Patents by Inventor Jui Wang

Jui Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200018342
    Abstract: A fittable and releasable fastener includes a head which has a fitted and released portion and a fastening portion; and a fitting and releasing piece which has a fitting and releasing portion. Accordingly, when the fitting and releasing portion fits to the fitted and released portion, an external turning force is applied to the fitting and releasing piece or the head to make the fastening portion combine with at least one object. After the fastening portion is combined with the object, the fitting and releasing portion would release the fitted and released portion to limit the force or the force interval applied on the fastening portion for preventing excessively locking if the force is continuously applied.
    Type: Application
    Filed: July 9, 2019
    Publication date: January 16, 2020
    Inventors: TING-JUI WANG, Tung-Jung Chang
  • Publication number: 20200018930
    Abstract: An imaging optical lens assembly includes four lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element and a fourth lens element. Each of the four lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. At least one of all lens surfaces of the four lens elements is aspheric and has at least one inflection point.
    Type: Application
    Filed: August 25, 2018
    Publication date: January 16, 2020
    Applicant: LARGAN PRECISION CO.,LTD.
    Inventors: Yu-Tai TSENG, Yu-Chun KE, Kuo-Jui WANG, Tzu-Chieh KUO
  • Publication number: 20200020729
    Abstract: A photo diode includes a pixel unit, a photo conversion layer, and a dielectric layer. The pixel unit includes a pair of pixels. The photo conversion layer is above the pixel unit and has a pair of portions, each of which corresponds to a respective one of the pixels. The dielectric layer is between the portions of the photo conversion layer. A method of manufacturing the photo diode is also disclosed.
    Type: Application
    Filed: September 23, 2019
    Publication date: January 16, 2020
    Inventors: Tzu-Jui Wang, Keng-Yu Chou, Chun-Hao Chuang, Ming-Chieh Hsu, Ren-Jie Lin, Jen-Cheng Liu, Dun-Nian Yaung
  • Patent number: 10510912
    Abstract: A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: December 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu, Bruce C. S. Chou, Jung-Kuo Tu, Cheng-Chieh Hsieh
  • Patent number: 10510790
    Abstract: A circuit structure includes a semiconductor substrate having a top surface. A dielectric material extends from the top surface into the semiconductor substrate. A high-k dielectric layer is formed of a high-k dielectric material, wherein the high-k dielectric layer comprises a first portion on a sidewall of the dielectric material, and a second portion underlying the dielectric material.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: December 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Szu-Ying Chen, Tzu-Jui Wang, Jen-Cheng Liu, Dun-Nian Yaung
  • Patent number: 10510789
    Abstract: The present disclosure, in some embodiments, relates to a method of forming an image sensor. The method includes implanting a dopant into a substrate to form a doped region and implanting one or more additional dopants into the substrate to form an image sensing element between the doped region and a front-side of the substrate. The doped region directly contacts a boundary of the image sensing element that is furthest from the front-side of the substrate. The method further includes etching the substrate to form one or more trenches extending into a back-side of the substrate. The back-side of the substrate opposes the front-side of the substrate. The method further includes filling the one or more trenches with one or more dielectric materials to form isolation structures.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: December 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Yuan Chen, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze, Shyh-Fann Ting, Tzu-Jui Wang, Yen-Ting Chiang, Yu-Jen Wang, Yuichiro Yamashita
  • Publication number: 20190376537
    Abstract: A position-limiting device includes a position-limiting element and a body. The position-limiting element has a position-limiting portion and a blocking portion. The body has a corresponding blocking portion and a fitting portion. The blocking portion of the position-limiting element and the corresponding blocking portion of the body block each other such that the position-limiting element and the body are fitted together. The fitting portion is fitted to an object. The position-limiting element penetrates a position-limited component before being rotated to block or position-limit the position-limited component. Therefore, the body is fitted to the object, and the position-limiting element is rotated to position-limit or move away from the position-limited component, so as to couple together and separate the object and the position-limited component, thereby allowing two objects to be coupled together and separated repeatedly and rapidly.
