Abstract: A coil component includes a body including a first surface and a second surface opposing each other in a first direction, and a third surface and a fourth surface opposing each other in a second direction and each having a recess formed therein, a coil disposed within the body and having both ends extending to the recesses, an external electrode disposed on the first surface of the body and extending to the recesses so as to be connected to both ends of the coil, a first insulating layer disposed on the first surface of the body and having a first opening formed therein, and a second insulating layer disposed on the first insulating layer and having a second opening formed therein, wherein at least a portion of the external electrode is disposed in the first opening and the second opening.

Abstract: A multi-modal based automatic music generation device according to an embodiment of present invention comprises an embedding extraction module configured to generate an input embedding vector from input information received from a user terminal, a stem search module configured to select a reference stem based on the input embedding vector and select a plurality of similar stems based on the input embedding vector and an embedding vector included in the reference stem, a reference section generation module configured to create a reference section by editing and mixing the plurality of similar stems and a music generation module configured to generate music in song units by generating a plurality of audio sections based on the reference section.

Abstract: A coil component includes a body having a first surface and a second surface, opposing each other in a first direction, a third surface and a fourth surface, opposing each other in a second direction, and a fifth surface and a sixth surface, opposing each other in a third direction, the body having a first recess and a second recess respectively formed in the first surface and the second surface, a coil disposed within the body, the coil including first and second lead-out portions respectively having at least portions extending to the first and second recesses, first and second external electrodes disposed on the sixth surface of the body to be spaced apart from each other, the first and second external electrodes respectively extending to the first and second recesses to be respectively connected to the first and second lead-out portions.

Abstract: A coil component includes: a body including a core, and a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction, and a fifth surface and a sixth surface opposing each other in a third direction, wherein first and second recesses are formed on the third surface and the fourth surface, respectively; the coil being disposed inside the body, and including first and second withdrawal portions extending to at least one of the first or second recess; and a first external electrode disposed on the fifth surface of the body, extending to the first and second recesses, and connected to the first withdrawal portion; and a second external electrode disposed on the fifth surface of the body, extending to the first and second recesses, and connected to the second withdrawal portion.

Abstract: A coil component includes: a body having a first and a second surface opposing, and including first and second recesses respectively formed in the first and the second surface; a support member disposed in the body; a coil including a first coil portion disposed on one surface of the support member, a sub-lead portion extending from an outermost turn of the first coil portion to the first surface, a first lead portion disposed on other surface of the support member and connected to the sub-lead portion, a second coil portion disposed on the other surface of the support member, and a second lead portion extending from an outermost turn of the second coil portion to the second surface, wherein a thickness of the sub-lead portion is less than that of the first coil portion, and a width of the sub-lead portion is less than that of the first lead portion.

Abstract: A music analysis device that cross-compares music properties using an artificial neural network comprises a processor including an artificial neural network module and a memory module storing instructions executable by the processor.

Abstract: An interposer includes an interposer body; first and second lower patterns spaced apart from each other on a lower surface of the interposer body; and first and second upper patterns spaced apart from each other on an upper surface of the interposer body. The first and second upper patterns include first and second shape-securing layers spaced apart from each other on the upper surface of the interposer body, and first and second acoustic noise reduction layers disposed on the first and second shape-securing layers, respectively. An electronic component includes a capacitor and the interposer.

Abstract: An electronic component and a manufacturing method thereof are disclosed. An electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, and at least one dummy electrode pattern disposed to be spaced apart from the first electrode pattern and the second electrode pattern and disposed on the substrate. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.

Abstract: A multilayer capacitor includes: a first internal electrode layer including first and second internal electrodes disposed to face each other with an insulating portion interposed therebetween; a second internal electrode layer including a third internal electrode and a lead portion connected to the third internal electrode; a body including the first and second internal electrode layers alternately disposed with respective dielectric layers interposed therebetween; first and second external electrodes disposed on the body to be connected to the first and second internal electrodes, respectively; and a third external electrode disposed on the body to be connected to the lead portion.

Abstract: An interposer includes an interposer body; first and second lower patterns spaced apart from each other on a lower surface of the interposer body; and first and second upper patterns spaced apart from each other on an upper surface of the interposer body. The first and second upper patterns include first and second shape-securing layers spaced apart from each other on the upper surface of the interposer body, and first and second acoustic noise reduction layers disposed on the first and second shape-securing layers, respectively. An electronic component includes a capacitor and the interposer.

