Patents by Inventor John P. Franz

John P. Franz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LIQUID COOLING
    Publication number: 20180017341
    Abstract: An assembly for liquid cooling is provided herein. The assembly 8includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.
    Type: Application
    Filed: September 27, 2017
    Publication date: January 18, 2018
    Inventors: John P. Franz, Tahir Cader, Michael L. Sabotta, David A. Moore
  • INTEGRATED LIQUID COOLING OF A SERVER SYSTEM
    Publication number: 20180018000
    Abstract: Example implementations relate to an integrated liquid cooling of a server system. For example, a method for integrated liquid cooling of a server system can include creating a liquid cooling component that includes creating a three dimensional (3D) design based on a server system, where the 3D design includes customized angle geometry. Further, the method for integrated liquid cooling of a server system can include forming the liquid cooling component based on the 3D design, where the liquid cooling component includes a plurality of liquid flow passages for delivering cooling resources to the server system, and delivering the cooling resources to the server system via the liquid cooling component.
    Type: Application
    Filed: January 30, 2015
    Publication date: January 18, 2018
    Inventors: Tahir Cader, John P. Franz, David A. Moore
  • ADAPTIVE COOLING ASSEMBLY
    Publication number: 20170359923
    Abstract: Example implementations relate to an adaptive cooling assembly. For example, an adaptive cooling assembly includes a removable shelf installed in the adaptive cooling assembly, an adaptive cooling bay located in a slot formed by the removable shelf, and a removable thermal bus bar installed in the adaptive cooling bay and connected to a pair of connectors. The adaptive cooling bay includes the pair of connectors and the removable thermal bus bar provides liquid cooling to an electronic device.
    Type: Application
    Filed: October 31, 2014
    Publication date: December 14, 2017
    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: John P FRANZ, Tahir CADER
  • SERVER DEVICE WITH CAPACITIVE CIRCUIT
    Publication number: 20170318706
    Abstract: Example implementations relate to a server device with a capacitive circuit. For example, a server device with a capacitive circuit can include a capacitive circuit located on a printed circuit assembly (PCA) of the server device and a baseboard management controller unit (BMC) to provide a communication interface between the capacitive circuit and a computing device. A voltage can be applied across the capacitive circuit and a signal can be sent from the capacitive circuit to the computing device using the BMC in response to a change in voltage.
    Type: Application
    Filed: October 31, 2014
    Publication date: November 2, 2017
    Inventors: John P FRANZ, Tahir CADER
  • Liquid cooling
    Patent number: 9803937
    Abstract: An assembly for liquid cooling is provided herein. The assembly includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: October 31, 2017
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John P Franz, Tahir Cader, Michael L Sabotta, David A Moore
  • MODULAR UTILITIES
    Publication number: 20170303439
    Abstract: A modular utility assembly is provided herein. The modular utility assembly includes a power module, a network module, and a cooling module. The power module includes a power connector to mate with and provide power to an electronic module. The network module includes a network connector to mate with and provide a network connection between the network module and the electronic module. The cooling module includes a cooling connector to mate with and connect to a cooling component on the electronic module.
    Type: Application
    Filed: September 30, 2014
    Publication date: October 19, 2017
    Inventors: Tahir CADER, John P FRANZ, Wade D VINSON, Arlen L ROESNER, Kevin B LEIGH, Dave MAYER
  • MODULAR COOLING
    Publication number: 20170295667
    Abstract: A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.
    Type: Application
    Filed: September 30, 2014
    Publication date: October 12, 2017
    Inventors: Tahir CADER, John P FRANZ, David Allen MOORE, Douglas Kent GARDAY, Wade D Vinson
  • Modular rack system
    Patent number: 9788452
    Abstract: In one implementation of a modular rack system, a rack module (22, 24, 222, 522, 722, 724) comprises a bay (30, 730) comprising a first side wall (32, 732), a second side wall (32, 732) and floor (36, 736) and an intermediate wall positioning mechanism (280, 380, 390, 392, 790, 792) to support a wall (282, 782) at different spacings with respect to the first side wall (32, 732). In another implementation of the modular rack system, a utility bay (148) extends across rack modules (22, 24, 222, 522, 722, 724).
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: October 10, 2017
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: David A Moore, John P Franz, Tahir Cader, Michael L Sabotta
  • AIR AND FLUID COOLING OF A DATA CENTER
    Publication number: 20170231118
    Abstract: An apparatus is provided herein. The apparatus includes a sensor module and a control module. The sensor module to receive a measured environmental condition. The control module to use the measured environmental condition to determine a fluid temperature to cool a first set of components and determine an air temperature to cool a second set of components.
