Patents by Inventor Jui Chang

Jui Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for controlling exposure region in bevel etching process for semiconductor fabrication
    Patent number: 10879051
    Abstract: A plasma processing apparatus is provided. The apparatus includes a lower sheltering module. The apparatus further includes an upper sheltering module arranged adjacent to the lower sheltering module. The apparatus includes an upper plate and an upper PEZ ring positioned around the upper plate. The apparatus also includes a shadowing unit that includes a number of engaging parts in the form of arcs detachably positioned on the upper PEZ ring. In addition, the apparatus includes a plasma generation module for generating plasma in the peripheral region of the lower sheltering module and the upper sheltering module.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: December 29, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Hsing Wu, Hung-Jui Chang, Chih-Ching Cheng, Yi-Wei Chiu, Kun-Cheng Chen
  • BARBECUE GRILL WITH A BOWL CONNECTED TO A SUPPORT STRUCTURE IN A DETACHABLE MANNER
    Publication number: 20200390278
    Abstract: A barbecue grill includes a bowl and a support structure. The bowl includes two connectors and two couplers. Each of the connectors includes an aperture. Each of the couplers includes a latch movable between an extended position and a withdrawn position. The support structure includes two positioning elements and two restraining elements. Each of the positioning elements includes a hook for insertion in the aperture of a corresponding one of the connectors. Each of the restraining elements includes an engagement fin formed with an aperture for receiving the latch of a corresponding one of the couplers in the extended position when the engagement fin is located parallel to the corresponding coupler.
    Type: Application
    Filed: June 17, 2019
    Publication date: December 17, 2020
    Inventor: Shu-Jui Chang
  • Method and device for adjusting signal transmission direction in bidirectional ReDriver IC chip
    Patent number: 10866920
    Abstract: For adjusting a signal transmission direction in a cable, which is configured to be electrically coupled between a first interface port and a second interface port, an electric characteristic on at least a first pin of the first interface port is detected. Then a signal transmission direction of at least one pair of differential signal transmission channels in the cable is controlled to change from a first direction to a second direction different from the first direction, provided that a communication protocol between the first interface port and the second interface port is changed from a first communication protocol to a second communication protocol, and the electric characteristic complies with a first condition.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: December 15, 2020
    Assignee: VIA LABS, INC.
    Inventors: Yu-Lung Lin, Hsuan-Jui Chang
  • Moving focus ring for plasma etcher
    Patent number: 10847349
    Abstract: A semiconductor manufacturing method and semiconductor manufacturing tool for performing the same are disclosed. The semiconductor manufacturing tool includes a plasma chamber, a mounting platform disposed within the plasma chamber, a focus ring disposed within the plasma chamber, and at least one actuator mechanically coupled to the focus ring and configured to move the focus ring vertically. The actuator is configured to move the focus ring vertically when a plasma is present in the plasma chamber.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: November 24, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chi Lin, Yi-Wei Chiu, Hung Jui Chang, Chin-Hsing Lin
  • Spreading control switch structure of a spreader
    Patent number: 10830361
    Abstract: A spreading control switch structure of a spreader has a spreading tube, a positioning member, a main tube and a switch unit. With the positioning member and the switch unit, the opening and closing state and the spreading amount of the present invention can be adjusted by the circular plate of the valve in the spreading tube. The size of the pipe in the spreading tube is opened to control the blanking amount. On the other hand, the circular plate of the valve can be kept opened in the spreading tube all time without the switching handle being pressed. Therefore, it is easier and less laborious to execute the spreading process.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: November 10, 2020
    Assignee: SK & Y AGRICULTURAL EQUIPMENTS CO., LTD.
    Inventor: Jui-Chang Wu
  • Electrolytic copper foil and electrode and lithium ion cell comprising the same
    Patent number: 10826052
    Abstract: Provided are an electrolytic copper foil, an electrode comprising the same, and a lithium ion cell comprising the same. The electrolytic copper foil comprises first and second chromium layers each containing 15 ?g/dm2 to 50 ?g/dm2 of chromium, and has a resistivity of 1.72 ??*cm to 2.25 ??*cm. First and second surfaces thereof each have a contact angle of 15 to 50 degrees with oxalic acid, the first surface has a lightness of 17.5 to 40 and the second surface has a lightness of 38 to 60. With these characteristics, the electrolytic copper foil has good weatherability and good adhesion strength with the active materials, thereby improving the cycle life of the lithium ion cell comprising the same.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: November 3, 2020
    Assignee: CHANG CHUN PETROCHEMICAL CO., LTD.
    Inventors: Jian-Ming Huang, Yao-Sheng Lai, Jui-Chang Chou
  • MOBILE DEVICE AND CONTROL METHOD THEREOF
    Publication number: 20200333886
    Abstract: A mobile device includes sensors and a processor. The sensors are disposed on opposite edges of the mobile device respectively. The processor is configured to collect a first data set labeled with a right hand holding gesture, collect a second data set labeled with a left hand holding gesture, establish a determination model associated with the first data set and the second data set, and in response to the processor collects a third data set comprising the holding positions and the force values detected by the sensor, determine a current holding gesture according to the third data set in reference to the determination model.
