Patents by Inventor Jong-su Kim

Jong-su Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11963273
    Abstract: The present embodiment relates to a communication protocol between an MCU and an LED driving circuit for LED driving. The MCU may define and use an SPI protocol including ID setting, a command, configuration data, etc.
    Type: Grant
    Filed: October 26, 2022
    Date of Patent: April 16, 2024
    Assignee: LX SEMICON CO., LTD.
    Inventors: Sang Suk Kim, Jang Su Kim, Jong Min Lee
  • Patent number: 11955629
    Abstract: The present invention relates to a positive electrode active material having improved capacity characteristic and life cycle characteristic, and a method of preparing the same, and specifically, to a positive electrode active material for a lithium secondary battery, wherein the positive electrode active material comprises a compound represented by Formula 1 above and allowing reversible intercalation/deintercalation of lithium, and from a crystal structure analysis of the positive electrode active material by a Rietveld method in which space group R-3m is used in a crystal structure model on the basis of an X-ray diffraction analysis, the thickness of MO slab is 2.1275 ? or less, the thickness of inter slab is 2.59 ? or greater, and the cation mixing ratio between Li and Ni is 0.5% or less, and a method of preparing the same.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: April 9, 2024
    Assignee: LG Chem, Ltd.
    Inventors: Jong Pil Kim, Seung Beom Cho, Won Tae Kim, San Su Son, Hyuck Lee
  • Patent number: 11939698
    Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: March 26, 2024
    Assignee: SENIC INC.
    Inventors: Jong Hwi Park, Jung-Gyu Kim, Eun Su Yang, Byung Kyu Jang, Jung Woo Choi, Yeon Sik Lee, Sang Ki Ko, Kap-Ryeol Ku
  • Publication number: 20240097218
    Abstract: Methods and systems for executing tracking and monitoring manufacturing data of a battery are disclosed. One method includes: receiving, by a server system, sensing data of the battery from a sensing system; generating, by the server system, mapping data based on the sensing data; generating, by the server system, identification data of the battery based on the sensing data; generating, by the server system, monitoring data of the battery based on the sensing data, the identification data, and the mapping data; and generating, by the server system, display data for displaying a simulated electrode of the battery on a graphical user interface based on the monitoring data of the battery.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 21, 2024
    Inventors: Min Kyu Sim, Jong Seok Park, Min Su Kim, Jae Hwan Lee, Ki Deok Han, Eun Ji Jo, Su Wan Park, Gi Yeong Jeon, June Hee Kim, Wi Dae Park, Dong Min Seo, Seol Hee Kim, Dong Yeop Lee, Jun Hyo Su, Byoung Eun Han, Seung Huh
  • Publication number: 20240076799
    Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.
    Type: Application
    Filed: November 1, 2023
    Publication date: March 7, 2024
    Applicant: SENIC INC.
    Inventors: Jong Hwi PARK, Jung-Gyu KIM, Eun Su YANG, Byung Kyu JANG, Jung Woo CHOI, Yeon Sik LEE, Sang Ki KO, Kap-Ryeol KU
  • Publication number: 20240079272
    Abstract: A method of manufacturing a semiconductor chip and a semiconductor device. The method of manufacturing the semiconductor chip includes a process of dicing a substrate. The substrate includes an active layer and an organic layer on the semiconductor base. Dicing grooves that are extended to face each other along first dicing lines from points, at which the first dicing lines and second dicing lines along which the substrate is to be diced intersect, are formed by recessing some parts of the active layer. Modified patterns are formed within the semiconductor base. The substrate is diced into semiconductor chips by propagating cracks into the substrate from the modified patterns.
    Type: Application
    Filed: December 23, 2022
    Publication date: March 7, 2024
    Inventors: Byung Cheol LEE, Jong Su KIM
  • Patent number: 11922880
    Abstract: A current supply circuit according to the present disclosure may include a voltage/current converter configured to convert, into a data current, a data voltage received from a data driving circuit and a first current mirror circuit configured to mirror the data current so that a light-emitting diode (LED) current flows into an LED array. The data current may be adjusted based on a greyscale value of the LED array.
    Type: Grant
    Filed: November 22, 2022
    Date of Patent: March 5, 2024
    Assignee: LX SEMICON CO., LTD.
