Patents by Inventor Ju Ho Kim

Ju Ho Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210320416
    Abstract: An antenna includes a first dielectric layer having a first surface and a second surface opposing the first surface; a second dielectric layer having a third surface, and a fourth surface opposing the third surface; a third dielectric layer having a fifth surface and a sixth surface opposing the fifth surface; a first adhesive layer disposed between the second surface and the third surface; a second adhesive layer disposed between the fourth surface and the fifth surface; a patch pattern disposed on the second surface and embedded in the first adhesive layer; a first coupling pattern disposed on the fourth surface and embedded in the second adhesive layer, and a second coupling pattern disposed on the sixth surface. The patch pattern, the first coupling pattern, and the second coupling pattern at least partially overlap one another on a plane.
    Type: Application
    Filed: June 18, 2020
    Publication date: October 14, 2021
    Inventors: Sangik Cho, Ju Ho Kim
  • Publication number: 20210320421
    Abstract: An antenna includes a first dielectric layer having a first surface and a second surface, a second dielectric layer having a third surface and a fourth surface, and a reinforcing layer disposed between the first dielectric layer and the second dielectric layer and including an insulating material. A first adhesive layer is disposed between the first dielectric layer and the reinforcing layer, and a second adhesive layer is disposed between the second dielectric layer and the reinforcing layer. A first pattern layer is disposed on a surface of the first dielectric layer facing the first adhesive layer, and a second pattern layer is disposed on a surface of the second dielectric layer facing away from the second adhesive layer. The reinforcing layer has a first cavity penetrating a region between the first and second dielectric layers.
    Type: Application
    Filed: July 2, 2020
    Publication date: October 14, 2021
    Inventors: Sangik CHO, Ju Ho KIM
  • Patent number: 11122694
    Abstract: A printed circuit board including: a laminate having a plurality of stacked insulating layers including a rigid insulating layer; a flexible insulating layer having a partial region that overlaps and is in contact with at least one of the insulating layers and a remaining region disposed outside of the laminate; and a first antenna disposed on a surface of the laminate.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: September 14, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae-Hong Min, Ju-Ho Kim
  • Patent number: 11099606
    Abstract: The present disclosure relates to a printed circuit board, a display device including the same, and a manufacturing method therefor. The printed circuit board includes a rigid region; and a flexible region comprising a flexible layer having a first surface and a second surface on an opposite side to the first surface, a reinforcing structure disposed on the first surface of the flexible layer, and a conductor pattern disposed on the second surface of the flexible layer. A material of the reinforcing structure has a coefficient of thermal expansion lower than that of a material of the flexible layer.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: August 24, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Ho Shin, Ju Ho Kim
  • Patent number: 11094623
    Abstract: A fan-out semiconductor package includes connection pads of a semiconductor chip that are redistributed and electrically connected to connection terminals by an interconnection member. In the fan-out semiconductor package, disposition forms of vias and pads in the interconnection member are designed so that stress may be reduced, such that reliability is improved.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: August 17, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Han Kim, Masazumi Amagai, Ju Ho Kim, Tae Sung Jeong
  • Publication number: 20210181799
    Abstract: The present disclosure relates to a printed circuit board, a display device including the same, and a manufacturing method therefor. The printed circuit board includes a rigid region; and a flexible region comprising a flexible layer having a first surface and a second surface on an opposite side to the first surface, a reinforcing structure disposed on the first surface of the flexible layer, and a conductor pattern disposed on the second surface of the flexible layer. A material of the reinforcing structure has a coefficient of thermal expansion lower than that of a material of the flexible layer.
    Type: Application
    Filed: March 17, 2020
    Publication date: June 17, 2021
    Inventors: Jae Ho SHIN, Ju Ho KIM
  • Patent number: 11013114
    Abstract: A printed circuit board is provided. The printed circuit board includes an insulating material, and a circuit comprising a first region that partially penetrates the insulating material, and a second region formed on the first region and that protrudes from an upper portion of the insulating material, the first region includes a first electroplating layer and a first electroless plating layer that are formed between the insulating material and the first electroplating layer.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: May 18, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seon-Ha Kang, Sa-Yong Lee, Mi-Sun Hwang, Ju-Ho Kim
  • Publication number: 20210101410
    Abstract: A tire for a vehicle has a structure in which a plurality of air blocks are detachably mounted in a circumferential direction of the tire. The tire is similar to an airless tire, in which a plurality of spokes are connected to and arranged between a tread rim part configured to come into contact with a road surface and a hub which is mounted to the wheel, and the tire is also similar to a pneumatic tire, in which an air block is replaceably inserted and mounted into an air block mounting space formed between the spokes.