    Type: Application
    Filed: April 19, 2019
    Publication date: October 22, 2020
    Inventors: Yu-Kai HUNG, I-Jui CHANG, Jhao-Yin LI, Wen-Yu WENG, Yu-Ta CHEN
  • INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
    Publication number: 20200335477
    Abstract: A method of manufacturing an integrated fan-out (InFO) package includes at least the following steps. A package array is formed. A core layer and a dielectric layer are sequentially stacked over the package array. The core layer includes a plurality of cavities. A plurality of first conductive patches is formed on the dielectric layer above the cavities.
    Type: Application
    Filed: July 8, 2020
    Publication date: October 22, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih, Han-Ping Pu, Chien-Ling Hwang, Pei-Hsuan Lee, Tzu-Chun Tang, Yu-Ting Chiu, Jui-Chang Kuo
  • ETCH PROFILE CONTROL OF INTERCONNECT STRUCTURES
    Publication number: 20200328113
    Abstract: A method of forming a semiconductor structure includes forming an etch stop layer on a substrate, forming a metal oxide layer over the etch stop layer, and forming an interlayer dielectric (ILD) layer on the metal oxide layer. The method further includes forming a trench etch opening over the ILD layer, forming a capping layer over the trench etch opening, and forming a via etch opening over the capping layer.
    Type: Application
    Filed: June 25, 2020
    Publication date: October 15, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Allen Ke, Yi-Wei CHIU, Hung Jui CHANG, Yu-Wei KUO
  • Electrolytic copper foil with low profile
    Patent number: 10787751
    Abstract: Surface-treated copper foils comprising an electrodeposited copper foil including a drum side and a deposited side are reported. The treatment layer is disposed on one of the drum side and the deposited side and provides a surface-treated side. The treatment layer comprises a nodule layer and the surface-treated side exhibits a void volume (Vv) in a range of 0.1 to 0.9 ?m3/?m2. The surface-treated copper foil also has a combined hydrogen and oxygen content of less than or equal to 300 ppm.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: September 29, 2020
    Assignee: CHANG CHUN PETROCHEMICAL CO., LTD.
    Inventors: Jian-Ming Huang, Yao-Sheng Lai, Jui-Chang Chou
  • Methods of Forming Conductive Features Using a Vacuum Environment
    Publication number: 20200303245
    Abstract: An interconnect structure and a method of forming are provided. The method includes forming an opening in a dielectric layer and an etch stop layer, wherein the opening extends only partially through the etch stop layer. The method also includes creating a vacuum environment around the device. After creating the vacuum environment around the device, the method includes etching through the etch stop layer to extend the opening and expose a first conductive feature. The method also includes forming a second conductive feature in the opening.
    Type: Application
    Filed: June 8, 2020
    Publication date: September 24, 2020
    Inventors: Chia-Ching Tsai, Yi-Wei Chiu, Hung Jui Chang, Li-Te Hsu
  • Electrolytic copper foil and electrode and lithium-ion battery comprising the same
    Patent number: 10781523
    Abstract: Provided are an electrolytic copper foil, an electrode comprising the same, and a lithium-ion battery comprising the same. The electrolytic copper foil comprises a drum side and a deposited side opposite each other. The drum side and the deposited side each have a Kurtosis (Sku) in a range of 1.8 to 6.4, a developed interfacial area ratio (Sdr) in a range of 0.06% to 13%, and a texture aspect ratio (Str) in a range of 0.1 to 1. With the surface morphology, the electrolytic copper foil has an improved adhesion strength with the active material, and thus improving the charge-discharge cycle life performance of the lithium-ion secondary battery.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: September 22, 2020
    Assignee: Chang Chun Petrochemicals Co., Ltd.
    Inventors: Huei-Fang Huang, Yao-Sheng Lai, Jui-Chang Chou
  • Magnetic random access memory with various size magnetic tunneling junction film stacks
    Patent number: 10784440
    Abstract: A semiconductor device includes a magnetic random access memory (MRAM). The MRAM comprises a plurality of MRAM cells including a first type MRAM cell and a second type MRAM cell. Each of the plurality of MRAM cells includes a magnetic tunneling junction (MTJ) layer including a pinned magnetic layer, a tunneling barrier layer and a free magnetic layer. A size of the MTJ film stack of the first type MRAM cell is different from a size of the MTJ film stack of the second type MRAM cell. In one or more of the foregoing and following embodiments, a width of the MTJ film stack of the first type MRAM cell is different from a width of the MTJ film stack of the second type MRAM cell.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: September 22, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Huang-Wen Tseng, Cheng-Chou Wu, Che-Jui Chang
  • ELECTRODEPOSITED COPPER FOIL WITH ANTI-BURR PROPERTY
    Publication number: 20200295378
    Abstract: Electrodeposited copper foils possessing properties for manufacturing lithium ion rechargeable secondary batteries are described, including methods of making the electrodeposited copper foils, methods for making the battery, and the resultant battery. The electrodeposited copper foils have a specific burst strength in the range of 1.5 to 4.3 kPa*m2/g and a tensile strength in the range of 30 to 40 kgf/mm2. The deposited side of the electrodeposited copper foil has a surface hardness in the range of 0.2 to about 2.0 Gpa by nano indentation analysis to resist wrinkling during pressing of the active materials on the electrodeposited copper foil. The foil exhibits reduced copper burr formation and burr size after clipping.