    Type: Application
    Filed: June 3, 2019
    Publication date: December 12, 2019
    Inventor: TING-JUI WANG
  • Patent number: 10500682
    Abstract: A roller structure and a manufacturing method thereof are introduced. The roller structure includes a roller rotatable about an axial portion, an end of a bush is fixed to an end of the axial portion, and another end of the bush having an engaging portion coupled to a load, a first stop portion disposed at another end of the axial portion and the bush has a second stop portion positioned opposite to the first stop portion such that the roller rotates between the first stop portion and the second stop portion; wherein the engaging portion of the bush has a feeding space that receives a material of the load to couple the engaging portion to the load. Hence, the roller structure and the manufacturing method thereof provide a modularized roller structure for carrying a load, effectuate modularized assembly and production, enhance assembly efficiency, attain structural streamlining, and cut costs.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: December 10, 2019
    Assignee: FIVETECH TECHNOLOGY INC.
    Inventors: Ting-Jui Wang, Martin Chao, Aias Lin
  • Publication number: 20190360545
    Abstract: A shock-absorbing device includes a first holding member, a second holding member movably assembled to the first holding member, and an elastic element disposed between the first and the second holding member with two ends of the elastic element pressing against the two holding members. With the elastic element, an elastic shock-absorbing space is defined between the first and the second holding member.
    Type: Application
    Filed: August 6, 2019
    Publication date: November 28, 2019
    Inventors: TING-JUI WANG, Pei-Hsun Lin
  • Publication number: 20190355713
    Abstract: A system in package structure and an electrostatic discharge protection structure thereof are provided. The electrostatic discharge protection structure includes a redistribution layer and a first transistor array. The redistribution layer has a first electrode and a second electrode. The first transistor array is coupled to a pin end of at least one integrated circuit, the first electrode and the second electrode. The first transistor array has a plurality of transistors. A plurality of first transistors of the transistors are coupled in parallel, and a plurality of second transistors of the transistors are coupled in parallel. The first transistors and the second transistors are configured to be turned on for dissipating an electrostatic discharge current.
    Type: Application
    Filed: November 8, 2018
    Publication date: November 21, 2019
    Applicant: Industrial Technology Research Institute
    Inventors: Cheng-Hung Yu, Tai-Jui Wang, Chieh-Wei Feng, Yu-Hua Chung
  • Publication number: 20190353202
    Abstract: A roller structure includes a roller having an axial hole and an axle portion disposed in the axial hole to allow the roller to rotate about the axle portion; a sleeve with an end disposed at an end of the axle portion and another end having a fitting portion, the fitting portion being fitted to a carried object, the sleeve has a first blocking portion positioned proximate to a side of the roller to allow the roller to rotate between the first blocking portion and the fitting portion, wherein one of the axle portion, the axial hole and the first blocking portion has a substance conducive to reduction of friction between the roller and the sleeve. A method of manufacturing the roller structure is further introduced.
    Type: Application
    Filed: August 5, 2019
    Publication date: November 21, 2019
    Inventor: TING-JUI WANG
  • Publication number: 20190348451
    Abstract: A circuit structure includes a semiconductor substrate having a top surface. A dielectric material extends from the top surface into the semiconductor substrate. A high-k dielectric layer is formed of a high-k dielectric material, wherein the high-k dielectric layer comprises a first portion on a sidewall of the dielectric material, and a second portion underlying the dielectric material.
    Type: Application
    Filed: July 22, 2019
    Publication date: November 14, 2019
    Inventors: Szu-Ying Chen, Tzu-Jui Wang, Jen-Cheng Liu, Dun-Nian Yaung
  • Publication number: 20190346661
    Abstract: An optical imaging lens assembly includes five lens elements, which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof. The third lens element has negative refractive power. The fifth lens element has negative refractive power.
    Type: Application
    Filed: October 3, 2018
    Publication date: November 14, 2019
    Applicant: LARGAN PRECISION CO.,LTD.
    Inventors: Kuan-Ting YEH, Kuo-Jui WANG, Chien-Hsun WU, Wei-Yu CHEN, Po-Lun HSU
  • Patent number: 10471592
    Abstract: A programming method for a robot arm includes setting and saving operational configurations of the robot arm, establishing an operation process of the robot arm, selecting the operational position icon for applying to the operation sub-process, displaying a selected operational position icon and an operational configuration sub-icon, modifying an operational configuration displayed on the operational configuration sub-icon for facilitating to execute a programming process of the robot arm.
