Abstract: Various embodiments of the present disclosure are directed towards a semiconductor processing system including an overlay (OVL) shift measurement device. The OVL shift measurement device is configured to determine an OVL shift between a first wafer and a second wafer, where the second wafer overlies the first wafer. A photolithography device is configured to perform one or more photolithography processes on the second wafer. A controller is configured to perform an alignment process on the photolithography device according to the determined OVL shift. The photolithography device performs the one or more photolithography processes based on the OVL shift.

Abstract: A system and method for maximizing bandwidth in an uplink for a 5G communication system is disclosed. Multiple end devices generate image streams. A gateway is coupled to the end devices. The gateway includes a gateway monitor agent collecting utilization rate data of the gateway and an image inspector collecting inspection data from the received image streams. An edge server is coupled to the gateway. The edge server includes an edge server monitor agent collecting utilization rate data of the edge server. An analytics manager is coupled to the gateway and the edge server. The analytics manager is configured to determine an allocation strategy based on the collected utilization rate data from the gateway and the edge server.

Abstract: A matte film for hot pressing and a manufacturing method thereof are provided. The manufacturing method includes steps of forming at least one polyester composition into an unstretched polyester thick film and stretching the unstretched polyester thick film in a machine direction (MD) and a transverse direction (TD). The polyester composition includes 81% to 97.9497% by weight of a polyester resin, 0.02% to 2% by weight of an antioxidative ingredient, 0.0003% to 1% by weight of a nucleating agent, 0.01% to 2% by weight of a flow aid, 0.01% to 2% by weight of a polyester modifier, 0.01% to 2% by weight of an inorganic filler, and 2% to 10% by weight of silica particles. The polyester resin has an intrinsic viscosity between 0.60 dl/g and 0.80 dl/g.

Abstract: A semiconductor device includes a first source/drain feature on a front side of a substrate. The device includes a first backside metal line under the first source/drain feature and extending lengthwise along a first direction. The device includes a first backside via disposed between the first source/drain feature and the first backside metal line. The first backside metal line is a first bit line of a first static random access memory (SRAM) cell and is connected to the first source/drain feature through the first backside via. The first backside metal line includes a first portion and a second portion each extending widthwise along a second direction perpendicular to the first direction, the first portion is wider than the second portion, and the first portion partially lands on the first backside via. The first and the second portions are substantially aligned on one side along the first direction.

Abstract: An assembly is provided for an aircraft propulsion system. This assembly includes an engine core, a bypass duct and a bleed circuit. The engine core includes a compressor section, a combustor section, a turbine section and a core flowpath extending sequentially through the compressor section, the combustor section and the turbine section. The bypass duct includes a bypass flowpath outside of the engine core. The bleed circuit includes a bleed passage and a flow regulator. The bleed circuit is configured to direct bypass gas through the bleed passage from the bypass flowpath into the core flowpath when the flow regulator is in an open position. The bleed circuit is configured to cutoff gas flow through the bleed passage between the bypass flowpath and the core flowpath when the flow regulator is in a closed position.

Abstract: A method for manufacturing a semiconductor device structure includes forming a first metallization line and a second metallization line extending along a first direction; forming a first isolation feature and a second isolation feature between the first metallization line and the second metallization line, wherein the first metallization line, the second metallization line, the first isolation feature and the second isolation feature define an aperture; forming a profile modifier within the aperture, wherein the profile modifier comprises a plurality of segments spaced apart from each other, wherein each of the segments are located at corners of the aperture; and forming a contact feature surrounded by the plurality of segments.

Abstract: The present invention includes a shell, a light emitter, a beam splitter, a convergent lens, an optical filter, a collimation unit, a discrete light detection unit, and a processing unit. The shell includes a sample well to contain a sample. The light emitter generates a detection beam towards the beam splitter, the detection beam is reflected by the beam splitter before being converged by the convergent lens onto the sample, and a Raman scattered beam is scattered from the sample. The Raman scattered beam respectively passes through the convergent lens, the beam splitter, the optical filter, and the collimation unit, allowing the collimation unit to collimate the Raman scattered beam into a collimated beam. The discrete light detection unit generates multiple light intensity signals according to the collimated beam received, and the processing unit generates a detection result according to the light intensity signals to help detect toxins.

Abstract: A pairing method is adapted for a first bicycle assembly and a second bicycle assembly. The pairing method includes driving the first bicycle assembly to perform a self-check procedure and determining whether the first bicycle assembly passes the self-check procedure. If yes, completing pairing between the first bicycle assembly and the second bicycle assembly. If no, not completing pairing between the first bicycle assembly and the second bicycle assembly.

Abstract: A light emitting device and a keyboard structure are provided. The light emitting device includes a circuit board and multiple light emitting units. The circuit board includes a substrate, a first conductive pad, multiple second conductive pads, and multiple third conductive pads. The first conductive pad and the second conductive pads are disposed on a first board surface of the substrate. The first conductive pad has a symmetrical shape and a symmetrical axis. The symmetrical axis passes through the second conductive pads. The third conductive pads are disposed on a second board surface of the substrate. Each of the third conductive pads is electrically coupled to the first conductive pad and the second conductive pads by multiple conductive columns. Each of the light emitting units is connected to the first conductive pad and one of the second conductive pads.