Abstract: An electronic component and a manufacturing method thereof are disclosed. The electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, at least one dummy conductor pattern disposed to be spaced apart from the conductor pattern portion and disposed on the substrate, and at least one dummy electrode pattern disposed on the at least one dummy conductor pattern. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.

Abstract: A multilayer capacitor includes: a first internal electrode layer including first and second internal electrodes spaced apart from each other with an insulating portion interposed therebetween; a second internal electrode layer including a third internal electrode; a body including the first and second internal electrode layers alternately disposed with respective dielectric layers interposed therebetween; first and second external electrodes disposed on the body to be electrically connected to the first and second internal electrodes, respectively; a connection electrode penetrating through the body to thereby be electrically connected to the third internal electrode; and a third external electrode disposed on the body to be electrically connected to the connection electrode.

Abstract: An electronic component and a manufacturing method thereof are disclosed. The electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, at least one dummy conductor pattern disposed to be spaced apart from the conductor pattern portion and disposed on the substrate, and at least one dummy electrode pattern disposed on the at least one dummy conductor pattern. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.

Abstract: An electronic component and a manufacturing method thereof are disclosed. An electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, and at least one dummy electrode pattern disposed to be spaced apart from the first electrode pattern and the second electrode pattern and disposed on the substrate. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.

Abstract: A multilayer capacitor and a board having the same provide high capacitance and low equivalent series inductance (ESL). The multilayer capacitor includes a capacitor body including an active region, including first and second internal electrodes, and first and second cover regions. Third and fourth internal electrodes are alternately disposed in the cover region adjacent to a mounting surface. First and second external electrodes respectively contact the first and second internal electrodes to provide capacitance. First and second via electrodes are disposed in the cover region, where the first via electrode connects the third internal electrode and a first band portion of the first external electrode to each other, and where the second via electrode connects the fourth internal electrode and a second band portion of the second external electrode to each other.

Abstract: A multilayer capacitor and a board having the same provide high capacitance and low equivalent series inductance (ESL). The multilayer capacitor includes a capacitor body including an active region, including first and second internal electrodes, and first and second cover regions. Third and fourth internal electrodes are alternately disposed in the cover region adjacent to a mounting surface. First and second external electrodes respectively contact the first and second internal electrodes to provide capacitance. First and second via electrodes are disposed in the cover region, where the first via electrode connects the third internal electrode and a first band portion of the first external electrode to each other, and where the second via electrode connects the fourth internal electrode and a second band portion of the second external electrode to each other.

Abstract: There is provided a piezoelectric vibration member including: a vibration substrate including a vibrating portion and a surrounding portion which is thinner than the vibrating portion; and vibrating electrodes disposed on one surface and the other surface of the vibrating portion in a thickness direction, wherein the vibrating portion includes protrusion portions protruding in relation to one surface and the other surface of the surrounding portion in the thickness direction, and at least one side surface of the protrusion portion has two or more crystal planes.

Abstract: A monolayer thin film capacitor includes: a bottom electrode; a top electrode; a dielectric layer disposed between the bottom electrode and the top electrode; a first via formed in the dielectric layer so as to penetrate through the dielectric layer; a second via formed in the top electrode so as to penetrate through the top electrode and having a greater width or a greater diameter than that of the first via; and a connection electrode disposed on inner sides of the first and second vias, electrically connected to the bottom electrode, and electrically insulated from the top electrode.

Abstract: A resistor element includes a substrate having first and second surfaces facing each other, and a plurality of side surfaces connecting the first surface and the second surface with each other. A resistance layer is on at least one of the first and second surfaces. A first terminal and a second terminal are connected to the resistance layer, and each include a first electrode layer on the first surface, a second electrode layer on the second surface, and a plurality of side electrode layers on at least a portion of the plurality of side surfaces. At least a portion of the side surfaces of the substrate is exposed between side electrode layers of the first terminal.

Abstract: A multilayer ceramic capacitor includes: a capacitance layer including dielectric layers and first and second internal electrodes disposed with respective dielectric layers interposed therebetween; a protection layer disposed on one surface of the capacitance layer; an alpha connection electrode provided in an alpha via penetrating through the protection layer; and a beta connection electrode provided in a beta via penetrating through the capacitance layer and connected to the alpha via. The alpha via has a diameter greater than that of the beta via.