Abstract: A snap-engagement module includes a fixing portion, support, extension portion, snap-engagement portion, and prodding portion. A first jointing unit of the fixing portion and a jointing hole of the support are jointed. The extension portion connects to the first jointing unit. A passage is formed inside the fixing portion and the extension portion. The snap-engagement portion is movably disposed at the extension portion. The prodding portion has a controlling unit connected to the prodding unit and exposed from the fixing portion. The prodding unit is movably disposed at the passage to retract or protrude the snap-engagement portion. A jointing module comprises a jointing base and a jointing ring. The jointing base has a second jointing unit, a jointing hole, and a receiving space. The jointing ring is movably confined to the receiving space. The snap-engagement portion snap-engages the jointing ring.

Abstract: A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration.

Abstract: A screw made of a high-strength composite material includes a head with a first end, a second end, and a first containing portion in the head and having an opening at the second end of the head which is made of a first material like plastic, fiber, rubber or silicone; a thread, with a first end, a second end, and a second containing portion in the thread and having an opening at the first end of the thread, and the first end of the thread being coupled to the second end of the head, and the first containing portion of the head and the second containing portion of the thread forming a space, and the thread being made of the first material; and an enhanced post body contained in the first and second containing portions and made of a second material like metal.

Abstract: A representative display device includes a display module, a polarization controller and a compensator. Each pixel region of the display module has a first sub-pixel region, a second sub-pixel region and a third sub-pixel region respectively providing a first light, a second light and a third light of the same polarization. The polarization controller has control regions that control the polarization of the light passing therethrough. The compensator has first compensating regions, second compensating regions and third compensating regions corresponding to the first sub-pixel regions, the second sub-pixel regions and the third sub-pixel regions, respectively. The compensations of phase retardation of the first light, the second light and the third light generated by passing through the first compensating regions, the second compensating regions and the third compensating regions are different from one another.

Abstract: A method for fixing a semiconductor chip on a circuit board is provided, which includes following steps. The circuit board is provided, which sequentially includes a substrate having a chip connecting portion, at least one metal wire and an insulating layer. An organic insulating material is formed on the insulating layer of the outside edge of the chip connecting portion. An anisotropic conductive film (ACF) is then formed to cover the chip connecting portion and a portion of the organic insulating material. Finally, a semiconductor chip is hot-pressed on the ACF. The organic insulating material formed on the insulating layer is used to prevent the metal wires beneath the insulating layer from occurring of corrosion. A semiconductor chip package structure is also provided.

Abstract: A method for fixing a semiconductor chip on a circuit board is provided, which includes following steps. The circuit board is provided, which sequentially includes a substrate having a chip connecting portion, at least one metal wire and an insulating layer. An organic insulating material is formed on the insulating layer of the outside edge of the chip connecting portion. An anisotropic conductive film (ACF) is then formed to cover the chip connecting portion and a portion of the organic insulating material Finally, a semiconductor chip is hot-pressed on the ACF. The organic insulating material formed on the insulating layer is used to prevent the metal wires beneath the insulating layer from occurring of corrosion. A semiconductor chip package structure is also provided.

Abstract: An improved fastener includes a fastener body and a blocker. The fastener body has an end functioning as a connecting head, and center of the fastener body forms an axial threaded bore. An end of the axial threaded bore corresponding to the connecting head is formed into a recess surrounded by the connecting head. The blocker is removably fitted in the recess of the fastener body. When the connecting head of the fastener body is extended through a fixing hole on a printed circuit board with the blocker fitted in the recess, solder paste applied over the fixing hole is prevented from entering into the axial threaded bore of the fastener body to interfere with a screw being threaded into the fastener body.

Abstract: Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a BSI sensor device with an application specific integrated circuit (ASIC) are disclosed. A bond pad array may be formed in a bond pad area of a BSI sensor where the bond pad array comprises a plurality of bond pads electrically interconnected, wherein each bond pad of the bond pad array is of a small size which can reduce the dishing effect of a big bond pad. The plurality of bond pads of a bond pad array may be interconnected at the same layer of the pad or at a different metal layer. The BSI sensor may be bonded to an ASIC in a face-to-face fashion where the bond pad arrays are aligned and bonded together.

Abstract: A band-pass filter with a loop configuration is implemented on a circuit board in the form of a microstrip line for signals in the gigahertz range. The band-pass filter includes a dielectric substrate and a conductive layer disposed over the dielectric substrate, wherein the conductive layer comprises a loop portion; a first signal terminal extending from a first side of the loop portion; a second signal terminal extending from a second side of the loop portion; a first branch extending from a third side of the loop portion; and a second branch extending from a fourth side of the loop portion.

Abstract: A method for fixing a semiconductor chip on a circuit board is provided, which includes following steps. The circuit board is provided, which sequentially includes a substrate having a chip connecting portion, at least one metal wire and an insulating layer. An organic insulating material is formed on the insulating layer of the outside edge of the chip connecting portion. An anisotropic conductive film (ACF) is then formed to cover the chip connecting portion and a portion of the organic insulating material. Finally, a semiconductor chip is hot-pressed on the ACF. The organic insulating material formed on the insulating layer is used to prevent the metal wires beneath the insulating layer from occurring of corrosion. A semiconductor chip package structure is also provided.

