Abstract: An ESD protection structure for I/O pads is formed with well resistors underlying the active areas of a transistor. The well resistors are coupled in series with the active areas and provide additional resistance which is effective in protecting the transistor from ESD events. Metal conductors over the active areas, have a plurality of contacts to the active areas formed through an insulative layer to contact the active areas. Additional active areas adjacent to the active areas of the transistor are also coupled to the well resistors, and to a conductive layer which provides a conductor to the I/O pads. The active areas are silicided to reduce their resistance and increase the switching speed of the transistor. The n-well resistors are coupled in series to provide a large resistance with respect to that of the active areas to reduce the impact of ESD events.

Abstract: A voltage control circuit provides a test supply voltage during manufacturing and testing of a semiconductor device and provides an operational supply voltage after certification of the semiconductor device. The operational supply voltage is lower than the test supply voltage. The voltage control circuit includes a clamp circuit having a plurality of voltage regulation devices, typically diodes. The voltage regulation devices control an output of the clamp circuit. A voltage regulator is electrically coupled to the clamp circuit and generates a first control signal based upon the output of the clamp circuit. A charge pump then receives the control signal from the voltage regulator, and, based on the value of the control signal, the charge pump generates the test supply voltage. At least one bypass device is connected to at least one of the plurality of voltage regulation devices. The bypass device is activated following the certification of the semiconductor device.

Abstract: A buffer with an adjustable slew rate, including a current driver having an input terminal and an enable circuit connected to the input terminal to selectively enables the current driver. In one embodiment, the current driver includes an input terminal and the enable circuit includes a memory element, the state of which is used to activate the enable signal, a read circuit which reads the state of the memory element, a latch which latches the signal from the read circuit, and an output circuit connected to the input terminal of the current driver which provides a signal which selectively enables the current driver to adjust the slew rate.

Abstract: A voltage control circuit provides a test supply voltage during manufacturing and testing of a semiconductor device and provides an operational supply voltage after certification of the semiconductor device. The operational supply voltage is lower than the test supply voltage. The voltage control circuit includes a clamp circuit having a plurality of voltage regulation devices, typically diodes. The voltage regulation devices control an output of the clamp circuit. A voltage regulator is electrically coupled to the clamp circuit and generates a first control signal based upon the output of the clamp circuit. A charge pump then receives the control signal from the voltage regulator, and, based on the value of the control signal, the charge pump generates the test supply voltage. At least one bypass device is connected to at least one of the plurality of voltage regulation devices. The bypass device is activated following the certification of the semiconductor device.

Abstract: A fuse or antifuse reading circuit for accurately reading the conductive state of a marginally blown fuse or antifuse in spite of an increasing internal voltage supply. The antifuse reading circuit includes a voltage divider circuit to produce a fuse power supply that has a proportional relationship to the internal voltage supply. The antifuse reading circuit further includes a latch that receives the fuse power supply and produces an output signal indicative of the conductive state of the fuse or antifuse. The latch is set when the fuse or antifuse is not conductive and reset by a latch control circuit when the fuse or antifuse is conductive. The latch control circuit has a variable resistance to compensate for an increasing internal voltage supply. The variable resistance is controlled by a signal with an output level having a proportional relationship to the internal voltage supply that is greater than that for the fuse power supply.

Abstract: An improved anti-fuse structure is formed on a silicon substrate of a first conductivity type. The anti-fuse has a first conductive layer formed on a surface of substrate, a dielectric layer formed on the first conductive layer, and a second conductive layer formed on the dielectric layer. The second conductive layer has a portion extending beyond the dielectric layer above the surface of the substrate. A third conductive layer is contacted to this portion of the second dielectric layer. The anti-fuse further includes a well region having a graded doping profile formed in the silicon substrate under the portion of the second conductive layer to which the third conductive layer is contacted. The well region has a second conductivity type that is opposite the first conductivity type.

Abstract: A buffer with an adjustable slew rate, including a current driver having an input terminal and an enable circuit connected to the input terminal to selectively enables the current driver. In one embodiment, the current driver includes an input terminal and the enable circuit includes a memory element, the state of which is used to activate the enable signal, a read circuit which reads the state of the memory element, a latch which latches the signal from the read circuit, and an output circuit connected to the input terminal of the current driver which provides a signal which selectively enables the current driver to adjust the slew rate.

Abstract: An inventive integrated circuit die includes a bond pad connected to first and second input buffers in the die through laser fuses. In one operating configuration of the die, the die uses the first input buffer but does not use the second input buffer, so the laser fuse between the bond pad and the second input buffer is blown. In another operating configuration of the die, the die uses the second input buffer but does not use the first input buffer, so the laser fuse between the bond pad and the first input buffer is blown. As a result, the capacitive load on the bond pad is similar to the capacitive load on similar bond pads in the die connected to only one input buffer in the die. Thus, signals propagate into all the bond pads at about the same improved speed.

Abstract: An inventive integrated circuit die includes a bond pad connected to first and second input buffers in the die through laser fuses. In one operating configuration of the die, the die uses the first input buffer but does not use the second input buffer, so the laser fuse between the bond pad and the second input buffer is blown. In another operating configuration of the die, the die uses the second input buffer but does not use the first input buffer, so the laser fuse between the bond pad and the first input buffer is blown. As a result, the capacitive load on the bond pad is similar to the capacitive load on similar bond pads in the die connected to only one input buffer in the die. Thus, signals propagate into all the bond pads at about the same improved speed.

