics includes memory(ies) having drug delivery form information, including information about the drug and about at least part of a supply chain from manufacture of the drug delivery form to a current location in the supply chain. The electronics includes communication circuitry configured to read data from and write data to the drug delivery form information. An apparatus includes memory(ies) having computer readable code, and processor(s). The processor(s) cause the apparatus to perform operations including communicating with a drug delivery form including a drug and drug delivery form information, including information about the drug and about at least part of a supply chain from manufacture of the drug delivery form to a current location in the supply chain. The processor(s) cause the apparatus to perform reading data from or writing data into the drug and drug delivery form information.
    Type: Application
    Filed: June 13, 2019
    Publication date: December 17, 2020
    Inventors: John Knickerbocker, Li-Wen Hung, Bing Dang, Katsuyuki Sakuma, Jeffrey Donald Gelorme, Rajeev Narayanan, Qianwen Chen
  • Patent number: 10833296
    Abstract: Systems and/or techniques associated with a solid-state microbattery packaging system are provided. In one example, a device comprises a substrate layer and a tape substrate layer. The substrate layer is associated with a set of solid-state microbattery components. The tape substrate comprises a releasable adhesive material and a polymer sealing material. A conductive surface associated with the set of solid-state microbattery components is disposed on the releasable adhesive material of the tape substrate layer.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: November 10, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Qianwen Chen, Bing Dang, John Knickerbocker, Bo Wen
  • Publication number: 20200274113
    Abstract: Vertical via connections to a battery are hermetically sealed to prevent environmental factors (e.g. moisture, oxygen, and nitrogen) from entering the internals of the battery through porous conductive material filling the vias resulting in reduced battery performance and battery failure.
    Type: Application
    Filed: February 22, 2019
    Publication date: August 27, 2020
    Inventors: Bing Dang, Qianwen Chen, Yu Luo, John Knickerbocker, Jae-Woong Nah, Kai Liu, Po-wen Cheng, Tung-hsiu Shih, Mengnian Niu, Kai-wei Nieh
  • Patent number: 10750955
    Abstract: A health & fitness tracking device may include a display that provides fitness information to a wearer of the health & fitness tracking device, at least one physiological sensor that obtains physiological data by monitoring at least one physiological condition of the wearer, at least one environmental sensor that obtains environmental data by monitoring at least one environmental condition, a data storage device that stores the physiological data, the environmental data, and medical history data relating to the wearer, a memory storing a computer program, and a processor that executes the computer program. The computer program may adjust a sensor configuration of the at least one physiological sensor based on the medical history data.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: August 25, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: John Knickerbocker, Shriya Kumar
  • Publication number: 20200211947
    Abstract: Die stacks and methods of making die stacks with very thin dies are disclosed. The die surfaces remain flat within a 5 micron tolerance despite the thinness of the die and the process steps of making the die stack. A residual flux height is kept below 50% of the spacing distance between adjacent surfaces or structures, e.g. in the inter-die spacing.
    Type: Application
    Filed: March 8, 2020
    Publication date: July 2, 2020
    Inventors: John Knickerbocker, Bing Dang, Raymond Horton, Joana Maria
  • Publication number: 20200205735
    Abstract: Systems, computer-implemented methods and/or computer program products that facilitate wearable multiplatform sensing are provided. In one embodiment, a computer-implemented method comprises: measuring, by a system operatively coupled to a processor, wirelessly on a nail plate, physiological data of an entity; integrating and synchronizing, by the system, the physiological data with other physiological data from one or more devices to form integrated physiological data; and analyzing, by the system, the integrated physiological data to detect one or more disorders.
    Type: Application
    Filed: January 2, 2019
    Publication date: July 2, 2020
    Inventors: Rajeev Narayanan, Katsuyuki Sakuma, John Knickerbocker, Bucknell C. Webb
  • Publication number: 20200191722
    Abstract: Techniques for colorimetric based test strip analysis and reader system are provided. In one aspect, a method of test strip analysis includes: illuminating a test strip wetted with a sample with select spectrums of light, wherein the test strip includes test pads that are configured to change color in the presence of an analyte in the sample; obtaining at least one digital image of the test strip; and analyzing color intensity from the at least one digital image against calibration curves to determine an analyte concentration in the sample with correction for one or more interference substances in the sample that affect the color intensity. A calibration method and a reader device are also provided.
    Type: Application
    Filed: February 20, 2020
    Publication date: June 18, 2020
    Inventors: Minhua Lu, Vince Siu, Russell Budd, Evan Colgan, John Knickerbocker
  • Publication number: 20200161230
    Abstract: Die stacks and methods of making die stacks with very thin dies are disclosed. The die surfaces remain flat within a 5 micron tolerance despite the thinness of the die and the process steps of making the die stack. A residual flux height is kept below 50% of the spacing distance between adjacent surfaces or structures, e.g. in the inter-die spacing.
    Type: Application
    Filed: November 18, 2018
    Publication date: May 21, 2020
    Inventors: John Knickerbocker, Bing Dang, Raymond Horton, Joana Maria
  • Patent number: 10605741
    Abstract: Techniques for colorimetric based test strip analysis and reader system are provided. In one aspect, a method of test strip analysis includes: illuminating a test strip wetted with a sample with select spectrums of light, wherein the test strip includes test pads that are configured to change color in the presence of an analyte in the sample; obtaining at least one digital image of the test strip; and analyzing color intensity from the at least one digital image against calibration curves to determine an analyte concentration in the sample with correction for one or more interference substances in the sample that affect the color intensity. A calibration method and a reader device are also provided.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: March 31, 2020
    Assignee: International Business Machines Corporation
    Inventors: Minhua Lu, Vince Siu, Russell Budd, Evan Colgan, John Knickerbocker
  • Publication number: 20200075906
    Abstract: Techniques regarding a thin film battery, which can comprise one or more sealing layers, and a method of manufacturing thereof are provided. For example, one or more embodiments described herein can regard an apparatus that can comprise a thin film battery cell encapsulated in a multi-layer stack comprising an adhesive layer located between a first substrate layer and a second substrate layer. The apparatus can also comprise a metal sealing layer at least partially surrounding the multi-layer stack.