    Type: Application
    Filed: August 26, 2020
    Publication date: April 8, 2021
    Inventors: Jae Sung Jung, Se Hwan Ku, Hyun Woo Hong, Dae Hwan Jo, Ju Ho Kim
  • Patent number: 10952316
    Abstract: A printed circuit board is disclosed. The printed circuit board includes a first substrate portion, and a second substrate portion connected to the first substrate portion and having a flexible insulation layer which is bendable, and the second substrate portion includes a frame member inserted into the flexible insulation layer.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: March 16, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Hong Min, Ju Ho Kim
  • Publication number: 20210076492
    Abstract: A printed circuit board and an antenna module including the same are provided. The printed circuit board includes a core layer; a first build-up structure disposed on an upper side of the core layer, including first insulating layers and first bonding layers, alternately stacked, and further including first wiring layers disposed on upper surfaces of the first insulating layers, respectively, and embedded in the first bonding layers, respectively; and a second build-up structure disposed on a lower side of the core layer, including second insulating layers and second bonding layers, alternately stacked, and further including second wiring layers disposed on lower surfaces of the second insulating layers, respectively, and embedded in the second bonding layers, respectively. The printed circuit board has a through-portion penetrating through the core layer and the second build-up structure, and has a region in which the through-portion is disposed as a flexible region.
    Type: Application
    Filed: February 19, 2020
    Publication date: March 11, 2021
    Inventors: Tae Hong Min, Ju Ho Kim
  • Publication number: 20210029625
    Abstract: An electronic device in a neighbor awareness networking (NAN) cluster is provided. The electronic device includes a wireless fidelity (Wi-Fi) transceiver; and a processor, coupled with the Wi-Fi transceiver, configured to perform a synchronization with at least one device in the NAN cluster, wherein the at least one device comprises an external electronic device, after performing the synchronization, receive, from the external electronic device through the Wi-Fi transceiver, a frame including first data within at least one discovery window (DW) among a plurality of DWs, wherein the first data comprises channel information for second data, and time information for the second data, and based on the channel information and the time information, control the Wi-Fi transceiver to receive the second data at a channel corresponding to the channel information of the received first data during a time duration corresponding to the time information of the received first data.
    Type: Application
    Filed: October 8, 2020
    Publication date: January 28, 2021
    Inventors: Bu-Seop Jung, Young-Kwan Chung, Dong-II Son, Yong-Hae Choi, Ju-Ho Kim, Christopher Kang, Hyuk Kang
  • Publication number: 20210014964
    Abstract: A printed circuit board is disclosed. The printed circuit board includes a first substrate portion, and a second substrate portion connected to the first substrate portion and having a flexible insulation layer which is bendable, and the second substrate portion includes a frame member inserted into the flexible insulation layer.
    Type: Application
    Filed: November 11, 2019
    Publication date: January 14, 2021
    Inventors: Tae Hong Min, Ju Ho Kim
  • Patent number: 10880824
    Abstract: An electronic device in a neighbor awareness networking (NAN) cluster is provided. The electronic device includes a wireless fidelity (Wi-Fi) transceiver; and a processor, coupled with the Wi-Fi transceiver, configured to perform a synchronization with at least one device in the NAN cluster, wherein the at least one device comprises an external electronic device, after performing the synchronization, receive, from the external electronic device through the Wi-Fi transceiver, a frame including first data within at least one discovery window (DW) among a plurality of DWs, wherein the first data comprises channel information for second data, and time information for the second data, and based on the channel information and the time information, control the Wi-Fi transceiver to receive the second data at a channel corresponding to the channel information of the received first data during a time duration corresponding to the time information of the received first data.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: December 29, 2020
    Inventors: Bu-Seop Jung, Young-Kwan Chung, Dong-Il Son, Yong-Hae Choi, Ju-Ho Kim, Christopher Kang, Hyuk Kang
  • Patent number: 10841868
    Abstract: An electronic device in a neighbor awareness networking (NAN) cluster is provided. The electronic device includes a wireless fidelity (Wi-Fi) transceiver; and a processor, coupled with the Wi-Fi transceiver, configured to perform a synchronization with at least one device in the NAN cluster, wherein the at least one device comprises an external electronic device, after performing the synchronization, receive, from the external electronic device through the Wi-Fi transceiver, a frame including first data within at least one discovery window (DW) among a plurality of DWs, wherein the first data comprises channel information for second data, and time information for the second data, and based on the channel information and the time information, control the Wi-Fi transceiver to receive the second data at a channel corresponding to the channel information of the received first data during a time duration corresponding to the time information of the received first data.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: November 17, 2020
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Bu-Seop Jung, Young-Kwan Chung, Dong-Il Son, Yong-Hae Choi, Ju-Ho Kim, Christopher Kang, Hyuk Kang
  • Publication number: 20200323328
    Abstract: The present invention relates to a cosmetic separately containing a different cosmetic material, which includes a cosmetic container (10); an impregnation member (20) accommodated in the cosmetic container (10) and impregnated with a cosmetic material; and a containing body (32) provided separately from the cosmetic container (10), wherein the containing body (32) contains another cosmetic material, and two kinds of cosmetic materials are mixed with each other for use while the containing body (32) is placed on the impregnation member (20) of the cosmetic container (10).
