Abstract: The present disclosure relates to a CMOS image sensor having a doped region, arranged between deep trench isolation structures and an image sensing element, and an associated method of formation. In some embodiments, the CMOS image sensor has a pixel region disposed within a semiconductor substrate. The pixel region has an image sensing element configured to convert radiation into an electric signal. A plurality of back-side deep trench isolation (BDTI) structures extend into the semiconductor substrate on opposing sides of the pixel region. A doped region is laterally arranged between the BDTI structures and separates the image sensing element from the BDTI structures and the back-side of the semiconductor substrate. Separating the image sensing element from the BDTI structures prevents the image sensing element from interacting with interface defects near edges of the BDTI structures, and thereby reduces dark current and white pixel number.

Abstract: A quick release connecting device includes an actuating retainer having an internal receiving space, at least one first push section and a retaining section for detachably engaging with a first object; a fixing member including a body portion movably associated with the receiving space and a pivot portion formed on the body portion for detachably connecting with a second object; pin connection means connecting the body portion to the receiving space for the actuating retainer and the fixing member to move relative to each other within a limited range; an elastic element having two ends pressed against an inner wall surface of the receiving space and the body portion to control the limited movement of the actuating retainer and the fixing member and return them to their original positions. With the quick release connecting device, two mating objects can be conveniently repeatedly connected to and separated from each other.

Abstract: A quick release connecting device includes an actuating retainer having an internal receiving space, at least one first push section and a retaining section for detachably engaging with a first object; a fixing member including a body portion movably associated with the receiving space and a pivot portion formed on the body portion for detachably connecting with a second object; pin connection means connecting the body portion to the receiving space for the actuating retainer and the fixing member to move relative to each other within a limited range; an elastic element having two ends pressed against an inner wall surface of the receiving space and the body portion to control the limited movement of the actuating retainer and the fixing member and return them to their original positions. With the quick release connecting device, two mating objects can be conveniently repeatedly connected to and separated from each other.

Abstract: A sensor device is disclosed. The sensor device include: a detector having a contact formation region; an insulating layer disposed over the detector; a conductive pad disposed over the insulating layer opposite to a side of the detector; a contact plug formed in the insulating layer for electrically coupling the contact implant region and the conductive pad; and a read-out integrated circuit bonded to the insulating layer through the conductive pad. An image sensor array and a manufacturing method of a sensor device are also disclosed.

Abstract: Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a BSI sensor device with an application specific integrated circuit (ASIC) are disclosed. A bond pad array may be formed in a bond pad area of a BSI sensor where the bond pad array comprises a plurality of bond pads electrically interconnected, wherein each bond pad of the bond pad array is of a small size which can reduce the dishing effect of a big bond pad. The plurality of bond pads of a bond pad array may be interconnected at the same layer of the pad or at a different metal layer. The BSI sensor may be bonded to an ASIC in a face-to-face fashion where the bond pad arrays are aligned and bonded together.

Abstract: A complementary metal oxide semiconductor (CMOS) image sensor and a method for fabricating the same are provided. An example CMOS image sensor includes first active regions of a semiconductor substrate, where the first active regions are arranged in rows or columns. Photosensitive regions are formed in the first active regions. The CMOS image sensor also includes second active regions of the semiconductor substrate that are interposed between the first active regions. Each of the second active regions includes a device isolation region formed by doping the semiconductor substrate with impurities. Each of the second active regions also includes a channel region of a field effect transistor (FET) that is formed within the device isolation region and is configured to connect source and drain regions of the FET. At least one control gate is formed over each of the second active regions.

Abstract: A shock-absorbing device includes a first holding member, a second holding member movably assembled to the first holding member, and an elastic element disposed between the first and the second holding member with two ends of the elastic element pressing against the two holding members. With the elastic element, an elastic shock-absorbing space is defined between the first and the second holding member.

Abstract: A grooved rotatably fastening structure includes, in top-to-bottom sequence, a head, a shaft connected to the head, and a fastening portion connected to the shaft. The fastening portion has a first groove and a second groove. The first groove is concavely disposed on a lateral surface of the fastening portion and extends upward from a bottom of the fastening portion. The second groove is concavely disposed on the lateral surface of the fastening portion and extends from the first groove transversely or obliquely. The first groove and the second groove are in communication. The rotatably fastening structure enables users to connect two objects together quickly without compromising the structural strength of the two objects and is applicable to thin objects.