Abstract: The invention discloses a glycosuria measurement device, comprising a prism body and a housing. The prism body comprises a first accommodating space, a junction surface, a first light penetrating surface, a second light penetrating surface, a third light penetrating surface and a light-emitting surface. The first accommodating space accommodates urine. The junction surface is formed at a bottom surface of the first accommodating space. The first light penetrating surface is formed at the first lateral surface of the first accommodating space. The second light penetrating surface is formed at the second lateral surface of the first accommodating space. The third light penetrating surface is disposed opposite to the junction surface. The light-emitting surface is disposed opposite to the junction surface. The housing comprises a second accommodating space, a first light-emitting port and a second light-emitting port. The second accommodating space accommodates the prism body.

Abstract: A photographing optical lens assembly includes five lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element has positive refractive power. The second lens element has negative refractive power. When specific conditions are satisfied, the requirements of compact size and high image quality can be met by the photographing optical lens assembly, simultaneously.

Abstract: A touch sensor includes a substrate, sensing channels, and a protective layer. The sensing channels are disposed at intervals on a surface of the substrate, and any one of the sensing channels includes an electrode portion and a silver trace portion electrically connected to the electrode portion. The protective layer is disposed on the substrate and covers and encapsulates the sensing channels. After the touch sensor is subjected to a salt spray test with sodium chloride solution of a mass percentage concentration of 5% at a rate of 1 mL/H to 2 mL/H under an ambient temperature of 35° C. for 48 hours, a resistance change rate of any one of the sensing channels is less than or equal to 10%, and a resistance distribution difference between the sensing channels is less than or equal to 10%.

Abstract: An imaging system lens assembly includes six lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. Each of the six lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. The first lens element has positive refractive power. The image-side surface of the fifth lens element is convex in a paraxial region thereof. The image-side surface of the sixth lens element is concave in a paraxial region thereof, and the image-side surface of the sixth lens element has at least one inflection point.

Abstract: A metal-insulator-metal (MIM) capacitor and methods of forming the same are described. In some embodiments, the method includes forming an opening having a first depth in one or more dielectric layers, depositing a layer in the opening and on the one or more dielectric layers, performing an anisotropic etch process to remove portions of the layer formed on horizontal surfaces, extending the opening to a second depth in the one or more dielectric layers, removing the layer, extending the opening to a third depth in the one or more dielectric layers, and forming a MIM capacitor in the opening.

Abstract: Various embodiments of the present disclosure are directed towards a semiconductor device including a dielectric structure disposed on a first substrate. An edge coupler is disposed within the dielectric structure and comprises a plurality of optical core segments. A deflector structure is disposed within the dielectric structure and is laterally adjacent to the edge coupler. The deflector structure is configured to redirect an optical signal traveling along a first direction to a second direction towards the edge coupler.

Abstract: A semiconductor device structure and method for manufacturing the same are provided. The semiconductor device structure includes a first metallization line, a second metallization line, a first isolation feature, a second isolation feature, a profile modifier, and a contact feature. The first metallization line and the second metallization line extend along a first direction. The first isolation feature and the second isolation feature are disposed between the first metallization line and the second metallization line. The first metallization line, the second metallization line, the first isolation feature and the second isolation feature define an aperture. The profile modifier is disposed within the aperture to modify a profile of the aperture in a plan view. The contact feature is disposed within the aperture.

Abstract: An optical testing device has a beam splitting element, a glowing unit, a first sensor, and a second sensor. The beam splitting element has a first side and a second side. The glowing unit and the second sensor are disposed at the second side. The first sensor is disposed at the first side. The beam splitting element is capable of splitting the beam emitted from the glowing unit into a testing beam and a reflection beam. The testing beam penetrates the beam splitting element and is received by the first sensor. The reflection beam is reflected by the beam splitting element and is received by the second sensor. Therefore, the change of light intensity of the light source can be monitored, and thus the processing unit is allowed to correct the calculations on the basis of the change of light intensity of the light source.

Abstract: An optical imaging system includes four lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element and a fourth lens element. Each of the four lens elements of the optical imaging system has an object-side surface facing toward the object side and an image-side surface facing toward the image side. The object-side surface of the first lens element is concave in a paraxial region thereof, and the image-side surface of the first lens element is convex in a paraxial region thereof. The object-side surface of the fourth lens element is convex in a paraxial region thereof, the image-side surface of the fourth lens element is concave in a paraxial region thereof, and the image-side surface of the fourth lens element has at least one convex shape in an off-axis region thereof.

Abstract: The present invention provides an external module including a housing and an electronic component. One surface of the housing is provided with a through hole. The electronic component is disposed in the housing and includes a first connector, wherein the first connector is floatingly arranged in the housing and is exposed in the through hole.

Abstract: An imaging optical lens system includes a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, a seventh lens element and an eighth lens element, in order from an object side to an image side along an optical path. The first lens element has an object-side surface being concave in a paraxial region thereof. The fourth lens element has negative refractive power. The fifth lens element has positive refractive power. At least one lens surface of at least one lens element of the imaging optical lens system has at least one critical point in an off-axis region thereof.