Abstract: An integrated circuit includes a plurality of data processing engines (DPEs) DPEs. Each DPE may include a core configured to perform computations. A first DPE of the plurality of DPEs includes a first core coupled to an input cascade connection of the first core. The input cascade connection is directly coupled to a plurality of source cores of the plurality of DPEs. The input cascade connection includes a plurality of inputs, wherein each of the plurality of inputs is connected to a cascade output of a different one of the plurality of source cores. The input cascade connection is programmable to enable a selected one of the plurality of inputs.

Abstract: A micro-component module comprises a module substrate, a component disposed on the module substrate, and at least a portion of a module tether in contact with the module substrate. The module substrate can be flexible or can comprise an organic material, or both. The module tether can be more brittle and less flexible than the module substrate. The component can be less flexible than the module substrate and can comprise at least a portion of a component tether. An encapsulation layer can be disposed over the component and module substrate. The component can be disposed in a mechanically neutral stress plane of the micro-component module. A micro-component module system can comprise a micro-component module disposed on a flexible system substrate, for example by micro-transfer printing. A micro-component module can comprise an internal module cavity in the module substrate with internal module tethers physically connecting the module substrate to internal anchors.

Abstract: A trim cover assembly for a vehicle seat assembly, a vehicle seat assembly, and a method of assembling the trim cover are provided. The trim cover assembly has a first trim member with a first surface to form a seating surface and a second surface opposite to the first surface. A second trim member is provided for connection to a seat member, and has first and second side regions each extending between first and second end regions. The first and second end regions are connected adjacent to first and second edges of the first trim member, respectively. A central region of the second trim member is connected to the second surface of the first trim member via a first seam.

Abstract: A component source wafer comprises printable components having adhesive disposed on a backside of the printable components. A wafer substrate comprises a sacrificial layer having recessed portions and anchors. A component is disposed entirely over each recessed portion. A tether physically connects each component to at least one of the anchors. A layer of adhesive is disposed on a side of the component adjacent to the recessed portion. Each component is suspended over the wafer substrate and the recessed portion defines a gap separating the component from the wafer substrate.

Abstract: A micro-device structure comprises a source substrate comprising sacrificial portions laterally spaced apart by anchors. Each sacrificial portion is exposed through an opening. A micro-device is disposed on each sacrificial portion and laterally attached to an anchor by a multi-layer tether. In certain embodiments, a micro-device structure is constructed by providing the source substrate, disposing micro-devices on each sacrificial portion, depositing a first tether layer over at least a portion of the source substrate and the micro-device, depositing a second tether layer over the first tether layer, and patterning the first tether layer and the second tether layer to form (i) a multi-layer tether for each of the micro-devices such that the multi-layer tether laterally attaches the micro-device to one of the anchors, and (ii) an opening exposing each of the sacrificial portions.

Abstract: A overhanging device cavity structure comprises a substrate and a cavity disposed in or on the substrate. The cavity comprises a first cavity side wall and a second cavity side wall opposing the first cavity side wall on an opposite side of the cavity from the first cavity side wall. A support extends from the first cavity side wall to the second cavity side wall and at least partially divides the cavity. A device is disposed on, for example in direct contact with, the support and extends from the support into the cavity.

Abstract: A seating system for a vehicle and a method for producing a seating system include a seat part having a cushion and a support material disposed on a surface of the cushion. An elongated member is attached to one side of the support material to create a channel in the opposite side, and a trim material is positioned over the support material to create a concavity in the trim material along the channel.

Abstract: A micro-device structure comprises a source substrate having a sacrificial layer comprising a sacrificial portion adjacent to an anchor portion, a micro-device disposed completely over the sacrificial portion, the micro-device having a top side opposite the sacrificial portion and a bottom side adjacent to the sacrificial portion and comprising an etch hole that extends through the micro-device from the top side to the bottom side, and a tether that physically connects the micro-device to the anchor portion. A micro-device structure comprises a micro-device disposed on a target substrate. Micro-devices can be any one or more of an antenna, a micro-heater, a power device, a MEMs device, and a micro-fluidic reservoir.