Abstract: A rotary motion structure comprises a limiting member and a rotating member. The limiting member defines a mounting portion; and the rotating member is rotatably provided on the limiting member and includes a shaft portion, which is provided through the mounting portion. Accordingly, the rotary motion structure described above is preferably applied to form a handle device having a positioning function, in which the rotating member is rotated relative to the limiting member so that the rotating member can have the positioning efficacy of automatic positioning, frictional positioning, temporary positioning, or fixed positioning.

Abstract: A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration.

Abstract: A rolling device, a package for rolling device and a rolling module are introduced. The rolling device includes a receiving seat defining a receiving recess, at least one secondary rolling member received in the receiving recess to contact with a surface of the receiving recess, a primary rolling member partially received in the receiving recess to contact with a surface of the at least one secondary rolling member, a coupling section connected to the receiving seat for coupling to an external object, and a stop section connected to the receiving seat and defining a stop opening, which has a size smaller than a maximum size of the primary rolling member.

Abstract: A programming method for a robot arm includes setting and saving operational configurations of the robot arm, establishing an operation process of the robot arm, selecting the operational position icon for applying to the operation sub-process, displaying a selected operational position icon and an operational configuration sub-icon, modifying an operational configuration displayed on the operational configuration sub-icon for facilitating to execute a programming process of the robot arm.

Abstract: A lateral positioning device coupled to a first object to laterally engage or interfere with a second object. The lateral positioning device includes a body portion and positioning element. The body portion is coupled to the first object in a first direction and has a through hole which has therein a limiting portion and extends in a second direction, with an angle formed between the first and second directions. The positioning element is penetratingly disposed in the through hole and limited by the limiting portion to thereby move in the second direction. The positioning element has an engaging portion disposed on the first side of the limiting portion to allow the engaging portion to engage with the second object; a stopping portion disposed on the second side of the limiting portion; and a neck portion connecting with the engaging and stopping portions and passing through the limiting portion.

Abstract: In one embodiment, a flexible device is provided. The flexible device may include a flexible substrate, a buffer layer, a light reflective layer, and a device layer. The buffer layer is located on the flexible substrate. The light reflective layer is located on the flexible substrate, wherein the light reflective layer has a reflection wavelength of 200 nm˜1100 nm, a reflection ratio of greater than 80%, and a stress direction of the light reflective layer is the same as a stress direction of the flexible substrate. The device layer is located on the light reflective layer and the buffer layer.

Abstract: Methods for reducing core-to-core mismatch are provided. The method includes measuring gate lengths of a representative pattern of each core in a first lot of SOC products by a measurement apparatus. Each of the SOC products in the first lot includes more than two cores identical to each other. The method also includes determining a tuning amount according to the differences between the gate lengths of each core, and adjusting at least one mask for critical dimensions of gate length of each core in a second lot of SOC products respectively according to the tuning amounts.

Abstract: A movable handle includes a movable member and a seat, both of which can be made of a plastic, a metal or a composite material. The movable member includes a main body and a bent portion. The main body can be bar-shaped, block-like, ball-shaped, wedge-shaped or in any other suitable shape, and the bent portion can be bent inward, outward or in any other direction relative to the main body. The main body of the movable member is movably assembled to the seat, and the seat is connected to a first object, such that the movable member is indirectly connected to the first object via the seat and can be turned or moved upward and downward or leftward and rightward on and relative to the first object.

Abstract: A semiconductor device is provided. The semiconductor device includes a semiconductor substrate including a first doped region and a second doped region and a gate stack on the semiconductor substrate. The semiconductor device also includes a main spacer layer on a sidewall of the gate stack and a protection layer between the main spacer layer and the semiconductor substrate. The protection layer is doped with a quadrivalent element. The semiconductor device further includes an insulating layer formed over the semiconductor substrate and the gate stack and a contact formed in the insulating layer. The contact includes a first portion contacting the first doped region, and the contact includes a second portion contacting the second doped region. The first portion extends deeper into the semiconductor substrate than the second portion.

Abstract: Methods are provided to be able to efficiently and precisely estimate/predict an available capacity of a battery. One method is arranged to estimate/predict the available capacity of the battery according to a first battery percentage result, a second battery percentage result, and a calculated power when the battery is being operated or used within a specific operating range distinct from a normal operating range. Another method is arranged to estimate the available capacity by measuring battery's internal resistance and referencing a precise battery aging model.

Abstract: A method capable of accurately estimating a power percentage of a battery includes: performing a first fuel gauge operation to measure a power percentage of the battery to generate first information; performing a second fuel gauge operation to measure the power percentage of the battery to generate second information, the first fuel gauge operation being different from the second fuel gauge operation; and, dynamically determining one among at least the first percentage and the second percentage as the power percentage of the battery.