Patents by Inventor John Knickerbocker

John Knickerbocker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8388782
    Abstract: A method for attaching a handler to a wafer, the wafer comprising an integrated circuit (IC), includes forming a layer of an adhesive on the wafer, the adhesive comprising a polyimide-based polymer configured to withstand processing at a temperature of over about 280° C.; and adhering a handler to the wafer using the layer of adhesive. A system for attaching a handler to a wafer, the wafer comprising IC, includes a layer of an adhesive located on the wafer, the adhesive comprising a polyimide-based polymer configured to withstand processing at a temperature of over about 280° C.; and a handler adhered to the wafer using the layer of adhesive.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: March 5, 2013
    Assignee: International Business Machines Corporation
    Inventors: Paul S. Andry, Bing Dang, John Knickerbocker, Aparna Prahbakar, Peter J. Sorce, Robert E. Trzcinski, Cornelia K. Tsang
  • Publication number: 20110290413
    Abstract: A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC), includes attaching the handler to the wafer using an adhesive comprising a thermoset polymer, the handler comprising a material that is transparent in a wavelength range of about 193 nanometers (nm) to about 400 nm; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer.
    Type: Application
    Filed: May 27, 2010
    Publication date: December 1, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Bing Dang, Matthew Farinelli, John Knickerbocker, Aparna Prabhakar, Robert E. Trzcinski, Cornelia K. Tsang
  • Publication number: 20110290406
    Abstract: A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC) includes attaching the handler to the wafer using an adhesive comprising a polymer; performing edge processing to remove an excess portion of the adhesive from an edge of the handler and wafer; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer. A system for releasing a handler from a wafer, the wafer comprising an IC includes a handler attached to a wafer using an adhesive comprising a polymer; an edge processing module, the edge processing module configured to remove an excess portion of the adhesive from the edge of the handler and wafer; and a laser, the laser configured to ablate the adhesive through the handler.
    Type: Application
    Filed: May 27, 2010
    Publication date: December 1, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Bing Dang, John Knickerbocker, Aparna Prabhakar, Peter Sorce, Robert E. Trzcinski, Cornelia K. Tsang
  • Publication number: 20110290402
    Abstract: A method for attaching a handler to a wafer, the wafer comprising an integrated circuit (IC), includes forming a layer of an adhesive on the wafer, the adhesive comprising a polyimide-based polymer configured to withstand processing at a temperature of over about 280° C.; and adhering a handler to the wafer using the layer of adhesive. A system for attaching a handler to a wafer, the wafer comprising IC, includes a layer of an adhesive located on the wafer, the adhesive comprising a polyimide-based polymer configured to withstand processing at a temperature of over about 280° C.; and a handler adhered to the wafer using the layer of adhesive.
    Type: Application
    Filed: May 27, 2010
    Publication date: December 1, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Paul Andry, Bing Dang, John Knickerbocker, Aparna Prabhakar, Peter Sorce, Robert E. Trzcinski, Cornelia K. Tsang
  • Publication number: 20090181476
    Abstract: A method of stacking a chip, including an integrated circuit, onto a substrate including applying an anisotropic conductive film (ACF) or a solder-filled conductive film onto a surface thereof, the surface being configured to electrically couple to the film, placing the chip onto the film, the chip being configured to electrically couple to the film, compressively pressurizing the chip, the film and the surface such that the chip is electrically coupled to the surface via the film,, testing the chip to determine whether the chip is operating normally, reworking the placement of the chip onto the film and repeating the compressive pressurization if the chip is determined to not be operating normally, repeating the testing to determine whether the chip is operating normally, and once the chip is determined to be operating normally, bonding the chip, the film and the surface.
    Type: Application
    Filed: January 10, 2008
    Publication date: July 16, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Stephen L. Buchwalter, Bing Dang, Claudius Feger, Peter A. Gruber, John Knickerbocker
  • Publication number: 20080206960
    Abstract: A method for removing a thinned silicon structure from a substrate, the method includes selecting the silicon structure with soldered connections for removal; applying a silicon structure removal device to the silicon structure and the substrate, wherein the silicon structure removal device comprises a pre-determined temperature setpoint for actuation within a range from about eighty percent of a melting point of the soldered connections to about the melting point; heating the silicon structure removal device and the soldered connections of the silicon structure to within the range to actuate the silicon structure removal device; and removing the thinned silicon structure. Also disclosed is a structure including a plurality of layers, at least one layer including a thinned silicon structure and solder coupling the layer to another layer of the plurality; wherein the solder for each layer has a predetermined melting point.
