Patents by Inventor Jui Wang

Jui Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190154067
    Abstract: A lateral positioning device coupled to a first object to laterally engage or interfere with a second object. The lateral positioning device includes a body portion and positioning element. The body portion is coupled to the first object in a first direction and has a through hole which has therein a limiting portion and extends in a second direction, with an angle formed between the first and second directions. The positioning element is penetratingly disposed in the through hole and limited by the limiting portion to thereby move in the second direction. The positioning element has an engaging portion disposed on the first side of the limiting portion to allow the engaging portion to engage with the second object; a stopping portion disposed on the second side of the limiting portion; and a neck portion connecting with the engaging and stopping portions and passing through the limiting portion.
    Type: Application
    Filed: January 18, 2019
    Publication date: May 23, 2019
    Inventor: TING-JUI WANG
  • Publication number: 20190146186
    Abstract: An optical imaging lens assembly includes five lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element has an image-side surface being concave in a paraxial region thereof. The second lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof. The third lens element with positive refractive power has an image-side surface being convex in a paraxial region thereof. The fourth lens element has positive refractive power. The fifth lens element has negative refractive power.
    Type: Application
    Filed: April 12, 2018
    Publication date: May 16, 2019
    Applicant: LARGAN PRECISION CO.,LTD.
    Inventors: Cheng-Yuan LIAO, Shu-Yun YANG, Kuo-Jui WANG
  • Publication number: 20190147915
    Abstract: A vibration-proof fastener post structure includes a body portion having a first end integrally formed with or assembled to a first object; a fastening head portion movably mounted to a second end of the body portion and having a neck portion, which is movably disposed in the body portion for moving in a slideway hole of a second object; and an elastic element movably fitted around the neck portion to push against the body portion. The fastening head portion and the body portion are configured for engaging with and fastening to the slideway hole of the second object. The second object is slidably relative to the neck portion. When the second object is slid to a predetermined position, the fastening head portion and the elastic element, the body portion or the pushing member will engage with the slideway hole of the second object to achieve a vibration-proof fastening effect.
    Type: Application
    Filed: November 15, 2017
    Publication date: May 16, 2019
    Inventor: TING-JUI WANG
  • Publication number: 20190140112
    Abstract: A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration.
    Type: Application
    Filed: December 17, 2018
    Publication date: May 9, 2019
    Inventors: Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu, Cheng San Chou, Jung-Kuo Tu, Cheng-Chieh Hsieh
  • Publication number: 20190140106
    Abstract: A thin film transistor including a flexible substrate, a semiconductor layer, a first gate, and a first gate dielectric layer is provided. The semiconductor layer is located on the flexible substrate. The first gate is located on the flexible substrate and corresponds to a portion of the semiconductor layer. The first gate dielectric layer is located between the first gate and the semiconductor layer. The first gate dielectric layer is in contact with the semiconductor layer, and the hydrogen atom concentration of the first gate dielectric layer is less than 6.5×1020 atoms/cm3. A method of manufacturing the thin film transistor is also provided.
    Type: Application
    Filed: March 6, 2018
    Publication date: May 9, 2019
    Applicants: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Tai-Jui Wang, Yung-Hui Yeh, Jui-Wen Yang, Hsiao-Chiang Yao, Chun-Hung Chu
  • Publication number: 20190131478
    Abstract: A single photon avalanche diode (SPAD) image sensor is disclosed. The SPAD image sensor include: a substrate of a first conductivity type, the substrate having a front surface and a back surface; a deep trench isolation (DTI) extending from the front surface toward the back surface of the substrate, the DTI having a first surface and a second surface opposite to the first surface, the first surface being level with the front surface of the substrate; an epitaxial layer of a second conductivity type opposite to the first conductivity type, the epitaxial layer surrounding sidewalls and the second surface of the DTI; and an implant region of the first conductivity type extending from the front surface to the back surface of the substrate. An associated method for fabricating the SPAD image sensor is also disclosed.
    Type: Application
    Filed: January 17, 2018
    Publication date: May 2, 2019
    Inventors: TZU-JUI WANG, JHY-JYI SZE, YUICHIRO YAMASHITA, KUO-CHIN HUANG
  • Patent number: 10276618
    Abstract: The present disclosure, in some embodiments, relates to a CMOS image sensor. The CMOS image sensor has an image sensing element disposed within a substrate. A plurality of isolation structures are arranged along a back-side of the substrate and are separated from opposing sides of the image sensing element by non-zero distances. A doped region is laterally arranged between the plurality of isolation structures. The doped region is also vertically arranged between the image sensing element and the back-side of the substrate. The doped region physically contacts the image sensing element.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: April 30, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Yuan Chen, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze, Shyh-Fann Ting, Tzu-Jui Wang, Yen-Ting Chiang, Yu-Jen Wang, Yuichiro Yamashita
  • Publication number: 20190123085
    Abstract: A photo diode includes a pixel unit, a photo conversion layer, and a dielectric layer. The pixel unit includes a pair of pixels. The photo conversion layer is above the pixel unit and has a pair of portions, each of which corresponds to a respective one of the pixels. The dielectric layer is between the portions of the photo conversion layer. A method of manufacturing the photo diode is also disclosed.
