Abstract: An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

Abstract: A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.

Abstract: Example implementations relate to a magnetic fluid connector. For example, a magnetic fluid connector can include a magnet, an internal fluid path defined by a first portion and a second portion when the first portion and the second portion are coupled together, and a movable member that is movable to seal the internal fluid path, where the magnet provides at least a portion of a force sufficient to seal the internal fluid path.

Abstract: Example implementations relate to a chassis cooling resource. In some examples, a chassis cooling resource includes a controller, comprising instructions to detect a failure corresponding to a first cooling system of a first chassis coupled to a server rack, and alter settings of a second cooling system of a second chassis coupled the server rack to provide additional cooling resources to the first cooling system in response to the detected failure.

Abstract: Example implementations relate to an adaptive cooling assembly. For example, an adaptive cooling assembly includes a removable shelf installed in the adaptive cooling assembly, an adaptive cooling bay located in a slot formed by the removable shelf, and a removable thermal bus bar installed in the adaptive cooling bay and connected to a pair of connectors. The adaptive cooling bay includes the pair of connectors and the removable thermal bus bar provides liquid cooling to an electronic device.

Abstract: An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

Abstract: Example implementations relate to a heat transfer adapter plate. For example, a heat transfer adapter plate can comprise a first retention mechanism to couple a heat transfer device to the heat transfer adapter plate and a second retention mechanism to couple the heat transfer adapter plate to an electronic component. The heat transfer adapter plate can accept a plurality of heat transfer device types, including but not limited to, a passive heat exchanger, an active heat exchanger, and a heat pipe.

Abstract: Example implementations relate to a chassis cooling resource. In some examples, a chassis cooling resource includes a controller, comprising instructions to detect a failure corresponding to a first cooling system of a first chassis coupled to a server rack, and alter settings of a second cooling system of a second chassis coupled the server rack to provide additional cooling resources to the first cooling system in response to the detected failure.

Abstract: Example implementations relate to a chassis cooling resource. In some examples, a chassis cooling resource includes a controller, comprising instructions to detect a failure corresponding to a first cooling system of a first chassis coupled to a server rack, and alter settings of a second cooling system of a second chassis coupled the server rack to provide additional cooling resources to the first cooling system in response to the detected failure.

Abstract: A dual in-line memory module (DIMM) connector can include a double data rate fourth generation (DDR4) DIMM connector to connect to a DIMM via a lowest notch of the DIMM relative to an electronic component on which the DIMM is located.

Abstract: In one example, a system for fault representation of computing infrastructures includes an infrastructure engine to determine a fault relationship between a first element and a second element within a computing infrastructure, wherein the fault relationship represents an ability of the first element and the second element to function, a representation engine to generate a fault representation of the computing infrastructure based on the determined fault relationship between the first element and the second element within the computing infrastructure, and a workload engine to assign workloads to the computing infrastructure based on the fault representation of the computing infrastructure.

Abstract: Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar.

Abstract: An assembly useable with a cooling system is provided herein. The assembly includes a support member, a channel, and a fluid control mechanism. The support member includes a receiving member formed therein to receive a thermal member. The channel is formed within the support member to carry a fluid therethrough. The fluid control mechanism is along the channel to control the flow of the fluid.

Abstract: Example implementations relate to a magnetic fluid connector. For example, a magnetic fluid connector can include a magnet, an internal fluid path defined by a first portion and a second portion when the first portion and the second portion are coupled together, and a movable member that is movable to seal the internal fluid path, where the magnet provides at least a portion of a force sufficient to seal the internal fluid path.

Abstract: An assembly for liquid cooling is provided herein. The assembly 8includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

Abstract: An assembly useable with a cooling system is provided herein. The assembly includes a support member, a channel, and a fluid control mechanism. The support member includes a receiving member formed therein to receive a thermal member. The channel is formed within the support member to carry a fluid therethrough. The fluid control mechanism is along the channel to control the flow of the fluid.

Abstract: In one implementation, a system for supplemental air cooling includes a heat sink mounted to a computing device, a supplemental cooling device coupled to the heat sink by a number of heat pipes, and a fan coupled to the supplemental cooling device.

Abstract: An example fluid manifold is provided herein. The fluid manifold includes a first set of perimeter walls, a second set of perimeter walls, a first aperture, and a second aperture. The first set of perimeter walls to form a supply channel. The second set of perimeter walls to form a return channel. The second set of perimeter walls are adjacent to the first set of perimeter walls. The first aperture formed in the first set of perimeter walls is to transport fluid between a fluid component and the supply channel. The second aperture formed in the second set of perimeter walls is to transport fluid between the fluid component and the return channel. The first aperture and the second aperture are positioned adjacent to an electronic module.

Abstract: Example implementations relate to liquid cooling with a cooling chamber. For example, a system for liquid cooling with a cooling chamber can include a liquid cooling chamber in contact with a heat generating device within a computing device, the liquid cooling chamber to contain a liquid coolant and transfer heat from the heat generating device into a liquid circulation loop extending around a perimeter of the liquid cooling chamber. The system for liquid cooling with a cooling chamber can further include a comb structure adjacent to the liquid cooling chamber to transfer heat into the liquid circulation loop, and a liquid exit pipe coupled to the liquid circulation loop to direct a flow of the liquid coolant.

Abstract: In one implementation, a system for a memory cooling pad includes a first thermal interface material coupled to a second thermal interface material by a liner material configured to position the first thermal interface material on a first side of a memory unit and to position the second thermal interface material on a second side of the memory unit.