Abstract: A light source module configured to provide a light beam along a first direction is provided. The light source module includes first to third light source groups and first to fourth beam-combining devices, wherein each of a light exiting surface of the first light source group and a light exiting surface of the third light source group is not parallel to a light exiting surface of the second light source group. An emitted light of the first light source group is transmitted along the first direction after being reflected by the first and second beam-combining devices. An emitted light of the third light source group is transmitted along the first direction after being reflected by the third and fourth beam-combining devices. An emitted light of the second light source group is transmitted along the first direction and passes through the first and third beam-combining devices.

Abstract: Provided are an electrodeposited copper foil, a current collector, an electrode, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a deposited side and a drum side opposite the deposited side. In a first aspect, ?RS between the deposited side and the drum side is at most about 95 MPa, and the deposited side exhibits a Vv in a range from about 0.15 ?m3/?m2 to about 1.35 ?m3/?m2. In a second aspect, the deposited side has a Sku of about 1.5 to about 6.5 and the deposited side exhibits a Vv in a range from about 0.15 ?m3/?m2 to about 1.35 ?m3/?m2. The characteristics are beneficial to improve the quality of the electrodeposited copper foil, thereby extending the charge-discharge cycle life of a lithium-ion secondary battery comprising the same.

Abstract: An image mapping player includes an image mapping module for creating a mapping relation between each pixel of an image of a video to be mapped and each pixel of an image to be displayed and displaying the image according to the mapping relation, a brightness adjustment module for adjusting the brightness of the displayed image brightness, a controller selection module for selecting a controller type, a channel selection module for selecting a channel; a RB reverse selection module for selecting a color component R and a color component B whether or not applicable for reversing the image, a white light setting module, for selecting a white light mod, and a port brightness adjustment module for adjusting the brightness of a selected port. The invention also discloses a pixel debugging method by using the image mapping player.

Abstract: An electro-phoretic display apparatus including an electro-phoretic display panel and a driving circuit is provided. The electro-phoretic display panel includes a display area and a border area. The driving circuit is configured to drive the display area to display an image frame according to a first voltage. The driving circuit drives the border area to maintain displaying a border of a first color or a second color according to a second voltage. The driving circuit generates the second voltage according to the first voltage. The border area includes electro-phoretic particles of the first color or the second color. A voltage difference between the first voltage and the second voltage drives the electro-phoretic particles of the first color or the second color to be maintained to a predetermined position such that the border area maintains displaying the border of the first color or the second color.

Abstract: A method includes mounting a wafer on a chuck disposed within a chamber of an etching system, the wafer being encircled by a focus ring. While etching portions of the wafer, an etch direction is adjusted to a first desired etch direction by adjusting a vertical position of the focus ring relative to the wafer to a first desired vertical position. While etching portions of the wafer, the etch direction is adjusted to a second desired etch direction by adjusting the vertical position of the focus ring relative to the wafer to a second desired vertical position. The second desired vertical position is different from the first desired vertical position. The second desired etch direction is different from the first desired etch direction.

Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a chip package, a core dielectric layer disposed on the chip package, and an antenna pattern disposed on the core dielectric layer opposite to the chip package. The chip package includes a semiconductor chip, an insulating encapsulation encapsulating the semiconductor chip, and a redistribution structure electrically coupled to the semiconductor chip. The redistribution structure includes a first circuit pattern located at an outermost side of the chip package, and a patterned dielectric layer disposed between the first circuit pattern and the insulating encapsulation. The core dielectric layer is in contact with the first circuit pattern. The core dielectric layer and the patterned dielectric layer are of different materials. The antenna pattern is electrically coupled to the chip package.

Abstract: Provided are an electrolytic copper foil, an electrode, and a lithium-ion cell. The electrolytic copper foil comprising copper and chloride is analyzed by TOF-SIMS along its thickness direction to obtain a spectrum of a relative depth ratio as X-axis and a relative intensity of chloride versus copper as Y-axis. There is a chloride peak located between 20% and 80% of the relative depth ratio in the spectrum, and the chloride peak is characterized by a maximum relative intensity of chloride versus copper ranging from 0.77% to 5.13% and a full width at half maximum ranging from 2.31% to 5.78%. With above characteristics, the electrolytic copper foil has low density of copper particles, low degree of warpage, and good coating uniformity of the active material applied thereon, thereby optimizing the efficiency of a lithium-ion cell comprising the electrolytic copper foil.

Abstract: An image mapping player includes an image mapping module for creating a mapping relation between each pixel of an image of a video to be mapped and each pixel of an image to be displayed and displaying the image according to the mapping relation, a brightness adjustment module for adjusting the brightness of the displayed image brightness, a controller selection module for selecting a controller type, a channel selection module for selecting a channel; a RB reverse selection module for selecting a color component R and a color component B whether or not applicable for reversing the image, a white light setting module, for selecting a white light mod, and a port brightness adjustment module for adjusting the brightness of a selected port. The invention also discloses a pixel debugging method by using the image mapping player.

