Abstract: Optical devices and methods of manufacture are presented herein. In an embodiment, an optical device is provided that includes an optical package having a first surface and a second surface opposite the first surface, a laser die package having a third surface and a fourth surface opposite the third surface, wherein the first surface is planar with the third surface and the second surface is planar with the fourth surface, a first silicon support attached to both the second surface and the fourth surface, and an interposer attached to both the first surface and the third surface, wherein the interposer is free of a silicon substrate.

Abstract: A liquid crystal display (LCD) of the chiral polymer stabilized alignment (C-PSA) mode, a method of its production and its use as an energy-saving display.

Abstract: A semiconductor structure includes a first source/drain (S/D) epitaxial feature, a second S/D epitaxial feature adjacent to the first S/D epitaxial feature, an insulating structure between the first and the second S/D epitaxial features, and a shared S/D contact over top surfaces of the first and the second S/D epitaxial features. A center portion of the shared S/D contact is directly between a side surface of the first S/D epitaxial feature and a side surface of the second S/D epitaxial feature. The center portion is directly above the insulating structure. The semiconductor structure further includes a backside via penetrating through the insulating structure to directly land on a bottom surface of the center portion.

Abstract: An electrical discharge machine capable of providing a dielectric droplet and negative pressure suction, driving the dielectric droplet to flow between the EDM tool and the workpiece, allowing the EDM tool to perform nearly-dry electrical discharge machining on the workpiece through the dielectric droplet exerted from the droplet processing cavity. Additionally, the electrical discharge machine can utilize the negative pressure suction to drive debris away from the workpiece through the EDM tool, thereby enhancing debris removal efficiency, preventing the unstable discharge due to accumulation of debris on the workpiece, thereby improving electrical discharge machining efficiency and ensuring that the surface roughness, morphology, and dimensional accuracy of the machined areas of the workpiece meet the expected standards.

Abstract: The invention refers to a light-transmissive plastic plate structure suitable for vehicle sunroof with curved surface and a method for fabricating the same. By using polymer material formulation, UV resistant coating formulation and precision coating technology, the wear resistance of polymer surface of plastic substrate can be improved to the same level as glass, and the original optical and physical properties after various environmental tests can also be maintained. The plastic substrate is first formed into a curved plastic plate through a hot pressing process, and then a connecting structure is formed and fixed on the plastic plate by an insert-molding injection process, in order to replace the traditional car sunroof mechanism which is assembled by glass plate bonded with metal connecting parts.

Abstract: Optical devices and methods of manufacture are presented in which a resonant ring is incorporated with a optical device on an interposer substrate. The material for the resonant ring may be a material that can trigger second order non-linearity in received light or a material that can trigger third order non-linearity without electrical driving mechanisms.

Abstract: The present disclosure provides embodiments of electronic fuse devices. An electronic fuse device according to the present disclosure includes a first bit cell comprising a first plurality of active regions extending along a first direction and a second bit cell comprising a second plurality of active regions extending along the first direction. Each of the first plurality of active regions is aligned with one of the second plurality of active regions along the first direction. The first bit cell and the second bit cell are spaced apart along the first direction by a space and the space is free of a well tap cell.

Abstract: A method for processing a curved plastic panel is to first form a hard coating layer, an optical function layer, and a printing layer on a flat plastic substrate, and then cut it into a predetermined shape, and then use a hot pressing and curving device to perform a hot pressing and curving process to the flat plastic substrate in order to make it becoming a curved plastic substrate. The hot pressing and curving device can simultaneously perform hot pressing during the heating process, and has the functions of real-time monitoring of the local temperature and the local curvature forming state, and then feedback to the local heating and curvature forming mechanism for adjustments. The monitoring of temperature and curvature can be divided into multiple stages, which can be monitored stage by stage and adjusted for heating or curvature forming to improve production yield.

Abstract: The present disclosure provides an integrated circuit (IC) structure that includes a semiconductor substrate having a frontside and a backside; a shallow trench isolation (STI) structure formed in the semiconductor substrate and defining an active region, wherein the STI structure includes a STI bottom surface, wherein the semiconductor substrate includes a substrate bottom surface, and wherein the STI bottom surface and the substrate bottom surface are coplanar; a field-effect transistor (FET) over the active region and formed on the frontside of the semiconductor substrate; and a backside dielectric layer disposed on the substrate bottom surface and the STI bottom surface.

Abstract: An integrated circuit (IC) device has a memory region in which a plurality of memory cells is implemented. Each of the memory cells has a first dimension in a first horizontal direction. The IC device includes an edge region bordering the memory cell region in the first horizontal direction. The edge region has a second dimension in the first horizontal direction. The second dimension is less than or equal to about 4 times the first dimension. The IC device is formed by revising a first IC layout to generate a second IC layout. The second IC layout is generated by shrinking a dimension of the edge region in the first horizontal direction.

