Abstract: A method of testing a semiconductor memory device is provided. Data is written to a plurality of memory cells disposed in a memory cell block of the semiconductor memory device. A first driving voltage is applied to a first group of word lines. A second driving voltage is applied to a second group of word lines. Each word line of the first group of the word lines is interposed between two neighboring word lines of the second group of the word lines. The first driving voltage has a voltage level different from that of the second driving voltage. The data is read from first memory cells coupled to the first group to determine whether each of the first memory cells is defective.

Abstract: A method of testing a semiconductor memory device is provided. Data is written to a plurality of memory cells disposed in a memory cell block of the semiconductor memory device. A first driving voltage is applied to a first group of word lines. A second driving voltage is applied to a second group of word lines. Each word line of the first group of the word lines is interposed between two neighboring word lines of the second group of the word lines. The first driving voltage has a voltage level different from that of the second driving voltage. The data is read from first memory cells coupled to the first group to determine whether each of the first memory cells is defective.

Abstract: A semiconductor device may include a first memory cell connected to a bit-line and a first word-line, a second memory cell connected to a complementary bit-line and a second word-line, and an equalizer. The equalizer may be configured to transition a voltage of the bit-line and the complementary bit-line from a first voltage to a second voltage different from the first voltage at a first time period when the bit-line and complementary bit line are floating, and to transition the voltage of at least one of the bit-line and the complementary bit-line from the second voltage to a third voltage at a second time period after the first time period when the bit-line and complementary bit line are floating, the third voltage being different from the first and second voltages.

Abstract: A multiple well bias memory device that includes a semiconductor substrate; a first well of a first conductivity type formed in the semiconductor substrate and having a memory cell formed therein; and a second well of the first conductivity type formed in the semiconductor substrate and having formed therein a sense amplifier configured to sense and amplify data from the memory cell. The first and second wells have different doping concentrations and are biased to first and second voltages, respectively. The first voltage being lower than the second voltage.

Abstract: A method of testing a semiconductor memory device is provided. Data is written to a plurality of memory cells disposed in a memory cell block of the semiconductor memory device. A first driving voltage is applied to a first group of word lines. A second driving voltage is applied to a second group of word lines. Each word line of the first group of the word lines is interposed between two neighboring word lines of the second group of the word lines. The first driving voltage has a voltage level different from that of the second driving voltage. The data is read from first memory cells coupled to the first group to determine whether each of the first memory cells is defective.

Abstract: A semiconductor device may include a first memory cell connected to a bit-line and a first word-line, a second memory cell connected to a complementary bit-line and a second word-line, and an equalizer. The equalizer may be configured to transition a voltage of the bit-line and the complementary bit-line from a first voltage to a second voltage different from the first voltage at a first time period when the bit-line and complementary bit line are floating, and to transition the voltage of at least one of the bit-line and the complementary bit-line from the second voltage to a third voltage at a second time period after the first time period when the bit-line and complementary bit line are floating, the third voltage being different from the first and second voltages.

Abstract: A multiple well bias memory device that includes a semiconductor substrate; a first well of a first conductivity type formed in the semiconductor substrate and having a memory cell formed therein; and a second well of the first conductivity type formed in the semiconductor substrate and having formed therein a sense amplifier configured to sense and amplify data from the memory cell. The first and second wells have different doping concentrations and are biased to first and second voltages, respectively. The first voltage being lower than the second voltage.

Abstract: A semiconductor memory device and method directed to performing a memory operation in a semiconductor memory device are provided. The method includes receiving a write command signal from a memory controller; receiving data from the memory controller, the data including n pieces of data, wherein the k-th piece of data comprises masking data to be masked; and receiving a data masking signal from the memory controller, the data masking signal including enable information that enables data masking, and non-enable information for not enabling data masking, wherein the enable information is used to mask the k-th piece of data. A latency between receiving the write command signal and receiving the enable information is less than a latency between receiving the write command and receiving the k-th piece of data.

Abstract: A bit line sense amplifier circuit for use in a semiconductor memory device, and a control method thereof, in which the bit line sense amplifier circuit is controlled to maintain a precharge state thereof until a sense amplifier enable signal to enable the sense amplifier circuit is applied, thereby preventing the bit line sense amplifier circuit of the semiconductor memory device from floating, and preventing or substantially reducing a coupling effect, thereby providing a precise data sensing and amplification operation.

Abstract: A semiconductor memory device includes a memory core unit including a memory cell array including a plurality of memory cells and a sense amplifier to sense and amplify data of the plurality of memory cells, and a self refresh control unit to apply at least one first core voltage to the memory core unit and to control a self refresh operation to be performed at every first self refresh cycle, in a first self refresh mode, and to apply at least one second core voltage to the memory core unit and to control the self refresh operation to be performed at every second self refresh cycle, in a second self refresh mode. In the semiconductor memory, a level of the at least one first core voltage is higher than that of a corresponding one of the at least one second core voltage, and the first self refresh cycle is shorter than the second self refresh cycle.