    Type: Grant
    Filed: April 20, 2017
    Date of Patent: November 12, 2019
    Assignee: QUANTA STORAGE INC.
    Inventors: Shih-Jung Huang, Pei-Jui Wang, Chien-Te Ye, Shih-Kuo Chen, Fu-Jia Hsu
  • Publication number: 20190338801
    Abstract: A fastener structure includes a body portion and a fastening body. The body portion has a solderable layer, and the solderable layer is soldered to a plate body. The fastening body combines movably with the body portion. The fastening body has a head and a fastening portion. The body portion or the fastening body, or both the body portion and the fastening body is provided on the plate body for soldering after it is picked up by a tool so that the body portion can combine with the plate body. Also, the body portion or the fastening body, or both the body portion and the fastening body combines with a assisting pickup unit, and the fastener structure is provided on the plate body for soldering after it is picked up by a tool through the assisting pickup unit so that the body portion can combine with the plate body.
    Type: Application
    Filed: April 29, 2019
    Publication date: November 7, 2019
    Inventor: TING-JUI WANG
  • Publication number: 20190341373
    Abstract: A chip package structure including a redistribution structure layer, at least one chip, and an encapsulant is provided. The redistribution structure layer includes at least one redistribution circuit, at least one transistor electrically connected to the redistribution circuit, and a plurality of conductive vias electrically connected to the redistribution circuit and the transistor. The chip is disposed on the redistribution structure layer and electrically connected to the redistribution structure layer. The encapsulant is disposed on the redistribution structure layer and at least encapsulates the chip. A manufacturing method of a chip package structure is also provided.
    Type: Application
    Filed: July 5, 2018
    Publication date: November 7, 2019
    Applicant: Industrial Technology Research Institute
    Inventors: Cheng-Hung Yu, Tai-Jui Wang, Chieh-Wei Feng, Wei-Yuan Cheng
  • Patent number: 10468068
    Abstract: A vibration-proof fastener post structure includes a body portion having a first end integrally formed with or assembled to a first object; a fastening head portion movably mounted to a second end of the body portion and having a neck portion, which is movably disposed in the body portion for moving in a slideway hole of a second object; and an elastic element movably fitted around the neck portion to push against the body portion. The fastening head portion and the body portion are configured for engaging with and fastening to the slideway hole of the second object. The second object is slidably relative to the neck portion. When the second object is slid to a predetermined position, the fastening head portion and the elastic element, the body portion or the pushing member will engage with the slideway hole of the second object to achieve a vibration-proof fastening effect.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: November 5, 2019
    Assignee: FIVETECH TECHNOLOGY INC.
    Inventor: Ting-Jui Wang
  • Patent number: 10468443
    Abstract: A photo diode includes a pixel unit, a photo conversion layer, and a dielectric layer. The pixel unit includes a pair of pixels. The photo conversion layer is above the pixel unit and has a pair of portions, each of which corresponds to a respective one of the pixels. The dielectric layer is between the portions of the photo conversion layer. A method of manufacturing the photo diode is also disclosed.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: November 5, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Tzu-Jui Wang, Keng-Yu Chou, Chun-Hao Chuang, Ming-Chieh Hsu, Ren-Jie Lin, Jen-Cheng Liu, Dun-Nian Yaung
  • Patent number: 10458464
    Abstract: A roller structure and a manufacturing method thereof are introduced. The roller structure includes a cylindrical roller rotatable about an elongated axial portion disposed coaxially in a through-hole of the cylindrical roller, a bush with an end fixed to an end of the elongated axial portion, the bush having a first stop portion positioned proximate to one axial end of the cylindrical roller and another end having an engaging portion coupled to a load, and a second stop portion disposed at an opposite end of the elongated axial portion and positioned proximate to the other side of the roller such that the roller rotates between the first stop portion and the second stop portion. Hence, the roller structure and the manufacturing method thereof provide a modularized roller structure for carrying a load, effectuate modularized assembly and production, enhance assembly efficiency, attain structural streamlining, and cut costs.
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: October 29, 2019
    Assignee: FIVETECH TECHNOLOGY INC.
    Inventors: Ting-Jui Wang, Martin Chao, Aias Lin
  • Patent number: D866307
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: November 12, 2019
    Assignee: FIVETECH TECHNOLOGY INC.
    Inventor: Ting-Jui Wang