    Type: Application
    Filed: September 4, 2018
    Publication date: March 5, 2020
    Inventors: Qianwen Chen, Bing Dang, Bo Wen, Marlon Agno, John Knickerbocker
  • Publication number: 20200051948
    Abstract: Techniques for high speed handling of ultra-small chips (e.g., micro-chips) by selective laser bonding and/or debonding are provided. In one aspect, a method includes: providing a first wafer including chips bonded to a surface thereof; contacting the first wafer with a second wafer, the second wafer including a substrate bonded to a surface thereof, wherein the contacting aligns individual chips with bonding sites on the substrate; and debonding the individual chips from the first wafer using a debonding laser having a small spot size of about 0.5 ?m to about 100 ?m, and ranges therebetween. A system is also provided that has digital cameras, a motorized XYZ-axis stage, and a computer control system configured to i) control a spot size of the at least one laser source and ii) adjust a positioning of the sample to align individual chips with a target area of the laser.
    Type: Application
    Filed: October 21, 2019
    Publication date: February 13, 2020
    Inventors: Qianwen Chen, Bing Dang, Russell Budd, Bo Wen, Li-Wen Hung, Jae-Woong Nah, John Knickerbocker
  • Publication number: 20200003698
    Abstract: Techniques for colorimetric based test strip analysis and reader system are provided. In one aspect, a method of test strip analysis includes: illuminating a test strip wetted with a sample with select spectrums of light, wherein the test strip includes test pads that are configured to change color in the presence of an analyte in the sample; obtaining at least one digital image of the test strip; and analyzing color intensity from the at least one digital image against calibration curves to determine an analyte concentration in the sample with correction for one or more interference substances in the sample that affect the color intensity. A calibration method and a reader device are also provided.
    Type: Application
    Filed: June 28, 2018
    Publication date: January 2, 2020
    Inventors: Minhua Lu, Vince Siu, Russell Budd, Evan Colgan, John Knickerbocker
  • Patent number: 10490525
    Abstract: Techniques for high speed handling of ultra-small chips (e.g., micro-chips) by selective laser bonding and/or debonding are provided. In one aspect, a method includes: providing a first wafer including chips bonded to a surface thereof; contacting the first wafer with a second wafer, the second wafer including a substrate bonded to a surface thereof, wherein the contacting aligns individual chips with bonding sites on the substrate; and debonding the individual chips from the first wafer using a debonding laser having a small spot size of about 0.5 ?m to about 100 ?m, and ranges therebetween. A system is also provided that has digital cameras, a motorized XYZ-axis stage, and a computer control system configured to i) control a spot size of the at least one laser source and ii) adjust a positioning of the sample to align individual chips with a target area of the laser.
    Type: Grant
    Filed: May 10, 2018
    Date of Patent: November 26, 2019
    Assignee: International Business Machines Corporation
    Inventors: Qianwen Chen, Bing Dang, Russell Budd, Bo Wen, Li-Wen Hung, Jae-Woong Nah, John Knickerbocker
  • Publication number: 20190348392
    Abstract: Techniques for high speed handling of ultra-small chips (e.g., micro-chips) by selective laser bonding and/or debonding are provided. In one aspect, a method includes: providing a first wafer including chips bonded to a surface thereof; contacting the first wafer with a second wafer, the second wafer including a substrate bonded to a surface thereof, wherein the contacting aligns individual chips with bonding sites on the substrate; and debonding the individual chips from the first wafer using a debonding laser having a small spot size of about 0.5 ?m to about 100 ?m, and ranges therebetween. A system is also provided that has digital cameras, a motorized XYZ-axis stage, and a computer control system configured to i) control a spot size of the at least one laser source and ii) adjust a positioning of the sample to align individual chips with a target area of the laser.
    Type: Application
    Filed: May 10, 2018
    Publication date: November 14, 2019
    Inventors: Qianwen Chen, Bing Dang, Russell Budd, Bo Wen, Li-Wen Hung, Jae-Woong Nah, John Knickerbocker
  • Publication number: 20190347479
    Abstract: Writing recognition using a wearable pressure sensing device includes receiving pressure measurement data from a pressure sensor disposed upon a body part of a user. The pressure measurement data is indicative of a change in pressure of the body part due to an interaction of the body part with a medium indicative of a writing gesture by the user. A start boundary and end boundary for each of a plurality of writing symbols is detected based upon the pressure measurement data. At least one feature of the pressure measurement data associated with the plurality of writing symbols is extracted. A symbol pattern is detected based upon the extracted features, and at least one letter is detected based upon the symbol pattern. A word is detected based upon the detected at least one letter.
    Type: Application
    Filed: May 10, 2018
    Publication date: November 14, 2019
    Applicant: International Business Machines Corporation
    Inventors: KATSUYUKI SAKUMA, Stephen J. Heisig, John J. Rice, John Knickerbocker, Gaddi Blumrosen