Patents by Inventor John P. Franz

John P. Franz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11153992
    Abstract: An apparatus is provided herein. The apparatus includes a sensor module and a control module. The sensor module to receive a measured environmental condition. The control module to use the measured environmental condition to determine a fluid temperature to cool a first set of components and determine an air temperature to cool a second set of components.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: October 19, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Tahir Cader, Wade D Vinson, Douglas Kent Garday, John P Franz
  • Publication number: 20200367388
    Abstract: Example implementations relate to a chassis cooling resource. In some examples, a chassis cooling resource includes a controller, comprising instructions to detect a failure corresponding to a first cooling system of a first chassis coupled to a server rack, and alter settings of a second cooling system of a second chassis coupled the server rack to provide additional cooling resources to the first cooling system in response to the detected failure.
    Type: Application
    Filed: July 31, 2020
    Publication date: November 19, 2020
    Inventors: John P. Franz, Tahir Cader, Matthew Richard Slaby
  • Patent number: 10837719
    Abstract: An apparatus is provided herein. The apparatus includes a support member, a supply channel, a return channel, a supply port to provide a fluid to the supply channel, a return port to receive the fluid from the return channel, at least two port fittings, a first sleeve, and a second sleeve. The first sleeve is connectable to one of the at least two port fittings and forms a fluid tight seal between the first sleeve and the supply channel. The second sleeve is connectable to the other of the at least two port fittings and forms a fluid tight seal between the second sleeve and the return channel.
    Type: Grant
    Filed: May 15, 2014
    Date of Patent: November 17, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John P Franz, Tahir Cader, William K Norton
  • Patent number: 10765040
    Abstract: Example implementations relate to a chassis cooling resource. In some examples, a chassis cooling resource includes a controller, comprising instructions to detect a failure corresponding to a first cooling system of a first chassis coupled to a server rack, and alter settings of a second cooling system of a second chassis coupled the server rack to provide additional cooling resources to the first cooling system in response to the detected failure.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: September 1, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John P. Franz, Tahir Cader, Matthew Richard Slaby
  • Patent number: 10734760
    Abstract: Example implementations relate to a magnetic fluid connector. For example, a magnetic fluid connector can include a magnet, an internal fluid path defined by a first portion and a second portion when the first portion and the second portion are coupled together, and a movable member that is movable to seal the internal fluid path, where the magnet provides at least a portion of a force sufficient to seal the internal fluid path.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: August 4, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John P. Franz, Tahir Cader
  • Patent number: 10672683
    Abstract: Example implementations relate to a heat transfer adapter plate. For example, a heat transfer adapter plate can comprise a first retention mechanism to couple a heat transfer device to the heat transfer adapter plate and a second retention mechanism to couple the heat transfer adapter plate to an electronic component. The heat transfer adapter plate can accept a plurality of heat transfer device types, including but not limited to, a passive heat exchanger, an active heat exchanger, and a heat pipe.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: June 2, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John P. Franz, Charles R. Hanna, Brian T. Purcell
  • Publication number: 20200146182
    Abstract: An apparatus is provided herein. The apparatus includes a sensor module and a control module. The sensor module to receive a measured environmental condition. The control module to use the measured environmental condition to determine a fluid temperature to cool a first set of components and determine an air temperature to cool a second set of components.