Abstract: A light source module used in a projection device comprises a plurality of laser emitting elements and a light adjusting device. The laser emitting elements are configured to emit excitation beams. Each excitation beam is received by an optical system of the projection device to emit sub-beams. The light adjusting device comprises a plurality of light adjusting elements. The excitation beams penetrate through the light adjusting device and are output as output beams to be converted into illumination beams by the optical system. The light adjusting elements are disposed corresponding to at least some of the laser emitting elements with reference to the sub-beam light intensity distributions, so that the illumination beam light intensity distributions conform to a preset light intensity distribution. Furthermore, a projection device is provided and comprises at least one light source module, an optical system, at least one light valve and a projection lens.

Abstract: A circuit for touch sensing includes a driving unit, a self-capacitive sensor circuit, a mutual-capacitive sensor circuit and a control circuit. The driving is configured to generate a driving signal. The self-capacitive sensor circuit is configured to generate a self-capacitance sensing result. The mutual-capacitive sensor circuit is configured to receive the driving signal in order to generate a mutual-capacitance sensing result when the voltage of a node between the self-capacitive sensor circuit and the mutual-capacitive sensor circuit reaches a reference voltage. The control circuit receives and computes the self-capacitance sensing result and the mutual-capacitance sensing result in order to generate a sensing result. By utilizing the circuit for touch sensing of present disclosure, the accuracy and the efficiency of touch sensing can be enhanced.

Abstract: Provided are an electrolytic copper foil, an electrode, and a lithium-ion cell. The electrolytic copper foil comprising copper and chloride is analyzed by TOF-SIMS along its thickness direction to obtain a spectrum of a relative depth ratio as X-axis and a relative intensity of chloride versus copper as Y-axis. There is a chloride peak located between 20% and 80% of the relative depth ratio in the spectrum, and the chloride peak is characterized by a maximum relative intensity of chloride versus copper ranging from 0.77% to 5.13% and a full width at half maximum ranging from 2.31% to 5.78%. With above characteristics, the electrolytic copper foil has low density of copper particles, low degree of warpage, and good coating uniformity of the active material applied thereon, thereby optimizing the efficiency of a lithium-ion cell comprising the electrolytic copper foil.

Abstract: A positionable probe card includes a space transformer, a plurality of positioning pins, and a probe head. The space transformer includes a space transforming substrate, the space transforming substrate includes a plurality of apertures, and the positioning pins are respectively fixed in the apertures. The probe head includes a plurality of positioning holes, and the positioning pins are respectively inserted into corresponding positioning holes. In addition, a method of manufacturing a positionable probe card is also disclosed herein.

Abstract: A semiconductor device includes a magnetic random access memory (MRAM). The MRAM comprises a plurality of MRAM cells including a first type MRAM cell and a second type MRAM cell. Each of the plurality of MRAM cells includes a magnetic tunneling junction (MTJ) layer including a pinned magnetic layer, a tunneling barrier layer and a free magnetic layer. A size of the MTJ film stack of the first type MRAM cell is different from a size of the MTJ film stack of the second type MRAM cell. In one or more of the foregoing and following embodiments, a width of the MTJ film stack of the first type MRAM cell is different from a width of the MTJ film stack of the second type MRAM cell.

Abstract: The present disclosure relates to a semiconductor device and a manufacturing method, and more particularly to a semiconductor device having reduced trench loading effect. The present disclosure provides a novel multi-layer cap film incorporating one or more oxygen-based layers for reducing trench loading effects in semiconductor devices. The multi-layer cap film can be made of a metal hard mask layer and one or more oxygen-based layers. The metal hard mask layer can be formed of titanium nitride (TiN). The oxygen-based layer can be formed of tetraethyl orthosilicate (TEOS).

Abstract: An impact resistant structure for an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, a thickness of the resistance stack layer is less than 10 ?m, and a Young's modulus of the resistance stack layer is between 40 GPa and 150 GPa. The damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.

Abstract: An interconnect structure and a method of forming are provided. The method includes forming an opening in a dielectric layer and an etch stop layer, wherein the opening extends only partially through the etch stop layer. The method also includes creating a vacuum environment around the device. After creating the vacuum environment around the device, the method includes etching through the etch stop layer to extend the opening and expose a first conductive feature. The method also includes forming a second conductive feature in the opening.

Abstract: Electrodeposited copper foils are described having improved thermal properties. The copper foils include a drum side and deposited side where both sides have a roughness Rz lower than 2 ?m and wherein, when the electrodeposited copper foil is subjected to a thermal gravimetric analysis (TGA), the electrodeposited copper foil exhibits a primary weight increase of 105 wt. % when a primary temperature (T105 wt %) is reached during the TGA, wherein the T105 wt % is in a range of 350° C. to 501° C. The TGA characterization comprises heating at a rate of 5° C./min and an air flow at a rate of 95 mL/min. Ultrasonic welding of the copper foils to nickel foils provides an excellent weld with low detachment providing a good mechanical and electrical contact for applications such as in lithium-ion secondary batteries.

Abstract: A dielectric layer is formed over a substrate, an anti-reflective layer is formed over the dielectric layer, and a first hardmask is formed over the anti-reflective layer. A via opening and a trench opening are formed within the dielectric layer using the anti-reflective layer and the first hardmask as masking materials. After the formation of the trench opening and the via opening, the first hardmask is removed. An interconnect is formed within the openings, and the interconnect has a via with a profile angle of between about 70° and about 80° and a depth ratio of between about 65% and about 70%.