    Inventors: Jong Min Lee, Kyeong Rok Lee, Sang Suk Kim, Jang Su Kim
  • Patent number: 11912102
    Abstract: An air conditioner for a vehicle including an air-conditioning case divided into a plurality of air passageways by a separation wall. A heating heat exchanger is disposed inside the air-conditioning case and exchanges heat with air to heat the interior of the vehicle. A perforated member is disposed at a downstream side of the heating heat exchanger and has a plurality of perforated holes through which the air passing the heating heat exchanger passes, and a partition wall is disposed between the heating heat exchanger and the perforated member to divide the air passageway of the air-conditioning case into a plurality of air passageways, wherein the partition wall is formed integrally with the perforated member.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: February 27, 2024
    Assignee: HANON SYSTEMS
    Inventors: Dong Won Lee, Jong Su Kim, Jae Woo Ko, Young Keun Kim, Chang Soo Bae, Jong Min Lee, Gyu Ik Han
  • Patent number: 11917855
    Abstract: A display device includes a substrate, a transistor on the substrate, a pixel electrode connected to the transistor, a bank layer disposed on the pixel electrode and defining a pixel opening overlapping the pixel electrode, an emission layer in the pixel opening, a common electrode on the emission layer and the bank layer, an encapsulation layer on the common electrode, a sensing electrode on the encapsulation layer, a first insulating layer disposed on the encapsulation layer and overlapping the pixel opening, a second insulating layer on the first insulating layer, and a third insulating layer surrounding the first insulating layer. A refractive index of the first insulating layer, a refractive index of the second insulating layer, and a refractive index of the third insulating layer are different from one another, and the refractive index of the first insulating layer is greater than the refractive index of the third insulating layer.
    Type: Grant
    Filed: February 3, 2022
    Date of Patent: February 27, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jin-Su Byun, Jong Beom Hong, Woong Sik Kim, Jung Min Choi
  • Patent number: 11860116
    Abstract: A semiconductor device includes a target layer disposed on a substrate, and a crack sensor for detecting a crack generated in the target layer. The crack sensor includes a first conductive pattern positioned at a bottom surface of the target layer, a second conductive pattern positioned on a top surface of the target layer, the top surface being opposite to the bottom surface of the target layer, a plurality of resistors, and nodes. The plurality of resistors are connected in parallel to each other through the first conductive pattern and the second conductive pattern. Each of the plurality of resistors is disposed to substantially penetrate the target layer.
    Type: Grant
    Filed: March 8, 2022
    Date of Patent: January 2, 2024
    Assignee: SK hynix Inc.
    Inventor: Jong Su Kim
  • Publication number: 20230417696
    Abstract: A semiconductor device includes a target layer disposed on a substrate, and a crack sensor for detecting a crack generated in the target layer. The crack sensor includes a first conductive pattern positioned at a bottom surface of the target layer, a second conductive pattern positioned on a top surface of the target layer, the top surface being opposite to the bottom surface of the target layer, a plurality of resistors, and nodes. The plurality of resistors are connected in parallel to each other through the first conductive pattern and the second conductive pattern. Each of the plurality of resistors is disposed to substantially penetrate the target layer.
    Type: Application
    Filed: September 8, 2023
    Publication date: December 28, 2023
    Applicant: SK hynix Inc.
    Inventor: Jong Su KIM
  • Publication number: 20230331059
    Abstract: An embodiment vehicle air conditioner includes an air conditioning device connected to a blower device to receive air supplied from the blower device, a heat exchange core provided in the air conditioning device and disposed in parallel with a flow direction of the air supplied from the blower device, a partition wall disposed to divide the heat exchange core into a first core part disposed to be close in distance to the blower device and a second core part disposed to be distant from the blower device, such that the air supplied from the blower device is distributed and supplied to the first core part and the second core part, and an air guide provided in a connection portion between the blower device and the air conditioning device and configured to guide the air to be supplied to the second core part of the heat exchange core.
    Type: Application
    Filed: November 1, 2022
    Publication date: October 19, 2023
    Inventors: Jae Sik Choi, Byeong Moo Jang, Yun A Choi, Young Tae Song, Sung Been Cheon, Jin Uk Kim, Jong Su Kim, In Keun Kang, Sang Chul Byun
  • Publication number: 20230331071
    Abstract: A vehicle air-conditioning apparatus includes a filter case configured to accommodate a filter, and a filter cover configured to couple to an open upper end of the filter case. The filter case defines an inner space configured to accommodate the filter therein and having the open upper end to receive and discharge the filter therethrough. The inner space is inclined with respect to a vertical direction to allow the filter to be received into and discharged from the filter case in an inclined state. The filter cover includes a fixing protrusion protruding from a lower surface of the filter cover facing the inner space of the filter case and being configured to press and fix the filter in the inner space.