    Type: Application
    Filed: December 18, 2018
    Publication date: April 25, 2019
    Inventors: Tzu-Jui Wang, Keng-Yu Chou, Chun-Hao Chuang, Ming-Chieh Hsu, Ren-Jie Lin, Jen-Cheng Liu, Dun-Nian Yaung
  • Publication number: 20190110371
    Abstract: A pull-out aiding device is configured for mounting on an object, in which a corresponding apparatus is mounted. The pull-out aiding device includes a pulling member and a handle member. The pulling member includes a first pivot section and an abutting section for abutting against the corresponding apparatus to move the latter forward. The handle member includes a second pivot section and an operating section. The second pivot section is pivotally connected to the first pivot section, such that the handle member is turnable about the second pivot section relative to the pulling member and brings the latter to move forward.
    Type: Application
    Filed: December 10, 2018
    Publication date: April 11, 2019
    Inventors: TING-JUI WANG, CHIA-CHING LIAO
  • Publication number: 20190103360
    Abstract: A flexible chip package is provided. The flexible chip package includes a first flexible substrate; a first redistribution layer disposed on the first flexible substrate; a second flexible substrate; a second redistribution layer disposed on the second flexible substrate; a semiconductor chip disposed between the first and second redistribution layers and electrically connected to at least one of the first and second redistribution layers; and a first bonding layer disposed between the first and second redistribution layers and encapsulating the semiconductor chip, wherein the first bonding layer, the first redistribution layer and the second redistribution layer are between the first flexible substrate and the second flexible substrate.
    Type: Application
    Filed: March 13, 2018
    Publication date: April 4, 2019
    Applicants: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Cheng-Hung Yu, Tai-Jui Wang, Chieh-Wei Feng, Shih-Kuang Chiu, Ming-Huan Yang
  • Publication number: 20190094435
    Abstract: A wire grid polarizer and a display panel using the same are provided. The wire grid polarizer includes a substrate, a plurality of wire grids, a plurality of patterned light absorbing layers, and a surface covering layer. The plurality of wire grids are disposed on the substrate, wherein there are a plurality of gaps between every two wire grids. The plurality of patterned light absorbing layers are disposed corresponding to and overlapping the wire grids respectively, wherein every two of the patterned light absorbing layers have one of the gaps. The surface covering layer is disposed on the patterned light absorbing layers and directly contacts the patterned light absorbing layers.
    Type: Application
    Filed: August 28, 2018
    Publication date: March 28, 2019
    Inventors: HUANG-KAI SHEN, SHENG-MING HUANG, JEN-KUEI LU, CHIH-CHIANG CHEN, HUI-KU CHANG, TSAI-SHENG LO, CHIA-HSIN CHUNG, WEI-CHI WANG, SHENG-KAI LIN, MING-JUI WANG
  • Publication number: 20190079394
    Abstract: An imprint mold and a method for manufacturing the same are provided. The imprint mold includes a plurality of substantially identical or different mold patterns, wherein there isn't any height difference between the mold patterns.
    Type: Application
    Filed: September 10, 2018
    Publication date: March 14, 2019
    Inventors: SHENG-MING HUANG, SHENG-KAI LIN, CHIH-CHIANG CHEN, HUI-KU CHANG, CHIA-HSIN CHUNG, WEI-CHI WANG, MING-JUI WANG, JEN-KUEI LU, TSAI-SHENG LO, HUANG-KAI SHEN
  • Publication number: 20190048916
    Abstract: A fastening device includes a head member and a body member. The head member has a stem portion provided with a fastening section; and the body member is movably assembled to the head member and includes an elastic fastening section for engaging with a first workpiece. To connect the first workpiece to a second workpiece, simply fasten the fastening section of the stem portion to the second workpiece. To disconnect the first workpiece from the second workpiece, simply release the fastening section from the second workpiece. With these arrangements, it is able to quickly connect and easily disconnect two workpieces to and from one another.