    Type: Application
    Filed: May 25, 2017
    Publication date: October 15, 2020
    Applicant: AmorePacific Corporation
    Inventors: Jun Young KIM, Ju Ho KIM, Chang Gyu YOO
  • Patent number: 10744042
    Abstract: The present invention relates to a smart infant toilet system and a method thereof, and the system includes a first sensor mounted to an infant product to sense external temperature and humidity, a second sensor mounted to the infant product to sense gas, third sensor mounted to the infant product to sense whether an infant rides on the infant product, a control module configured to set critical temperature and humidity, and an alarming unit configured to provide an alarm to a guardian when it is determined that the comparative temperature and humidity are out of the preset range of the critical temperature and humidity.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: August 18, 2020
    Assignee: MONIT CORP.
    Inventors: Dohyeong Park, Jae Ho Baek, Jung Hun Lee, Yeo Hwan Yoon, Seong Cheol Lim, Ju Ho Kim, Ja Young Moon, Hye Bin Lee
  • Publication number: 20200176370
    Abstract: A fan-out semiconductor package includes connection pads of a semiconductor chip that are redistributed and electrically connected to connection terminals by an interconnection member. In the fan-out semiconductor package, disposition forms of vias and pads in the interconnection member are designed so that stress may be reduced, such that reliability is improved.
    Type: Application
    Filed: February 11, 2020
    Publication date: June 4, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Han Kim, Masazumi Amagai, Ju Ho Kim, Tae Sung Jeong
  • Publication number: 20200176386
    Abstract: Provided is a printed circuit board including a laminate that is formed by vertically stacking a plurality of insulating layers including a rigid insulating layer, a flexible insulating layer having a first region in vertical contact with at least one of the plurality of insulating layers and a second region located on an outer side of the laminate, and a first electronic element embedded in the flexible insulating layer.
    Type: Application
    Filed: August 12, 2019
    Publication date: June 4, 2020
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ho-Hyung HAM, Sa-Yong LEE, Ju-Ho KIM
  • Publication number: 20200171889
    Abstract: A tire noise reduction apparatus may include a housing mounted on an external circumferential surface of a wheel rim on which a tire is mounted, the housing having an internal space and being open at one side in a circumferential direction of the wheel rim, wherein the housing includes a neck at an opposite side which is opposite to the open one side; and a movable member inserted into the internal space of the housing through the open one side of the housing and having an internal space in fluidical communication with the internal space of the housing, the movable member being mounted to the housing to be movable in a direction in which the movable member is inserted into the internal space of the housing and in a direction in which the movable member is withdrawn out of the housing.
    Type: Application
    Filed: January 31, 2019
    Publication date: June 4, 2020
    Applicants: Hyundai Motor Company, Kia Motors Corporation
    Inventor: Ju Ho KIM
  • Publication number: 20200178389
    Abstract: A printed circuit board includes: a laminate including a core layer and insulating layers stacked on first and second sides of the core layer; and a first antenna formed on a surface of the laminate. A thickness of the core layer is greater than a thickness of one of the insulating layers. A dielectric constant of the core layer is higher than a dielectric constant of the one of the insulating layers.
    Type: Application
    Filed: November 5, 2019
    Publication date: June 4, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae-Hong MIN, Ju-Ho KIM