Abstract: Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a BSI sensor device with an application specific integrated circuit (ASIC) are disclosed. A bond pad array may be formed in a bond pad area of a BSI sensor where the bond pad array comprises a plurality of bond pads electrically interconnected, wherein each bond pad of the bond pad array is of a small size which can reduce the dishing effect of a big bond pad. The plurality of bond pads of a bond pad array may be interconnected at the same layer of the pad or at a different metal layer. The BSI sensor may be bonded to an ASIC in a face-to-face fashion where the bond pad arrays are aligned and bonded together.

Abstract: A backside illuminated image sensor comprises a photodiode and a first transistor located in a first chip, wherein the first transistor is electrically coupled to the photodiode. The backside illuminated image sensor further comprises a second transistor formed in a second chip and a plurality of logic circuits formed in a third chip, wherein the second chip is stacked on the first chip and the third chip is stacked on the second chip. The logic circuit, the second transistor and the first transistor are coupled to each other through a plurality of boding pads and through vias.

Abstract: A monitor is disclosed and includes a displaying device, a supporting device, and a console. The supporting device is connected to and supports the displaying device. The console is connected in communication to the displaying device and is capable of being engaged with the supporting device. The console includes a first switch key and a second switch key. The displaying device can be triggered to switch to a first displaying mode by the first switch key or to a second displaying mode by the second switch key. The detachable design for the console of the invention not only allows a user to quickly switch the displaying modes, but also avoids shaking due to performing the switching on the displaying device by fingers in the prior art. Therefore, the invention can effectively solve the inconvenience of switching or setting the displaying modes in the prior art.

Abstract: A quick assembly apparatus includes a fastening unit, a control unit and an elasticity unit. The fastening unit includes a head section and a fastening section, a through channel connecting the head section and the fastening section, and a notch at the fastening section to form a plurality of elastic fastening elements. The control unit is movably inserted in the through channel, includes a supporting section supporting the elastic fastening elements, a control shaft connected with the supporting section and extending out from the fastening section, and an extension shaft connected with the supporting section and extending towards the head section. The elasticity unit is fitted around the extension shaft of the control unit, and has its one end pushed against the control unit and its another end pushed against the fastening unit. Accordingly, the quick assembly apparatus is capable of quickly and steadily assembling two plates.

Abstract: A floating fastener for mounting to a first object and then fastening into a second object includes a fastening main body having, from top to bottom, sequentially connected handling portion, shank portion and fastening portion; a cap portion having a connecting section connected to the handling portion and a first stop section extended into the cap portion; and a sleeve movably located around the shank portion and having a second stop section movably interfering with the first stop section for the sleeve and the cap portion to movably connect together without separating from each other, a floating displacement limiting section located below the second stop section and horizontally abutted on the first stop section for preventing the sleeve from swaying, and a fixing section formed around a lower end of the sleeve. The floating fastener can possess a degree of floating displacement without having a swaying or inclined sleeve.

Abstract: A method for forming doping regions is disclosed, including providing a substrate, forming a first-type doping material on the substrate and forming a second-type doping material on the substrate, wherein the first-type doping material is separated from the second-type doping material by a gap; forming a covering layer to cover the substrate, the first-type doping material and the second-type doping material; and performing a thermal diffusion process to diffuse the first-type doping material and the second-type doping material into the substrate.

Abstract: An etching composition for a semiconductor wafer is provided, including 0.5-50 wt % base, 10-80 wt % alcohol, 0.01-15 wt % additive and water. A method for etching a semiconductor wafer is also provided. When the etching composition is applied to the entire surface or a partial surface of the semiconductor wafer at 60-200° C., the etching composition reacts on the semiconductor wafer to form a foam that etches the semiconductor wafer and includes a solid, a liquid and a gas. At the same time, the additive forms an oxide mask on the surface of the semiconductor wafer. Therefore, an excellent texture structure is formed on the surface of the semiconductor wafer, and a single surface of the semiconductor wafer is etched.

Abstract: Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a BSI sensor device with an application specific integrated circuit (ASIC) are disclosed. A bond pad array may be formed in a bond pad area of a BSI sensor where the bond pad array comprises a plurality of bond pads electrically interconnected, wherein each bond pad of the bond pad array is of a small size which can reduce the dishing effect of a big bond pad. The plurality of bond pads of a bond pad array may be interconnected at the same layer of the pad or at a different metal layer. The BSI sensor may be bonded to an ASIC in a face-to-face fashion where the bond pad arrays are aligned and bonded together.

Abstract: A backside illuminated image sensor comprises a photodiode and a first transistor located in a first chip, wherein the first transistor is electrically coupled to the photodiode. The backside illuminated image sensor further comprises a second transistor formed in a second chip and a plurality of logic circuits formed in a third chip, wherein the second chip is stacked on the first chip and the third chip is stacked on the second chip. The logic circuit, the second transistor and the first transistor are coupled to each other through a plurality of boding pads and through vias.

Abstract: A backside illuminated image sensor comprises a photodiode and a first transistor located in a first substrate, wherein the first transistor is electrically coupled to the photodiode. The backside illuminated image sensor further comprises a plurality of logic circuits formed in a second substrate, wherein the second substrate is stacked on the first substrate and the logic circuit are coupled to the first transistor through a plurality of bonding pads.