Abstract: The partitioning method for a working space of a robot includes defining the working space of the robot; setting a plurality of partitioning planes based on at least three non-collinear points in the working space; if the setting of the plurality of partitioning planes is completed, defining partitioning lines by intersecting the plurality of partitioning planes; dividing the plurality of partitioning planes into a plurality of designated sections and a plurality of extended sections based on the partitioning lines; combining the plurality of designated sections for constructing a full partitioning plane; partitioning the working space into two working regions based on the full partitioning plane; and setting the working region containing an origin of the robot as an operation region. Therefore, the partitioning process can be simplified.

Abstract: A polarizer substrate and manufacturing method thereof are provided. The polarizer substrate includes a substrate, a plurality of polarizer structures, a plurality of barrier structures, and a passivation layer. The polarizer structures are disposed on the substrate. Each of the polarizer structures includes a wire-grid and a capping structure disposed on the wire-grid. The barrier structures are disposed on the capping structures and not contacting with the side walls of the wire-grids. A gap between two adjacent barrier structures is smaller than a gap between two adjacent wire-grids. The passivation layer is disposed on the barrier structures.

Abstract: A photographing optical system includes five lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. Each of the five lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. The second lens element has negative refractive power. The fifth lens element has negative refractive power. At least one of the five lens elements has at least one aspheric surface having at least one inflection point.

Abstract: A quick release connecting device includes an actuating retainer and a fixing member movably assembled to the actuating retainer. The fixing member includes a pivot portion and a pivot member movably mounted to the pivot portion; and the pivot member is coupled with a second object. The fixing member includes a limiting section and the pivot member includes a corresponding limiting section, such that the limiting section and the corresponding limiting section limit or stop each other at a specific location when the fixing member is moved or rotated. With these arrangements, the quick release connecting device can be applied to conveniently and repeatedly connect and separate a circuit board, a drawer, or a window to and from a corresponding rack, chassis, cabinet or window frame.

Abstract: A pull-out aiding device is configured for mounting on an object, in which a corresponding apparatus is mounted. The pull-out aiding device includes a pulling member and a handle member. The pulling member includes a first pivot section and an abutting section for abutting against the corresponding apparatus to move the latter forward. The handle member includes a second pivot section and an operating section. The second pivot section is pivotally connected to the first pivot section, such that the handle member is turnable about the second pivot section relative to the pulling member and brings the latter to move forward.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes an image sensing element disposed within a semiconductor substrate. One or more isolation structures are arranged within one or more trenches disposed along a first surface of the semiconductor substrate. The one or more isolation structures are separated from opposing sides of the image sensing element by non-zero distances. The one or more trenches are defined by sidewalls and a horizontally extending surface of the semiconductor substrate. A doped region is laterally arranged between the sidewalls of the semiconductor substrate defining the one or more trenches and is vertically arranged between the image sensing element and the first surface of the semiconductor substrate.

Abstract: A panel to be plated is provided. The panel includes a substrate and an electric field compensation structure. The substrate includes a plurality of units to be plated each including a first pattern to be plated. The electric field compensation structure is disposed on the substrate. The electric field compensation structure includes a second pattern to be plated surrounding at least one of the units to be plated. A ratio of an area of the first pattern to be plated of the units to be plated to an area of the second pattern to be plated of the electric field compensation structure is in a range from 1:0.07 to 1:0.3.

Abstract: A method for soldering the soldering fastening element to a circuit board is introduced. The soldering fastening element is soldered to a first circuit board so as for a second board to be coupled thereto. The soldering fastening element includes a body soldered to the first circuit board, a head for fastening the second board in place, and a neck which connects the body and the head. When in use, the soldering fastening element is contained in a carrier, taken out of the carrier with an automated tool, transferred to the first circuit board, and heated through a solder layer on the first circuit board such that the body gets soldered to the first circuit board to form a module member. Therefore, the second board gets coupled to the first circuit board through the head and neck.

Abstract: A pull handle structure includes a carrier mounted on a first object, a pull handle movably assembled to the carrier, and a limiting section located on the pull handle for connecting to, interfering with or engaging with a second object, or the limiting section connects to, interferes with or engages with the carrier, wherein the carrier loads the pull handle by folding. By operating the pull handle to move the carrier, the first object can be engaged with or separated from the second object. Therefore, the pull handle structure has the advantages of being securely lockable in place and operable in an easy, convenient, effortless and quick manner.

Abstract: An imaging optical lens assembly includes four lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element and a fourth lens element. Each of the four lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. At least one of all lens surfaces of the four lens elements is aspheric and has at least one inflection point.