Abstract: The present disclosure provides an IC structure that includes a semiconductor substrate having a SRAM region, an input/output and peripheral (IOP) region, and an edge region spanning tween the SRAM region and the IOP region; a STI structure formed on the semiconductor substrate and defining active regions; a SRAM cell formed within the SRAM region; and a backside dielectric layer disposed on a backside of the semiconductor substrate and landing on a bottom surface of the STI structure. The active regions are longitudinally oriented along a first direction; gates are formed on the semiconductor substrate and are evenly distributed with a pitch P along the first direction; the SRAM cell spans a first dimension Ds along the first direction; the edge region spans a second dimension De along the first direction; and a ratio De/Ds equals to 2 or is less than 2.

Abstract: A semiconductor structure includes a capacitor structure and a contact structure. The capacitor structure includes an electrode layer, a protective dielectric layer, and a capacitor dielectric layer. The protective dielectric layer covers a top surface of the electrode layer. The capacitor dielectric layer is on the protective oxide layer. The contact structure penetrates the protective oxide layer and electrically connects to the electrode layer.

Abstract: A method comprises forming a first fin including alternating first channel layers and first sacrificial layers and a second fin including alternating second channel layers and second sacrificial layers, forming a capping layer over the first and the second fin, forming a dummy gate stack over the capping layer, forming source/drain (S/D) features in the first and the second fin, removing the dummy gate stack to form a gate trench, removing the first sacrificial layers and the capping layer over the first fin to form first gaps, removing the capping layer over the second fin and portions of the second sacrificial layers to from second gaps, where remaining portions of the second sacrificial layers and the capping layers form a threshold voltage (Vt) modulation layer, and forming a metal gate stack in the gate trench, the first gaps, and the second gaps.

Abstract: A parallel multiple-port system is provided, including a plurality of ports, a plurality of processors, and a memory storing software code which, when executed by the plurality of processors causes the processors to control the plurality of ports. A first processor is configured to control a first port. A second processor is configured to control a second port. The software code includes a common software code portion relevant to the plurality of ports and for execution by the plurality of processors. The software code further includes a port specific code portion including first configuration data for the first port and for execution by the first processor, and second configuration data for the second port and for execution by the second processor. The present application can advantageously be applied to parallel multi-port charging systems.

Abstract: A light-guide sunroof assembly comprises a plastic substrate and a light source module furnished besides the plastic substrate. An outer layer of the plastic substrate is added with dye to form a colored background. A plurality of light-guide microstructures is furnished on the plastic substrate to guide the light generated by the light source module toward an inner surface of the plastic substrate. Thereby, the light generated by the light source module is guided by the plastic substrate and then ejects out of the inner surface of plastic substrate, so as to provide a light decoration or lighting effect that enriches the visual experience. Moreover, the plastic substrate is first formed into a curved plastic plate through a hot pressing process, and then a connecting structure is formed and fixed on the plastic plate by an insert-molding injection process, in order to replace the traditional car sunroof mechanism which is assembled by glass plate bonded with metal connecting parts.

Abstract: An intraoral phototherapy device includes a transparent shell, a supporting board, and a flexible circuit board. The transparent shell includes a bite portion and a light portion. The bite portion is mounted on a light surface of the light portion. The supporting board is mounted in the light portion. The flexible circuit board is mounted on the supporting board, and includes at least one light emitting unit. The at least one light emitting unit emits a light having wavelength of 600-1000 nanometer (nm) toward the light surface. When a user bites the bite portion of the transparent shell, the light emitted by the at least one light emitting unit emits to a gum of the user. Therefore, the intraoral phototherapy device can stimulate an affected part of a gingivitis through a photobiomodulation therapy to achieve an effect of anti-inflammation or alleviating pain.

Abstract: The current disclosure is directed to a SRAM bit cell having a reduced coupling capacitance. In a vertical direction, a wordline “WL” and a bitline “BL” of the SRAM cell are stacked further away from one another to reduce the coupling capacitance between the WL and the BL. In an embodiment, the WL is vertically spaced apart from the BL with one or more metallization level that none of the WL or the BL is formed from. Connection island structures or jumper structures are provided to connect the upper one of the WL or the BL to the transistors of the SRAM cell.

Abstract: A photonic assembly includes: a composite die including a photonic integrated circuits (PIC) die and an electronic integrated circuits (EIC) die, the PIC die including waveguides and photonic devices therein, and the EIC die including semiconductor devices therein; an optical connector unit including a first connector-side mirror reflector and a first transition edge coupler and attached to a top surface of the composite die, wherein the first connector-side mirror reflector is configured to change a beam direction between a vertically-extending beam path through the composite die and a horizontally-extending beam path through the first transition edge coupler; and a fiber array units assembly attached to a sidewall of the optical connector unit.

Abstract: A composition and a material prepared from the composition are provided.

Abstract: An optical imaging system includes four lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element and a fourth lens element. Each of the four lens elements of the optical imaging system has an object-side surface facing toward the object side and an image-side surface facing toward the image side. The object-side surface of the first lens element is concave in a paraxial region thereof, and the image-side surface of the first lens element is convex in a paraxial region thereof. The object-side surface of the fourth lens element is convex in a paraxial region thereof, the image-side surface of the fourth lens element is concave in a paraxial region thereof, and the image-side surface of the fourth lens element has at least one convex shape in an off-axis region thereof.