    Type: Application
    Filed: December 17, 2019
    Publication date: May 7, 2020
    Inventors: Tahir Cader, Wade D. Vinson, Douglas Kent Garday, John P. Franz
  • Patent number: 10571206
    Abstract: An assembly useable with a cooling system is provided herein. The assembly includes a support member, a channel, and a fluid control mechanism. The support member includes a receiving member formed therein to receive a thermal member. The channel is formed within the support member to carry a fluid therethrough. The fluid control mechanism is along the channel to control the flow of the fluid.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: February 25, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: David Allen Moore, John P. Franz, Tahir Cader, Michael Lawrence Sabotta
  • Patent number: 10548242
    Abstract: A system to cool a module data center including a fluid cooling device to cool a first set of components of the module data center using a fluid cooling loop and an air cooling device to provide an air to cool a second set of components of the module data center. Also, a control apparatus to determine an air cooling temperature for the air cooling loop based on an environmental condition, determine a fluid cooling temperature for the fluid cooling loop based on the environmental condition, transmit an air signal to the air cooling device to set the air cooling temperature, and transmit a fluid signal to the fluid cooling device to set the fluid cooling temperature.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: January 28, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Tahir Cader, Wade D Vinson, Douglas Kent Garday, John P Franz
  • Patent number: 10512195
    Abstract: Example implementations relate to a server device with a capacitive circuit. For example, a server device with a capacitive circuit can include a capacitive circuit located on a printed circuit assembly (PCA) of the server device and a baseboard management controller unit (BMC) to provide a communication interface between the capacitive circuit and a computing device. A voltage can be applied across the capacitive circuit and a signal can be sent from the capacitive circuit to the computing device using the BMC in response to a change in voltage.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: December 17, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John P Franz, Tahir Cader
  • Publication number: 20190363485
    Abstract: Example implementations relate to a magnetic fluid connector. For example, a magnetic fluid connector can include a magnet, an internal fluid path defined by a first portion and a second portion when the first portion and the second portion are coupled together, and a movable member that is movable to seal the internal fluid path, where the magnet provides at least a portion of a force sufficient to seal the internal fluid path.
    Type: Application
    Filed: August 6, 2019
    Publication date: November 28, 2019
    Inventors: John P. Franz, Tahir Cader
  • Patent number: 10458724
    Abstract: An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: October 29, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: John P. Franz, Tahir Cader, Michael L. Sabotta, David A. Moore
  • Patent number: 10455726
    Abstract: A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: October 22, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: Tahir Cader, John P Franz, David Allen Moore, Douglas Kent Garday, Wade D Vinson
  • Patent number: 10431926
    Abstract: Example implementations relate to a magnetic fluid connector. For example, a magnetic fluid connector can include a magnet, an internal fluid path defined by a first portion and a second portion when the first portion and the second portion are coupled together, and a movable member that is movable to seal the internal fluid path, where the magnet provides at least a portion of a force sufficient to seal the internal fluid path.
    Type: Grant
    Filed: April 14, 2015
    Date of Patent: October 1, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: John P. Franz, Tahir Cader
  • Patent number: 10356957
    Abstract: Example implementations relate to an adaptive cooling assembly. For example, an adaptive cooling assembly includes a removable shelf installed in the adaptive cooling assembly, an adaptive cooling bay located in a slot formed by the removable shelf, and a removable thermal bus bar installed in the adaptive cooling bay and connected to a pair of connectors. The adaptive cooling bay includes the pair of connectors and the removable thermal bus bar provides liquid cooling to an electronic device.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: July 16, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: John P Franz, Tahir Cader
  • Patent number: 10356959
    Abstract: Example implementations relate to a chassis cooling resource. In some examples, a chassis cooling resource includes a controller, comprising instructions to detect a failure corresponding to a first cooling system of a first chassis coupled to a server rack, and alter settings of a second cooling system of a second chassis coupled the server rack to provide additional cooling resources to the first cooling system in response to the detected failure.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: July 16, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: John P. Franz, Tahir Cader, Matthew Richard Slaby
  • Patent number: 10330395
    Abstract: An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: June 25, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: John P. Franz, Tahir Cader, Michael L. Sabotta, David A. Moore
  • Patent number: D876432
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: February 25, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John P. Franz, Charles W. Cochran, Yinggang Du
  • Patent number: D939510
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: December 28, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Yinggang Du, Keith J. Kuehn, John P. Franz, Alan B. Doerr
  • Patent number: D951259
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: May 10, 2022
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Yinggang Du, Keith J. Kuehn, John P. Franz, Alan B. Doerr