Abstract: A photo diode includes a pixel unit, a photo conversion layer, and a dielectric layer. The pixel unit includes a pair of pixels. The photo conversion layer is above the pixel unit and has a pair of portions, each of which corresponds to a respective one of the pixels. The dielectric layer is between the portions of the photo conversion layer. A method of manufacturing the photo diode is also disclosed.

Abstract: A fittable and releasable fastener includes a head which has a fitted and released portion and a fastening portion; and a fitting and releasing piece which has a fitting and releasing portion. Accordingly, when the fitting and releasing portion fits to the fitted and released portion, an external turning force is applied to the fitting and releasing piece or the head to make the fastening portion combine with at least one object. After the fastening portion is combined with the object, the fitting and releasing portion would release the fitted and released portion to limit the force or the force interval applied on the fastening portion for preventing excessively locking if the force is continuously applied.

Abstract: A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration.

Abstract: A circuit structure includes a semiconductor substrate having a top surface. A dielectric material extends from the top surface into the semiconductor substrate. A high-k dielectric layer is formed of a high-k dielectric material, wherein the high-k dielectric layer comprises a first portion on a sidewall of the dielectric material, and a second portion underlying the dielectric material.

Abstract: The present disclosure, in some embodiments, relates to a method of forming an image sensor. The method includes implanting a dopant into a substrate to form a doped region and implanting one or more additional dopants into the substrate to form an image sensing element between the doped region and a front-side of the substrate. The doped region directly contacts a boundary of the image sensing element that is furthest from the front-side of the substrate. The method further includes etching the substrate to form one or more trenches extending into a back-side of the substrate. The back-side of the substrate opposes the front-side of the substrate. The method further includes filling the one or more trenches with one or more dielectric materials to form isolation structures.

Abstract: A position-limiting device includes a position-limiting element and a body. The position-limiting element has a position-limiting portion and a blocking portion. The body has a corresponding blocking portion and a fitting portion. The blocking portion of the position-limiting element and the corresponding blocking portion of the body block each other such that the position-limiting element and the body are fitted together. The fitting portion is fitted to an object. The position-limiting element penetrates a position-limited component before being rotated to block or position-limit the position-limited component. Therefore, the body is fitted to the object, and the position-limiting element is rotated to position-limit or move away from the position-limited component, so as to couple together and separate the object and the position-limited component, thereby allowing two objects to be coupled together and separated repeatedly and rapidly.

Abstract: A roller structure and a manufacturing method thereof are introduced. The roller structure includes a roller rotatable about an axial portion, an end of a bush is fixed to an end of the axial portion, and another end of the bush having an engaging portion coupled to a load, a first stop portion disposed at another end of the axial portion and the bush has a second stop portion positioned opposite to the first stop portion such that the roller rotates between the first stop portion and the second stop portion; wherein the engaging portion of the bush has a feeding space that receives a material of the load to couple the engaging portion to the load. Hence, the roller structure and the manufacturing method thereof provide a modularized roller structure for carrying a load, effectuate modularized assembly and production, enhance assembly efficiency, attain structural streamlining, and cut costs.

Abstract: A shock-absorbing device includes a first holding member, a second holding member movably assembled to the first holding member, and an elastic element disposed between the first and the second holding member with two ends of the elastic element pressing against the two holding members. With the elastic element, an elastic shock-absorbing space is defined between the first and the second holding member.

Abstract: A roller structure includes a roller having an axial hole and an axle portion disposed in the axial hole to allow the roller to rotate about the axle portion; a sleeve with an end disposed at an end of the axle portion and another end having a fitting portion, the fitting portion being fitted to a carried object, the sleeve has a first blocking portion positioned proximate to a side of the roller to allow the roller to rotate between the first blocking portion and the fitting portion, wherein one of the axle portion, the axial hole and the first blocking portion has a substance conducive to reduction of friction between the roller and the sleeve. A method of manufacturing the roller structure is further introduced.

Abstract: A system in package structure and an electrostatic discharge protection structure thereof are provided. The electrostatic discharge protection structure includes a redistribution layer and a first transistor array. The redistribution layer has a first electrode and a second electrode. The first transistor array is coupled to a pin end of at least one integrated circuit, the first electrode and the second electrode. The first transistor array has a plurality of transistors. A plurality of first transistors of the transistors are coupled in parallel, and a plurality of second transistors of the transistors are coupled in parallel. The first transistors and the second transistors are configured to be turned on for dissipating an electrostatic discharge current.