Abstract: A clock generator which provides a stable, programmable pulse width output clock signal based on an input clock signal. The clock generator provides a leading edge of an output clock signal in response to a leading edge of an input clock signal. The trailing edge of the output clock signal is conditioned on feedback of the leading edge output clock signal with the trailing edge of the input signal.

Abstract: A fuse or antifuse reading circuit for accurately reading the conductive state of a marginally blown fuse or antifuse in spite of an increasing internal voltage supply. The antifuse reading circuit includes a voltage divider circuit to produce a fuse power supply that has a proportional relationship to the internal voltage supply. The antifuse reading circuit further includes a latch that receives the fuse power supply and produces an output signal indicative of the conductive state of the fuse or antifuse. The latch is set when the fuse or antifuse is not conductive and reset by a latch control circuit when the fuse or antifuse is conductive. The latch control circuit has a variable resistance to compensate for an increasing internal voltage supply. The variable resistance is controlled by a signal with an output level having a proportional relationship to the internal voltage supply that is greater than that for the fuse power supply.

Abstract: A method is disclosed wherein the voltage of a semiconducting substrate can be locally pumped to a voltage different than the bulk of the semiconducting substrate generally. The local voltage may be pumped into a localized portion of the bulk substrate, or it may be pumped into a portion of the substrate that is isolated from the bulk substrate. This localized biasing may be used for various purposes, including the adjustment of body effect in a plurality of transistors, adjusting the threshold voltage of a capacitor, and reducing latch-up sensitivity of a transistor circuit.

Abstract: An improved anti-fuse structure is formed on a silicon substrate of a first conductivity type. The anti-fuse has a first conductive layer formed on a surface of the substrate, a dielectric layer formed on the first conductive layer, and a second conductive layer formed on the dielectric layer. The second conductive layer has a portion extending beyond the dielectric layer above the surface of the substrate. A third conductive layer is contacted to this portion of the second dielectric layer. The anti-fuse further includes a well region having a graded doping profile formed in the silicon substrate under the portion of the second conductive layer to which the third conductive layer is contacted. The well region has a second conductivity type that is opposite the first conductivity type.

Abstract: A circuit for reading and forcing a voltage at a node of an integrated circuit. In one embodiment, the circuit comprises a pass element that has an output that is coupled to a pin of the integrated circuit. A reset circuit is coupled to the pass circuit and is operable to activate and reset the pass circuit. Finally, a pass control circuit is coupled to provide a signal to the pass circuit that drives the pass circuit when active to pass the voltage at the node to the pin. In one embodiment, the circuit further includes a scaler circuit that establishes a ratio between the voltage at the node and the voltage at the pin such that high voltages can be passed to or from the node by the pass element.

Abstract: A clock generator which provides a stable output clock signal based on an input clock signal. The clock generator provides a leading edge of an output clock signal in response to a leading edge of an input clock signal. The trailing edge of the output signal is conditioned on feedback of the leading edge output clock signal with the trailing edge of the input clock signal.

Abstract: A buffer with an adjustable slew rate, including a current driver having an input terminal and an enable circuit connected to the input terminal to selectively enables the current driver. In one embodiment, the current driver includes an input terminal and the enable circuit includes a memory element, the state of which is used to activate the enable signal, a read circuit which reads the state of the memory element, a latch which latches the signal from the read circuit, and an output circuit connected to the input terminal of the current driver which provides a signal which selectively enables the current driver to adjust the slew rate.

Abstract: Method for repair of a memory array. In particular, a key is provided to inquire a memory array for ascertaining availability of redundant elements and programming a memory for access to such redundant elements. Alternatively, a second test key may be supplied to the memory for programming. In this manner, repair of the memory is effected. The memory may be a single memory integrated circuit (chip) or a memory module located in a system, such as a computer. Such repair may be done locally or remotely without uninstalling the defective memory.

Abstract: An improved anti-fuse structure is formed on a silicon substrate of a first conductivity type. The anti-fuse has a first conductive layer formed on a surface of the substrate, a dielectric layer formed on the first conductive layer, and a second conductive layer formed on the dielectric layer. The second conductive layer has a portion extending beyond the dielectric layer above the surface of the substrate. A third conductive layer is contacted to this portion of the second dielectric layer. The anti-fuse further includes a well region having a graded doping profile formed in the silicon substrate under the portion of the second conductive layer to which the third conductive layer is contacted. The well region has a second conductivity type that is opposite the first conductivity type.

Abstract: A circuit for providing electrostatic discharge (ESD) protection is disclosed. The circuit comprises a pair of CMOS field effect pull up and pull down transistors with reduced resistance source and drain, having a well resistor formed external to them between supply and ground busses respectively. During an ESD event, the well resistors serve to both limit the current flow through the transistors, and reduce the voltage drop across them.

Abstract: A circuit (10) for reading a voltage at a voltage source (14) of an integrated circuit (12). In one embodiment, the circuit (110) comprises a pass circuit (118) that has an input coupled to the node (114) of the integrated circuit (12). The circuit (110) provides a measurement of the voltage at the node (114) as an output to a pin (116). A reset circuit (122) is coupled to the pass circuit (118) and is operable to activate and reset the pass circuit (118). Finally, a pass control circuit (120) is coupled to provide an output signal to the pass circuit (118) that drives the pass circuit (118) when active to pass the voltage at the node (114) to the pin (116).