    Type: Application
    Filed: July 31, 2014
    Publication date: August 10, 2017
    Inventors: Tahir CADER, Wade D VINSON, Douglas Kent GARDAY, John P FRANZ
  • Lever unit
    Patent number: 9730356
    Abstract: An assembly to connect two electronic components is provided herein. The assembly includes a lever unit with a lever and a base. The lever includes a primary cam member and a secondary cam member connected thereto. The lever also includes a hook member extending therefrom. The base includes a guide structure to engage with a drive pin. Rotation of the lever to move a first electronic component along a y-axis towards, a backplane. The secondary cam member to move the drive pin along the guide structure, and the hook member to engage with a second electronic component and mate the first electronic component and the second electronic component along the second axis.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: August 8, 2017
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John P Franz, Michael L Sabotta, David A Moore, Tahir Cader, Alan B Doerr
  • Server rack lift
    Patent number: 9701330
    Abstract: An example of a server rack lifting apparatus can include a first side portion, a second side portion opposing the first side portion, a back portion connecting the first side portion to the second side portion, a first lifting surface associated with the first side portion to engage a portion of a server rack, a second lifting surface associated with the second side portion to engage an opposing portion of the server rack, and a motive component to adjust a height of the first and second lifting surfaces.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: July 11, 2017
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Suzie Mkandawire, Alan B. Doerr, John P. Franz, Michael L. Sabotta, Jeffery M. Giardina
  • DUAL IN-LINE MEMORY MODULE CONNECTOR
    Publication number: 20170196113
    Abstract: A dual in-line memory module (DIMM) connector can include a double data rate fourth generation (DDR4) DIMM connector to connect to a DIMM via a lowest notch of the DIMM relative to an electronic component on which the DIMM is located.
    Type: Application
    Filed: July 8, 2014
    Publication date: July 6, 2017
    Inventors: John NORTON, Melvin K BENEDICT, John P FRANZ
  • Support member
    Patent number: 9693479
    Abstract: An apparatus to cool an electronic module is provided herein. The apparatus includes a support member and a retaining member. The support member to receive the cooling module. The support member includes a cooling module alignment member to align the cooling module therein. The retaining member to secure the cooling module.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: June 27, 2017
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Tahir Cader, John P Franz, Jon Kolas, David A Moore
  • Liquid temperature control cooling
    Patent number: 9529395
    Abstract: Examples of the present disclosure may include methods and systems for liquid temperature control cooling.
    Type: Grant
    Filed: March 12, 2012
    Date of Patent: December 27, 2016
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John P. Franz, Michael L. Sabotta, Tahir Cader, David A. Moore
  • FLUID MANIFOLD
    Publication number: 20160356558
    Abstract: An apparatus is provided herein. The apparatus includes a support member, a supply channel, a return channel, a supply port to provide a fluid to the supply channel, a return port to receive the fluid from the return channel, at least two port fittings, a first sleeve, and a second sleeve. The first sleeve is connectable to one of the at least two port fittings and forms a fluid tight seal between the first sleeve and the supply channel. The second sleeve is connectable to the other of the at least two port fittings and forms a fluid tight seal between the second sleeve and the return channel.
    Type: Application
    Filed: May 15, 2014
    Publication date: December 8, 2016
    Inventors: John P FRANZ, Tahir CADER, William K NORTON
  • MANIFOLDS HAVING SLIDABLE DRIPLESS CONNECTORS
    Publication number: 20160270260
    Abstract: An example device in accordance with an aspect of the present disclosure includes a dripless connector that has a base and an extension. A manifold is to slidably mount the dripless connector. The base of the dripless connector is slidable, relative to the manifold, along a floating direction substantially non-parallel to an engagement direction of the extension of the dripless connector.
    Type: Application
    Filed: January 6, 2014
    Publication date: September 15, 2016
    Inventor: John P Franz
  • LEVER UNIT
    Publication number: 20160157376
    Abstract: An assembly to connect two electronic components is provided herein. The assembly includes a lever unit with a lever and a base. The lever includes a primary cam member and a secondary cam member connected thereto. The lever also includes a hook member extending therefrom. The base includes a guide structure to engage with a drive pin. Rotation of the lever to move a first electronic component along a y-axis towards, a backplane. The secondary cam member to move the drive pin along the guide structure, and the hook member to engage with a second electronic component and mate the first electronic component and the second electronic component along the second axis.
    Type: Application
    Filed: June 28, 2013
    Publication date: June 2, 2016
    Inventors: John P. Franz, Michael L. Sabotta, David A. Moore, Tahir Cader, Alan B. Doerr
  • SERVER RACK LIFT
    Publication number: 20160121915
    Abstract: An example of a server rack lifting apparatus can include a first side portion, a second side portion opposing the first side portion, a back portion connecting the first side portion to the second side portion, a first lifting surface associated with the first side portion to engage a portion of a server rack, a second lifting surface associated with the second side portion to engage an opposing portion of the server rack, and a motive component to adjust a height of the first and second lifting surfaces.
    Type: Application
    Filed: October 31, 2014
    Publication date: May 5, 2016
    Inventors: Suzie Mkandawire, Alan B. Doerr, John P. Franz, Michael L. Sabotta, Jeffery M. Giardina
  • Drive carrier light source control
    Patent number: 9263093
    Abstract: A drive carrier includes a first computing device with light source control capacity and a light source proximate to a front plate of the drive carrier. The first computing device receives a signal from a second computing device (external to the drive carrier) and controls the light source proximate to the front plate of the drive carrier based on the signal.
    Type: Grant
    Filed: October 25, 2011
    Date of Patent: February 16, 2016
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: M. Scott Bunker, Michael White, Timothy A Mccree, Keith J Kuehn, Andrew James Phelan, John P Franz
  • SUPPORT MEMBER
    Publication number: 20160029510
    Abstract: An apparatus to cool an electronic module is provided herein. The apparatus includes a support member and a retaining member. The support member to receive the cooling module. The support member includes a cooling module alignment member to align the cooling module therein. The retaining member to secure the cooling module.
    Type: Application
    Filed: March 14, 2013
    Publication date: January 28, 2016
    Inventors: Tahir Cader, John P. Franz, Jon Kolas, David A. Moore