    Type: Application
    Filed: March 14, 2019
    Publication date: September 17, 2020
    Inventors: Yao-Sheng LAI, Kuei-Sen CHENG, Jui-Chang CHOU, Chien-Ming LAI
  • Low transmission loss copper foil and methods for manufacturing the copper foil
    Patent number: 10772199
    Abstract: Surface-treated copper foils that exhibit a material volume (Vm) less than 1.90 ?m3/?m2. Where the surface-treated copper foil is treated on the drum side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: September 8, 2020
    Assignee: CHANG CHUN PETROCHEMICAL CO., LTD.
    Inventors: Chien-Ming Lai, Yao-Sheng Lai, Jui-Chang Chou
  • ELECTRO-PHORETIC DISPLAY APPARATUS
    Publication number: 20200279535
    Abstract: An electro-phoretic display apparatus including an electro-phoretic display panel and a driving circuit is provided. The electro-phoretic display panel includes a display area and a border area. The driving circuit is configured to drive the display area to display an image frame according to a first voltage. The driving circuit drives the border area to maintain displaying a border of a first color or a second color according to a second voltage. The driving circuit generates the second voltage according to the first voltage. The border area includes electro-phoretic particles of the first color or the second color. A voltage difference between the first voltage and the second voltage drives the electro-phoretic particles of the first color or the second color to be maintained to a predetermined position such that the border area maintains displaying the border of the first color or the second color.
    Type: Application
    Filed: May 18, 2020
    Publication date: September 3, 2020
    Applicant: E Ink Holdings Inc.
    Inventors: Hao-Ting Hsu, Chia-Hao Kuo, Yu-Jui Chang
  • Electrolytic copper foil for printed circuit board with low transmission loss
    Patent number: 10765010
    Abstract: Surface-treated copper foils that exhibit a material volume (Vm) in a range of 0.05 to 0.6 ?m3/?m2 and a yellowness index (YI) in a range of 17 to 52 are reported. Where the surface-treated copper foil is treated on the deposited side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: September 1, 2020
    Assignee: CHANG CHUN PETROCHEMICAL CO., LTD.
    Inventors: Jian-Ming Huang, Yao-Sheng Lai, Jui-Chang Chou
  • DATA TRANSMISSION DEVICE, DATA TRANSMISSION METHOD AND NON-TRANSITORY COMPUTER READABLE MEDIUM
    Publication number: 20200272586
    Abstract: The disclosure provides a data transmission device. The data transmission device includes a storage medium, a processor and a communication interface. The storage medium is configured to store a plurality of applications. The processor is coupled to the storage media and configured to determine a host application among the plurality of applications, where the host application includes a software development kit (SDK) program, and executes the SDK program of the host application to request behavior data of the plurality of applications. The communication interface is coupled to the processor and is configured to transmit the behavior data to a server.
    Type: Application
    Filed: January 8, 2020
    Publication date: August 27, 2020
    Inventors: I-Heng WU, Chang-Hsien WANG, Yang-Jui CHANG
  • Method of manufacturing integrated fan-out package
    Patent number: 10756052
    Abstract: A method of manufacturing an integrated fan-out (InFO) package includes at least the following steps. A package array is formed. A dielectric layer having a core layer formed thereon is provided. The core layer includes a plurality of cavities penetrating through the core layer. The dielectric layer and the core layer are attached onto the package array such that the core layer is located between the dielectric layer and the package array. A plurality of first conductive patches is formed on the dielectric layer above the cavities.
    Type: Grant
    Filed: July 28, 2019
    Date of Patent: August 25, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih, Han-Ping Pu, Chien-Ling Hwang, Pei-Hsuan Lee, Tzu-Chun Tang, Yu-Ting Chiu, Jui-Chang Kuo
  • LOW TRANSMISSION LOSS COPPER FOIL AND METHODS FOR MANUFACTURING THE COPPER FOIL
    Publication number: 20200253047
    Abstract: Surface-treated copper foils that exhibit a material volume (Vm) less than 1.90 ?m3/?m2. Where the surface-treated copper foil is treated on the drum side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.
    Type: Application
    Filed: December 16, 2019
    Publication date: August 6, 2020
    Inventors: Chien-Ming LAI, Yao-Sheng LAI, Jui-Chang CHOU