Patents by Inventor Jui Wang

Jui Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electric connector, plug-in module thereof and method for manufacturing plug-in module
    Patent number: 9516757
    Abstract: An electric connector, a plug-in module thereof and a production method of the plug-in module are provided. The plug-in module comprises a base, an input unit, an output unit and an output end. The base comprises a top plate, a bottom plate and one connection plate. A plurality of input terminals and a plurality of intermediate terminals are fixed to the base. The input unit comprises one input circuit board provided vertically to the base and electrically coupled to an end portion of the input terminals. At least one channel are provided on the input circuit board. Each channel comprises a transformer electrically coupled to the input circuit board. The output unit comprises an output circuit board horizontally provided to the base and electrically coupled to the input circuit board via the intermediate terminals. The output end are fixed to and electrically coupled to the output circuit board.
    Type: Grant
    Filed: April 16, 2015
    Date of Patent: December 6, 2016
    Assignee: DELTA ELECTRONICS (CHEN ZHOU) CO. LTD.
    Inventors: Wangjun He, Jung-jui Wang, Shaofeng Yu
  • Electrical connector and communication device
    Patent number: 9515426
    Abstract: The disclosure provides an electrical connector and a communication device. The electrical connector includes an insulator, on which at least one docking socket and at least one module socket are provided; a housing provided outside the insulator; a plug-in module provided on the insulator; and a signal display unit, which comprises a signal display circuit board, at least one SMD (surface-mounted-device) LED electrically coupled to the signal display circuit board, and at least two connection terminals electrically coupled to the signal display circuit board used to transmit signal of the signal display unit.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: December 6, 2016
    Assignee: Delta Electronics (Chen Zhou) Co., Ltd.
    Inventors: Qing Li, Wangjun He, Jung-jui Wang
  • Method and Apparatus for Image Sensor Packaging
    Publication number: 20160307944
    Abstract: Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a sensor device with an application specific integrated circuit (ASIC) are disclosed. According to an embodiment, a sensor device may be bonded together face-to-face with an ASIC without using a carrier wafer, where corresponding bond pads of the sensor are aligned with bond pads of the ASIC and bonded together, in a one-to-one fashion. A column of pixels of the sensor may share a bond pad connected by a shared inter-metal line. The bond pads may be of different sizes and configured in different rows to be disjoint from each other. Additional dummy pads may be added to increase the bonding strength between the sensor and the ASIC.
    Type: Application
    Filed: June 27, 2016
    Publication date: October 20, 2016
    Inventors: Szu-Ying Chen, Ping-Yin Liu, Calvin Yi-Ping Chao, Tzu-Jui Wang, Jen-Cheng Liu, Dun-Nian Yaung, