Abstract: Provided is a protective structure including an auxiliary layer and a hard coating layer. The auxiliary layer has a first surface and a second surface opposite to the first surface. The hard coating layer is located on the second surface of the auxiliary layer. The Young's modulus of the auxiliary layer is gradually increased from the second surface to the first surface. An electronic device with the same is also provided.

Abstract: A method includes mounting a wafer on a chuck disposed within a chamber of an etching system, the wafer being encircled by a focus ring. While etching portions of the wafer, an etch direction is adjusted to a first desired etch direction by adjusting a vertical position of the focus ring relative to the wafer to a first desired vertical position. While etching portions of the wafer, the etch direction is adjusted to a second desired etch direction by adjusting the vertical position of the focus ring relative to the wafer to a second desired vertical position. The second desired vertical position is different from the first desired vertical position. The second desired etch direction is different from the first desired etch direction.

Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a chip package, a core dielectric layer disposed on the chip package, and an antenna pattern disposed on the core dielectric layer opposite to the chip package. The chip package includes a semiconductor chip, an insulating encapsulation encapsulating the semiconductor chip, and a redistribution structure electrically coupled to the semiconductor chip. The redistribution structure includes a first circuit pattern located at an outermost side of the chip package, and a patterned dielectric layer disposed between the first circuit pattern and the insulating encapsulation. The core dielectric layer is in contact with the first circuit pattern. The core dielectric layer and the patterned dielectric layer are of different materials. The antenna pattern is electrically coupled to the chip package.

Abstract: For adjusting a signal transmission direction in a cable, which is configured to be electrically coupled between a first interface port and a second interface port, an electric characteristic on at least a first pin of the first interface port is detected. Then a signal transmission direction of at least one pair of differential signal transmission channels in the cable is controlled to change from a first direction to a second direction different from the first direction, provided that a communication protocol between the first interface port and the second interface port is changed from a first communication protocol to a second communication protocol, and the electric characteristic complies with a first condition.

Abstract: An assemblable cooling fin assembly includes a plurality of cooling fins. Each of the cooling fins includes a base plate, a first side plate, a second side plate and a first engaging protrusion. The base plate has a first engaging slot. The first side plate and the second side plate are respectively connected to two opposite sides of the base plate. The first engaging protrusion has a connecting end and a deformable end opposite to each other. The connecting end is connected to the first side plate. In addition, the first engaging protrusion of one of the plurality of cooling fins is disposed through the first engaging slot of another one of the plurality of cooling fins, and the deformable end of the first engaging protrusion is deformed so as to become wider than the first engaging slot.

Abstract: The present disclosure describes an exemplary etch process in a reactor that includes a shower head and an electrostatic chuck configured to receive a radio frequency (RF) power. The shower head includes a top plate and a bottom plate with one or more gas channels that receive incoming gases. The method can include (i) rotating the top plate or the bottom plate of the shower head to a first position to allow a gas to flow through the shower head; (ii) performing a surface modification cycle that includes: applying a negative direct current (DC) bias voltage to the shower head, applying an RF power signal to the wafer chuck; and (iii) performing an etching cycle that includes: removing the negative DC bias voltage from the shower head and lowering the RF power signal applied to the wafer chuck.

Abstract: A light emitting device including a base, a first electrode, a barrier structure layer, a light emitting layer and a second electrode is provided. The barrier structure layer includes a first barrier layer in contact with the first electrode, a second barrier layer and a third barrier layer. The first barrier layer, the second barrier layer and the third barrier layer stack sequentially. The materials of the first barrier layer and the third barrier layer include a dielectric material. The material of the second barrier layer includes a metal material. A boundary between the third barrier layer and the second barrier layer keeps a vertical distance from the first electrode. The light emitting structure layer is disposed between the first electrode and the second electrode and surrounded by the barrier structure layer. The thickness of the light emitting structure layer is not greater than the vertical distance.

Abstract: An assemblable cooling fin assembly includes a plurality of cooling fins. Each of the cooling fins includes a base plate, a first side plate, a second side plate and a first engaging protrusion. The base plate has a first engaging slot. The first side plate and the second side plate are respectively connected to two opposite sides of the base plate. The first engaging protrusion has a connecting end and a deformable end opposite to each other. The connecting end is connected to the first side plate. In addition, the first engaging protrusion of one of the plurality of cooling fins is disposed through the first engaging slot of another one of the plurality of cooling fins, and the deformable end of the first engaging protrusion is deformed so as to become wider than the first engaging slot.

Abstract: A semiconductor manufacturing method and semiconductor manufacturing tool for performing the same are disclosed. The semiconductor manufacturing tool includes a plasma chamber, a mounting platform disposed within the plasma chamber, a focus ring disposed within the plasma chamber, and at least one actuator mechanically coupled to the focus ring and configured to move the focus ring vertically. The actuator is configured to move the focus ring vertically when a plasma is present in the plasma chamber.

Abstract: A method includes mounting a wafer on a chuck disposed within a chamber of an etching system, the wafer being encircled by a focus ring. While etching portions of the wafer, an etch direction is adjusted to a first desired etch direction by adjusting a vertical position of the focus ring relative to the wafer to a first desired vertical position. While etching portions of the wafer, the etch direction is adjusted to a second desired etch direction by adjusting the vertical position of the focus ring relative to the wafer to a second desired vertical position. The second desired vertical position is different from the first desired vertical position. The second desired etch direction is different from the first desired etch direction.

Abstract: Family of non-homopolymers synthesized from N-vinyl lactam, (meth)acrylic acid, hydrophobic (meth)acrylic ester of a straightchain or branched-chain alkyl alcohol and monomer selected from the group consisting of functionalized and unfunctionalized: dialkyl maleates, dialkyl fumarates, and combinations thereof. The non-homopolymers may exhibit solubility in one or more lower molecular weight alcohols and/or a glass transition temperature greater than 80° C.

Abstract: A bicycle chain includes a plurality of link units in series connection, and each of the link units includes two outer link plates, two inner link plates, and a pin. Each outer link plate includes two outer plate end portions and an outer plate connecting portion between to the outer plate end portions, and each outer plate end portion has a bore. Each outer plate end portion of the outer link plate has two cut portions on an edge thereof. The cut portions of the outer link plates provides a space, which is helpful to derailing the chain onto another sprocket in a low interference and a fast and smooth way.

Abstract: A method of manufacturing an integrated fan-out (InFO) package includes at least the following steps. A package array is formed. A dielectric layer having a core layer formed thereon is provided. The core layer includes a plurality of cavities penetrating through the core layer. The dielectric layer and the core layer are attached onto the package array such that the core layer is located between the dielectric layer and the package array. A plurality of first conductive patches is formed on the dielectric layer above the cavities.

Abstract: A nail gun with dry fire prevention device includes a gun body, a nail magazine connected with the gun body, a trigger device, and an action assembly. The nail magazine is configured to house at least a nail. The action assembly includes an action member fixed on an outer side of the nail magazine and an operation member pivotally disposed at the action member. The operation member has a first and second portions disposed on two ends of the operation member, respectively. When the nail magazine is empty of the nail, the first portion enters the nail magazine, and the second portion blocks the trigger member, such that the trigger member is unable to be operated. Therefore, the dry fire operation of the nail gun without nails is prevented, improving the convenience of usage and the utility of the nail gun.

Abstract: A method includes mounting a wafer on a chuck disposed within a chamber of an etching system, the wafer being encircled by a focus ring. While etching portions of the wafer, an etch direction is adjusted to a first desired etch direction by adjusting a vertical position of the focus ring relative to the wafer to a first desired vertical position. While etching portions of the wafer, the etch direction is adjusted to a second desired etch direction by adjusting the vertical position of the focus ring relative to the wafer to a second desired vertical position. The second desired vertical position is different from the first desired vertical position. The second desired etch direction is different from the first desired etch direction.

Abstract: Converter devices and methods are disclosed. A supply voltage (Vcc), for example to supply a control circuit (11) controlling a switch (Q1), is generated using an additional current path (16) and a snubber circuit (12).

Abstract: An illumination system includes a first light source providing a first color beam, a first beam-splitting element which disposes on a transmission path of the first color beam and separates the first color beam into a first sub-beam and a second sub-beam, an optical wavelength conversion element which receives the first sub-beam and converts the first sub-beam into a second color beam and reflects the second color beam back to the first beam-splitting element, a second light source providing a third color beam, and a second beam-splitting element which is located between the second light source and the first beam-splitting element to reflect the second sub-beam. The third color beam passes through the second beam-splitting element and is transmitted to the first beam-splitting element. The second sub-beam, the second color beam and the third color beam are combined into an illumination beam.

Abstract: An electrodeposited copper foil of high toughness having a lightness L* value of the deposit side in the range of 36 to 74, the copper foil having a tensile strength in the range of 40 to 70 kg/mm2, and a weight deviation of less than 3%. The electrodeposited copper foils are particularly useful as current collectors for anode components of rechargeable secondary batteries and tend not to form wrinkles during charge-discharge cycles of the battery and are resistant to fracture during pressing of the anode active materials onto the copper foil. Secondary batteries and methods of manufacture are also described.

Abstract: A physiological sensor device and system, and a correction method are provided. The physiological sensor device includes a physiological signal sensor, a first compensation sensor, and a signal processing device. The physiological signal sensor is attached to an object to be detected to sense a physiological signal value. The first compensation sensor is disposed on the physiological signal sensor. The signal processing device is coupled to the physiological signal sensor and the first compensation sensor. The signal processing device obtains through the first compensation sensor a failure region of the physiological signal sensor partially detached from the object to be detected and obtains a first failure compensation value according to the failure region, so as to compensate the physiological signal value sensed by the physiological signal sensor.

Abstract: A three-dimensional (3D) continuous color printer includes one or more cartridges each with a building material stored therein, a mixer coupled to each cartridge, and a single printhead coupled to a mixer output, wherein the building material stored in the cartridge is transported to the mixer and the single print head to form a continuous color object.