Patents by Inventor Jose Marques
Jose Marques has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11950375Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.Type: GrantFiled: April 30, 2021Date of Patent: April 2, 2024Assignee: X Display Company Technology LimitedInventors: David Gomez, Christopher Andrew Bower, Raja Fazan Gul, António José Marques Trindade, Ronald S. Cok
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Patent number: 11897760Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.Type: GrantFiled: April 30, 2021Date of Patent: February 13, 2024Assignee: X-Celeprint LimitedInventors: Ronald S. Cok, Raja Fazan Gul, António José Marques Trindade
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Patent number: 11884537Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.Type: GrantFiled: March 15, 2021Date of Patent: January 30, 2024Assignee: X-Celeprint LimitedInventors: Ronald S. Cok, Raja Fazan Gul, António José Marques Trindade
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Patent number: 11863154Abstract: A suspended device structure comprises a substrate, a cavity disposed in a surface of the substrate, and a device suspended entirely over a bottom of the cavity. The device is a piezoelectric device and is suspended at least by a tether that physically connects the device to the substrate. The tether has a non-linear centerline. A wafer can comprise a plurality of suspended device structures.Type: GrantFiled: November 1, 2022Date of Patent: January 2, 2024Assignee: X-Celeprint LimitedInventors: António José Marques Trindade, Lei Liu, Ronald S. Cok
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Patent number: 11834330Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.Type: GrantFiled: October 8, 2020Date of Patent: December 5, 2023Assignee: X-Celeprint LimitedInventors: Ronald S. Cok, Raja Fazan Gul, António José Marques Trindade
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Publication number: 20230363092Abstract: A flexible electronic structure includes a flexible substrate comprising an electrically conductive top substrate layer and an opposing electrically conductive bottom substrate layer and a component. The component can include a component substrate non-native to the flexible substrate having a component substrate top side and an opposing component substrate bottom side, a planar component top electrode disposed on the component substrate top side and electrically connected to the electrically conductive top substrate layer thereby defining a planar electrical contact, and a planar component bottom electrode disposed on the component substrate bottom side and electrically connected to the electrically conductive bottom substrate layer thereby defining a planar electrical contact. The component can be disposed between the electrically conductive top substrate layer and the electrically conductive bottom substrate layer.Type: ApplicationFiled: May 5, 2023Publication date: November 9, 2023Inventors: António José Marques Trindade, Alexandre Chikhaoui, Ronald S. Cok
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Publication number: 20230336150Abstract: According to embodiments of the present disclosure, a micro-system comprises a frame, a component attached to and supported by the frame, and an electrically functional micro-device disposed on or in the frame and electrically connected to the component. The component can be exclusively supported by the frame. The frame can comprise the micro-device and can comprise the same materials and layer structure as the component. The component, frame, and micro-device can comprise a piezoelectric material. The component can be an acoustic resonator and the micro-device can be a capacitor.Type: ApplicationFiled: April 15, 2022Publication date: October 19, 2023Inventors: António José Marques Trindade, Ronald S. Cok, Raja Fazan Gul
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Publication number: 20230327640Abstract: A suspended device structure comprises a substrate, a cavity disposed in a surface of the substrate, and a device suspended entirely over a bottom of the cavity. The device is a piezoelectric device and is suspended at least by a tether that physically connects the device to the substrate. The tether has a non-linear centerline. A wafer can comprise a plurality of suspended device structures. A device structure can comprise a device over a sacrificial portion or cavity and a tether with a tether opening extending to the sacrificial portion or cavity. The tether or tether opening can have a T shape. The tether can have a tether length at least one third as large as a device length and the device can have a device length at least twice as large as a device width.Type: ApplicationFiled: March 9, 2023Publication date: October 12, 2023Inventors: António José Marques Trindade, Raja Fazan Gul, Lei Liu, Ronald S. Cok
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Publication number: 20230290663Abstract: According to embodiments of the present disclosure a micro-device comprises a frame and a component separated from the frame by a gap except where the component is connected to the frame with cantilever supports extending from the component to the frame. The internal frame contour of the frame can be non-rectangular. The external contour of the frame can be rectangular. The frame can follow the external contour of the component and cantilever supports except where the cantilever supports are connected to the frame. The internal or external contour of the frame can comprise slits extending into the frame. The gap separating the frame from the component can have a uniform width except where the cantilever supports are connected to the frame. In some embodiments, a micro-device is disposed on a target substrate comprising a cavity and the component is suspended over the cavity.Type: ApplicationFiled: March 11, 2022Publication date: September 14, 2023Inventors: António José Marques Trindade, Ronald S. Cok
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Publication number: 20230261149Abstract: A micro-device structure includes an insulating layer and a micro-device disposed on the insulating layer. A pocket is formed in the micro-device that extends from a surface of the micro-device opposite the insulating layer through the micro-device to the insulating layer. A micro-component is disposed in the pocket and is non-native to the micro-device and the insulating layer. The micro-component can emit or receive light through the insulating layer and can be connected to and controlled by a micro-circuit disposed in the micro-device.Type: ApplicationFiled: February 15, 2022Publication date: August 17, 2023Inventors: António José Marques Trindade, Alexandre Chikhaoui, Ronald S. Cok, Robert R. Rotzoll, Raja Fazan Gul, Lei Liu