Abstract: A overhanging device cavity structure comprises a substrate and a cavity disposed in or on the substrate. The cavity comprises a first cavity side wall and a second cavity side wall opposing the first cavity side wall on an opposite side of the cavity from the first cavity side wall. A support extends from the first cavity side wall to the second cavity side wall and at least partially divides the cavity. A device is disposed on, for example in direct contact with, the support and extends from the support into the cavity.

Abstract: A micro-component comprises a component substrate having a first side and an opposing second side. Fenders project from the first and second sides of the component substrate and include first-side fenders extending from the first side and a second-side fender extending from the second side of the component substrate. At least two of the first-side fenders have a non-conductive surface and are disposed closer to a corner of the component substrate than to a center of the component substrate.

Abstract: A trim cover assembly for a vehicle seat assembly, a vehicle seat assembly, and a method of assembling the trim cover are provided. The trim cover assembly has a first trim member with a first surface to form a seating surface and a second surface opposite to the first surface. A second trim member is provided for connection to a seat member, and has first and second side regions each extending between first and second end regions. The first and second end regions are connected adjacent to first and second edges of the first trim member, respectively. A central region of the second trim member is connected to the second surface of the first trim member via a first seam.

Abstract: A vehicle seat trim assembly includes a seat trim adapted to be located over a seat foam that is supported on a vehicle seat frame. The seat trim includes an occupant support surface and a side trim that is attached to the occupant support surface. The vehicle seat trim assembly also includes a frame sock. The frame sock has a cover having an attachment edge with a top attachment portion that is attached to the occupant support surface and a side attachment portion that is attached to the side trim. The frame sock includes a clip that is attached to the cover and is adapted to engage the vehicle seat frame. The frame sock also has a strap that is attached to the cover between the attachment edge and the clip. The strap is attached to the cover and to a resilient retainer.

Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.

Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.

Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.

Abstract: A micro-component comprises a component substrate having a first side and an opposing second side. Fenders project from the first and second sides of the component substrate and include first-side fenders extending from the first side and a second-side fender extending from the second side of the component substrate. At least two of the first-side fenders have a non-conductive surface and are disposed closer to a corner of the component substrate than to a center of the component substrate.

Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.

Abstract: An exemplary micro-device and substrate structure includes a destination substrate and one or more contact pads disposed thereon, a micro-device disposed on or over the destination substrate, and a layer of cured adhesive disposed on the destination substrate. The micro-device comprises at least one electrical contact. The at least one electrical contact is in direct electrical contact with the one or more contact pads. The adhesive layer adheres the micro-device to the destination substrate and is in contact with the one or more contact pads. An exemplary method of making a micro-device and substrate structure includes providing a destination substrate and one or more contact pads disposed thereon, coating a layer of curable adhesive, disposing a micro-device comprising at least one electrical contact on the layer and curing the layer thereby directly electrically contacting the at least one electrical contact with the one or more contact pads.

Abstract: A seating system for a vehicle and a method for producing a seating system include a seat part having a cushion and a support material disposed on a surface of the cushion. An elongated member is attached to one side of the support material to create a channel in the opposite side, and a trim material is positioned over the support material to create a concavity in the trim material along the channel.

Abstract: A suspended device structure comprises a substrate, a cavity disposed in a surface of the substrate, and a device suspended entirely over a bottom of the cavity. The device is a piezoelectric device and is suspended at least by a tether that physically connects the device to the substrate. The tether has a non-linear centerline. A wafer can comprise a plurality of suspended device structures. A device structure can comprise a device over a sacrificial portion or cavity and a tether with a tether opening extending to the sacrificial portion or cavity. The tether or tether opening can have a T shape. The tether can have a tether length at least one third as large as a device length and the device can have a device length at least twice as large as a device width.