    Type: Application
    Filed: November 1, 2022
    Publication date: October 19, 2023
    Inventors: Jae Sik CHOI, Byeong Moo JANG, Young Tae SONG, Sung Been CHEON, Jin Uk KIM, Jong Su KIM, In Keun KANG, Sang Chul BYUN
  • Patent number: 11691561
    Abstract: Provided are a lamp apparatus of a vehicle and a control method thereof. The lamp apparatus includes: a first integrated lamp installed at either the front or rear of a vehicle and having a plurality of lamps, one or more of which being turned on according to a lighting mode; a second integrated lamp installed at a position different from the installation position of the first integrated lamp and having a plurality of lamps, one or more of which being turned on; a travel direction input unit that receives a travel direction; a driving signal input unit that receives driving signals for turning on and off the lamps; and a lamp control unit that receives the travel direction to set the lighting modes of the first and second integrated lamps, and drives one or more of the plurality of lamps included in each of them.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: July 4, 2023
    Assignee: HYUNDAI MOBIS CO., LTD.
    Inventors: Jong Su Kim, Ya Won Kim, Seung Yeon Lee, Dong Hyuk Jung, Jong Hwa Kim, Eun Hee Kim
  • Patent number: 11628764
    Abstract: A lamp system for traffic lane indication using a navigation link may include a multi-function sensor sensing an environment and a line in front of a host vehicle, a line lamp generating and outputting a prediction line at a location corresponding to a line of a road, a navigation device providing location information of the host vehicle, and a vehicle controller predicting a forward line based on a line sensed by the multi-function sensor, and the location information of the host vehicle provided by the navigation device and controlling the line lamp to output the prediction line to follow the predicted forward line.
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: April 18, 2023
    Assignee: HYUNDAI MOBIS CO., LTD.
    Inventors: Soo Han Im, Eun Hee Kim, Jong Su Kim
  • Publication number: 20230110075
    Abstract: A semiconductor device includes a target layer disposed on a substrate, and a crack sensor for detecting a crack generated in the target layer. The crack sensor includes a first conductive pattern positioned at a bottom surface of the target layer, a second conductive pattern positioned on a top surface of the target layer, the top surface being opposite to the bottom surface of the target layer, a plurality of resistors, and nodes. The plurality of resistors are connected in parallel to each other through the first conductive pattern and the second conductive pattern. Each of the plurality of resistors is disposed to substantially penetrate the target layer.
    Type: Application
    Filed: March 8, 2022
    Publication date: April 13, 2023
    Applicant: SK hynix Inc.
    Inventor: Jong Su KIM
  • Patent number: 11613158
    Abstract: The present invention relates to an air conditioner for a vehicle, which includes an air-conditioning case (200), and at least one door (100) mounted to be opened and closed at a predetermined position, wherein the door (100) is formed integrally with an arm pivot (140), and the arm pivot (140) includes a pin part, and ribs formed integrally with both sides of the pin part to reinforce rigidity of the pin part and offset noise. The air conditioner further includes distortion preventing parts formed on a rotary shaft to be dented and to be crossed to each other, thereby reducing a transformation rate of the door and securing accuracy of the pin part.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: March 28, 2023
    Assignee: HANON SYSTEMS
    Inventors: Jong Su Kim, Seong Seok Han, Jeong Jae Lee, Hyung Joo Kim, Hun Sang Lee, Heon Hur, Beom Ki Kim
  • Patent number: D1016029
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: February 27, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji-Young Lee, Hyok-Su Choi, Chung-Ha Kim, Jong-Bo Jung, Min-Young Park
  • Patent number: D1016030
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: February 27, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji-Young Lee, Hyok-Su Choi, Chung-Ha Kim, Jong-Bo Jung, Min-Young Park
  • Patent number: D1016775
    Type: Grant
    Filed: May 4, 2022
    Date of Patent: March 5, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji-Young Lee, Hyok-Su Choi, Chung-Ha Kim, Jong-Bo Jung, Min-Young Park