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Patent number: 11670603Abstract: A micro-component comprises a component substrate having a first side and an opposing second side. Fenders project from the first and second sides of the component substrate and include first-side fenders extending from the first side and a second-side fender extending from the second side of the component substrate. At least two of the first-side fenders have a non-conductive surface and are disposed closer to a corner of the component substrate than to a center of the component substrate.Type: GrantFiled: July 2, 2021Date of Patent: June 6, 2023Assignee: X-Celeprint LimitedInventors: António José Marques Trindade, Ronald S. Cok
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Patent number: 11637540Abstract: A suspended device structure comprises a substrate, a cavity disposed in a surface of the substrate, and a device suspended entirely over a bottom of the cavity. The device is a piezoelectric device and is suspended at least by a tether that physically connects the device to the substrate. The tether has a non-linear centerline. A wafer can comprise a plurality of suspended device structures.Type: GrantFiled: October 30, 2019Date of Patent: April 25, 2023Assignee: X-Celeprint LimitedInventors: António José Marques Trindade, Lei Liu, Ronald S. Cok
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Patent number: 11626856Abstract: A suspended device structure comprises a substrate, a cavity disposed in a surface of the substrate, and a device suspended entirely over a bottom of the cavity. The device is a piezoelectric device and is suspended at least by a tether that physically connects the device to the substrate. The tether has a non-linear centerline. A wafer can comprise a plurality of suspended device structures. A device structure can comprise a device over a sacrificial portion or cavity and a tether with a tether opening extending to the sacrificial portion or cavity. The tether or tether opening can have a T shape. The tether can have a tether length at least one third as large as a device length and the device can have a device length at least twice as large as a device width.Type: GrantFiled: August 28, 2020Date of Patent: April 11, 2023Assignee: X-Celeprint LimitedInventors: António José Marques Trindade, Raja Fazan Gul, Lei Liu, Ronald S. Cok
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Publication number: 20230093573Abstract: A micro-device structure includes a substrate having a substrate surface and a substrate contact disposed on or in the substrate surface, a cavity extending into the substrate from the substrate surface, a micro-device disposed in the cavity, the micro-device comprising a micro-device contact, a planarization layer disposed over at least a portion of the substrate, and an electrode disposed at least partially over or on the planarization layer and electrically connected to the micro-device contact.Type: ApplicationFiled: October 24, 2022Publication date: March 23, 2023Inventors: António José Marques Trindade, Ronald S. Cok
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Publication number: 20230085815Abstract: A suspended device structure comprises a substrate, a cavity disposed in a surface of the substrate, and a device suspended entirely over a bottom of the cavity. The device is a piezoelectric device and is suspended at least by a tether that physically connects the device to the substrate. The tether has a non-linear centerline. A wafer can comprise a plurality of suspended device structures.Type: ApplicationFiled: November 1, 2022Publication date: March 23, 2023Inventors: António José Marques Trindade, Lei Liu, Ronald S. Cok
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Publication number: 20230058681Abstract: A micro-device structure includes a substrate having a substrate surface and a substrate contact disposed on or in the substrate surface, a cavity extending into the substrate from the substrate surface, a micro-device disposed in the cavity, the micro-device comprising a micro-device contact, a planarization layer disposed over at least a portion of the substrate, and an electrode disposed at least partially over or on the planarization layer and electrically connected to the micro-device contact.Type: ApplicationFiled: August 17, 2021Publication date: February 23, 2023Inventors: António José Marques Trindade, Ronald S. Cok
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Publication number: 20230057903Abstract: An integrated circuit includes a data processing array. The data processing array includes a plurality of compute tiles each having a processor. The integrated circuit includes an array controller coupled to the data processing array. The array controller is adapted to configure the plurality of compute tiles of the data processing array to implement an application. The application specifies kernels executable by the processors and stream channels that convey data to the plurality of compute tiles. The array controller is configured to initiate execution of workloads by the data processing array as configured with the application.Type: ApplicationFiled: August 15, 2022Publication date: February 23, 2023Applicant: Xilinx, Inc.Inventors: David Clarke, Juan J. Noguera Serra, Javier Cabezas Rodriguez, Zachary Blaise Dickman, Pedro Miguel Parola Duarte, Jose Marques
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Patent number: 11528808Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.Type: GrantFiled: December 3, 2018Date of Patent: December 13, 2022Assignee: X Display Company Technology LimitedInventors: David Gomez, Christopher Andrew Bower, Raja Fazan Gul, António José Marques Trindade, Ronald S. Cok
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Patent number: 11520717Abstract: An integrated circuit having a data processing engine (DPE) array can include a plurality of memory tiles. A first memory tile can include a first direct memory access (DMA) engine, a first random-access memory (RAM) connected to the first DMA engine, and a first stream switch coupled to the first DMA engine. The first DMA engine may be coupled to a second RAM disposed in a second memory tile. The first stream switch may be coupled to a second stream switch disposed in the second memory tile.Type: GrantFiled: March 9, 2021Date of Patent: December 6, 2022Assignee: Xilinx, Inc.Inventors: David Clarke, Peter McColgan, Zachary Dickman, Jose Marques, Juan J. Noguera Serra, Tim Tuan, Baris Ozgul, Jan Langer
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Patent number: 11482979Abstract: A method of making a micro-module structure comprises providing a substrate, the substrate having a substrate surface and comprising a substrate post protruding from the substrate surface. A component is disposed on the substrate post, the component having a component top side and a component bottom side opposite the component top side, the component bottom side disposed on the substrate post. The component extends over at least one edge of the substrate post. One or more component electrodes are disposed on the component.Type: GrantFiled: December 3, 2018Date of Patent: October 25, 2022Assignee: X Display Company Technology LimitedInventors: António José Marques Trindade, Raja Fazan Gul, Robert R. Rotzoll, Alexandre Chikhaoui, David Gomez, Ronald S. Cok