    Type: Application
    Filed: August 7, 2018
    Publication date: February 14, 2019
    Inventor: TING-JUI WANG
  • Publication number: 20190040891
    Abstract: A fastening apparatus includes a body; a fastener movably disposed at the body; and a resilient component disposed at the body, the resilient component having an end abutting against the body and another end abutting against the fastener such that the resilient component allows the fastener to be protruded from or inserted into the body normally, or the fastener in rotation and the resilient component interact with each other to effectuate limiting-stopping, interfering-stopping or interfering-abutting. The fastener enters the body disposed on the first object and compresses the resilient component. Then, the resilient component protrudes the fastener out of the body, thereby fastening the fastener to the second object quickly. Easy separation of the first and second objects entails moving the fastener into the body. A fastening method for the fastening apparatus is further introduced.
    Type: Application
    Filed: August 2, 2018
    Publication date: February 7, 2019
    Inventors: TING-JUI WANG, HSU-SHENG CHANG, CHIA-CHING LIAO
  • Publication number: 20190013378
    Abstract: A pixel structure including a substrate, a power wire, a planarization layer, a drive circuit and a conductive structure is provided. The substrate has a layout area and a light-transmitting area located outside the layout area. The power wire is disposed on the layout area of the substrate. The power wire includes a shielding layer. The planarization layer is disposed on the substrate and covers the power wire. The drive circuit is disposed on the planarization layer and corresponds to the layout area. The drive circuit includes a first active device. The shielding layer overlaps with the first active device. The conductive structure is disposed in the planarization layer and distributed corresponding to the layout area. The power wire is electrically connected with the drive circuit through the conductive structure. A display panel is also provided.
    Type: Application
    Filed: August 31, 2017
    Publication date: January 10, 2019
    Applicants: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Tai-Jui Wang, Chieh-Wei Feng, Meng-Jung Yang, Wei-Han Chen, Shao-An Yan, Tsu-Chiang Chang
  • Patent number: 10177186
    Abstract: A photo diode includes a pixel unit, a photo conversion layer, and a dielectric layer. The pixel unit includes a pair of pixels. The photo conversion layer is above the pixel unit and has a pair of portions, each of which corresponds to a respective one of the pixels. The dielectric layer is between the portions of the photo conversion layer. A method of manufacturing the photo diode is also disclosed.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: January 8, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Jui Wang, Keng-Yu Chou, Chun-Hao Chuang, Ming-Chieh Hsu, Ren-Jie Lin, Jen-Cheng Liu, Dun-Nian Yaung
  • Patent number: 10165688
    Abstract: A flexible electronic device including a first flexible substrate, an electronic component, and a control device is provided. The electronic component includes a conductive layer. The control device includes at least one integrated circuit and a circuit layer set. The circuit layer set includes a plurality of circuit layers and at least one first dielectric layer, and at least a portion of the first dielectric layer is interposed between two adjacent circuit layers. The integrated circuit is electrically connected to the electronic component through the circuit layer set and the conductive layer. At least a portion of the conductive layer and at least a portion of one circuit layer are integrally formed, and the conductive layer and the circuit layer are both disposed on the first flexible substrate. A fabricating method of a flexible electronic device is also provided.
    Type: Grant
    Filed: April 25, 2016
    Date of Patent: December 25, 2018
    Assignee: Industrial Technology Research Institute
    Inventors: Sheng-Po Wang, Heng-Yin Chen, Cheng-Chung Lee, Jia-Chong Ho, Yung-Hui Yeh, Tai-Jui Wang
  • Patent number: 10164133
    Abstract: A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: December 25, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu, Bruce C.S. Chou, Jung-Kuo Tu, Cheng-Chieh Hsieh
  • Patent number: 10155413
    Abstract: A roller structure and method of using the same are introduced. The roller structure includes a first sleeve having a mounting portion for mounting a roller portion and a first connection portion for mounting a carried object, wherein the roller portion is disposed at the mounting portion; and a positioning element disposed at the first sleeve and the roller portion to cause the roller portion to rotate relative to the mounting portion. The roller structure can be conveniently and quickly amounted on the carried object, roller frame or circuit board such that roller structure gets standardized and modularized to serve an industrial purpose and provides rollers rotatable in all directions and suitable for use in SMT (Surface Mount Technology) processes and automated assembly operation.
    Type: Grant
    Filed: November 18, 2015
    Date of Patent: December 18, 2018
    Assignee: DTECH PRECISION INDUSTRIES CO., LTD.
    Inventor: Ting-Jui Wang
  • Patent number: D834929
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: December 4, 2018
    Assignee: FIVETECH TECHNOLOGY INC.
    Inventor: Ting-Jui Wang