    Type: Application
    Filed: February 27, 2007
    Publication date: August 28, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Bing Dang, Mario J. Interrante, John Knickerbocker, Edmund J. Sprogis
  • Publication number: 20080067628
    Abstract: Techniques for electronic device fabrication are provided. In one aspect, an electronic device is provided. The electronic device comprises at least one interposer structure having one or mote vias and a plurality of decoupling capacitors integrated therein, the at least one interposer structure being configured to allow for one or more of the plurality of decoupling capacitors to be selectively deactivated. In another aspect, a method of fabricating an electronic device comprising at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein comprises the following step.
    Type: Application
    Filed: October 31, 2007
    Publication date: March 20, 2008
    Applicant: International Business Machines Corporation
    Inventors: Raymond Horton, John Knickerbocker, Edmund Sprogis, Cornelia Tsang
  • Publication number: 20080009101
    Abstract: Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a carrier (the lead-free connectors electrically connect the device to the carrier), and fills the gaps between the carrier and the device with an insulating underfill.
    Type: Application
    Filed: September 20, 2007
    Publication date: January 10, 2008
    Inventors: William Bernier, Tien-Jen Cheng, Marie Cole, David Eichstadt, Mukta Farooq, John Fitzsimmons, Lewis Goldmann, John Knickerbocker, Tasha Lopez, David Welsh
  • Publication number: 20080000080
    Abstract: A method of forming compliant electrical contacts includes patterning a conductive layer into an array of compliant members. The array of compliant members is then positioned to be in contact with electrical connection pads on an integrated circuit wafer and the compliant members are joined to the pads. Then, the supporting layer that supported the compliant members is removed to leave the compliant members connected to the pads.
    Type: Application
    Filed: September 17, 2007
    Publication date: January 3, 2008
    Inventors: William Bernier, David Eichstadt, Mukta Farooq, John Knickerbocker
  • Publication number: 20070272389
    Abstract: A method and apparatus for the formation of coplanar electrical interconnectors. Solder material is deposited onto a wafer, substrate, or other component of an electrical package using a complaint mold such that the terminal ends of the solder material being deposited, i.e., the ends opposite to those forming an attachment to the wafer, substrate, or other component of an electrical package are coplanar with one another. A complaint mold is used having one or more conduits for receiving solder material and having a compliant side and a planar side. The compliant side of the mold is positioned adjacent to the wafer, substrate, or other component of an electrical package allowing solder material to be deposited onto the surface thereof such that the planar side of the compliant mold provides coplanar interconnectors. An Injection Molded Solder (IMS) head can be used as the means for filling the conduits of the compliant mold of the present invention.
    Type: Application
    Filed: March 31, 2006
    Publication date: November 29, 2007
    Applicant: IBM Corporation
    Inventors: Peter Gruber, John Knickerbocker
  • Publication number: 20070252288
    Abstract: Under the present invention, a semiconductor chip is electrically connected to a substrate (e.g., organic, ceramic, etc.) by an interposer structure. The interposer structure comprises an elastomeric, compliant material that includes metallurgic through connections having a predetermined shape. In a typical embodiment, the metallurgical through connections electrically connect an under bump metallization of the semiconductor chip to a top surface metallization of the substrate. By utilizing the interposer structure in accordance with the present invention, the problems associated with previous semiconductor module designs are alleviated.
    Type: Application
    Filed: July 3, 2007
    Publication date: November 1, 2007
    Inventors: MUKTA FAROOQ, John Knickerbocker, Frank Pompeo, Subhash Shinde
  • Publication number: 20070246518
    Abstract: A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.
    Type: Application
    Filed: April 21, 2006
    Publication date: October 25, 2007
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Steven Cordes, Peter Gruber, John Knickerbocker, James Speidell
  • Publication number: 20070246511
    Abstract: A system, method, and apparatus of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate is disclosed. The method comprises placing a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Conductive bonding material is forced out of the fill head toward the circuit supporting substrate. The conductive bonding material is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head.