Abstract: A semiconductor memory device and related test method are disclosed. Test data is defined from a group of M test bits selected from either input data or corresponding output data. A parallel bit test is then conducted on the test data. The M test bits include N test bits, where N is less than M, selected on a bit by bit basis from the output data, and L test bits, where N+L=M, selected from the input data. The selection of input data may be made in accordance with a don't care case for selected test data.

Abstract: A semiconductor memory device and method thereof are provided. The example method may be directed to performing a memory operation in a semiconductor memory device, and may include receiving data and a data masking signal corresponding to at least a portion of the received data, the received data scheduled to be written into memory in response to a write command and the data masking signal configured to block the at least a portion of the received data from being written into the memory and configuring timing parameters differently for each of the received data and the data masking signal so as to execute the write command without writing the at least a portion of the received data into the memory.

Abstract: A semiconductor memory device is provided. The device includes an on die termination circuit controlling a termination resistance value by detecting a phase change of a signal inputted through a pad. Additionally, the on die termination circuit changes the termination resistance value when an identical phase signal is inputted during n (n is positive integer) periods of a clock signal.

Abstract: A row active time control circuit is described that includes a master signal generating circuit and a row active control signal generating circuit. The master signal generating circuit generates one or more row active master signals based on an active command signal, a pre-charge command signal, and one or more row active control signals. The row active control signal generating circuit generates a pulse signal that oscillates based on the one or more row active master signals. The row active control signal also generates the one or more row active control signals by dividing a frequency of the generated pulse signal.

Abstract: A semiconductor memory device and method directed to performing a memory operation in a semiconductor memory device, which include receiving data and a data masking signal corresponding to a portion of the received data configured to be written into memory in response to a write command and the data masking signal configured to block the at least a portion of the received data from being written into the memory, and further configuring different timing parameters of the received data and the data masking signal for executing the write command without writing the at least a portion of the received data into the memory.

Abstract: There are provided a semiconductor memory device and a burn-in test method thereof. A semiconductor memory device according to an aspect of the invention includes a plurality of memory cell blocks, each of which includes a plurality of memory cells that are respectively coupled to a plurality of word lines and a plurality of bit lines, a word line control unit activating word lines in memory cell blocks that correspond to row address signals and word lines in memory cell blocks that do not correspond to the row address signals, during a test operation, and a write circuit writing data in the memory cell blocks that correspond to the row address signals and not writing data in the memory cell blocks that do not correspond to the row address signals, during the test operation.

Abstract: Provided is a semiconductor memory device and method that can control internal supply voltages independently. The semiconductor memory device includes a memory cell array, a reference voltage generating unit, an internal reference voltage generating unit, and an internal supply voltage generating unit. The reference voltage generating unit outputs a reference voltage in response to an external voltage. The internal reference voltage generating unit converts the reference voltage into a plurality of internal reference voltages, and outputs the plurality of internal reference voltages. The internal supply voltage generating unit converts the plurality of internal reference voltages into a plurality of internal supply voltages, and outputs the plurality of internal supply voltages. A first internal reference voltage is used to generate a first internal supply voltage and a second internal reference voltage is used to generate a second internal supply voltage.

Abstract: A probe sensing pad used to detect a position of a probe needle includes a probe area, at least two sensing regions contacting peripheral portions of the probe area, sensing elements of different electrical characteristics connected to corresponding sensing regions, and at least one isolation region for electrically insulting the sensing regions. The position of the probe needle relative to the probe sensing pad may be rapidly detected and automatically corrected toward a desired contact site of the probe sensing pad depending upon the voltage measured by a probe needle contacting the probe sensing pad. That is, the measured voltage will have a first value if deflected in a first direction, a second value (different from the first) if deflected in a second direction, and so on. The position of the probe needle can be corrected based on this measurement.

Abstract: An input/output sense amplifier (IOSA) controller of a semiconductor memory device includes an auto pulse generator and a latch enable signal generating circuit. The auto pulse generator generates an auto pulse signal having a first pulse shape. The latch enable signal generating circuit generates a first latch enable signal having a second pulse shape in response to an auto pulse signal in normal mode, and generates a second latch enable signal having a level shape that is enabled for long duration in response to the write enable bar signal in test mode. Accordingly, the semiconductor memory device including the IOSA controller may safely test a characteristic of the IOSA.

Abstract: A row active time control circuit is described that includes a master signal generating circuit and a row active control signal generating circuit. The master signal generating circuit generates one or more row active master signals based on an active command signal, a pre-charge command signal, and one or more row active control signals. The row active control signal generating circuit generates a pulse signal that oscillates based on the one or more row active master signals. The row active control signal also generates the one or more row active control signals by dividing a frequency of the generated pulse signal.