    Type: Application
    Filed: April 21, 2006
    Publication date: October 25, 2007
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Steven Cordes, Peter Gruber, John Knickerbocker, James Speidell
  • Publication number: 20070246516
    Abstract: A system, method, and device for applying conductive bonding material to a substrate are disclosed. The method includes providing conductive bonding material in a plurality of cavities of a mold. A total number of cavities in the plurality of cavities being greater than a total number of at least one conductive pad of a circuit supporting substrate corresponding to the mold. The conductive bonding material in the mold is heated to a reflow temperature of the conductive bonding material. At least one wettable surface is placed in substantial contact with the heated conductive bonding material in at least one cavity. The mold and the corresponding circuit supporting substrate are brought in close proximity to each other such that the heated conductive bonding material in at least one cavity comes in contact with at least one conductive pad of the corresponding circuit supporting substrate.
    Type: Application
    Filed: April 21, 2006
    Publication date: October 25, 2007
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Steven Cordes, Peter Gruber, John Knickerbocker, James Speidell
  • Publication number: 20070246853
    Abstract: A system and method are provided for injection molding conductive bonding material into a plurality of cavities in a mold within a vacuum chamber. A mold and a fill head are located within a vacuum chamber, wherein the mold includes a plurality of cavities. A vacuum is created within the vacuum chamber, thereby removing air from the chamber and from the cavities. Optionally, rotational motion is provided to at least one of the mold and the fill head while the fill head is in substantial contact with the mold. Conductive bonding material is forced out of the fill head toward the mold, and into at least one of the cavities, while a vacuum is maintained in the vacuum chamber.
    Type: Application
    Filed: June 6, 2007
    Publication date: October 25, 2007
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: S. CHEY, Steven Cordes, Peter Gruber, John Knickerbocker, James Speidell
  • Publication number: 20070246515
    Abstract: A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.
    Type: Application
    Filed: April 21, 2006
    Publication date: October 25, 2007
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Steven Cordes, Peter Gruber, John Knickerbocker, James Speidell
  • Publication number: 20070222065
    Abstract: An electronic dive and method of fabricating an electronic device. The method including placing a placement guide over a top surface of a module substrate, the placement guide having a guide opening, the guide opening extending from a top surface of the placement guide to a bottom surface of the placement guide; aligning the placement guide to an integrated circuit chip position on the module substrate; fixing the placement guide to the module substrate; placing an integrated circuit chip in the guide opening, sidewalls of the placement guide opening constraining electrically conductive bonding structures on bottom surface of the integrated circuit chip to self-align to an electrically conductive module substrate contact pad on the top surface of the module substrate in the integrated circuit chip position; and bonding the bonding structures to the module substrate contact pads, the bonding structures and the module substrate contact pads in direct physical and electrical contact after the bonding.
    Type: Application
    Filed: March 21, 2006
    Publication date: September 27, 2007
    Applicant: International Business Machines Corporation
    Inventors: Paul Andry, Leena Buchwalter, Raymond Horton, John Knickerbocker, Cornelia Tsang, Steven Wright
  • Publication number: 20070138657
    Abstract: A physically secure processing assembly is provided that includes dies mounted on a substrate so as to sandwich the electrical contacts of the dies between the dies and the substrate. The substrate is provided with substrate contacts and conductive pathways that are electrically coupled to the die contacts and extend through the substrate. Electrical conductors surround the conductive pathways. A monitoring circuit detects a break in continuity of one or more of the electrical conductors, and preferably renders the assembly inoperable. Preferably, an epoxy encapsulation is provided to prevent probing tools from being able to reach the die or substrate contacts.
    Type: Application
    Filed: December 21, 2005
    Publication date: June 21, 2007
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Vincenzo Condorelli, Claudius Feger, Kevin Gotze, Nihad Hadzic, John Knickerbocker, Edmund Sprogis
  • Publication number: 20070099342
    Abstract: Ball Grid Array packages having decreased adhesion of the BGA pad to the laminate surface and methods for producing same are provided.
    Type: Application
    Filed: December 5, 2006
    Publication date: May 3, 2007
    Inventors: John Knickerbocker, Voya Markovich, Thomas Miller, William Rudik
  • Publication number: 20070084629
    Abstract: Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.
    Type: Application
    Filed: October 5, 2006
    Publication date: April 19, 2007
    Inventors: William Bernier, Marie Cole, Mukta Farooq, John Knickerbocker, Tasha Lopez, Roger Quon, David Welsh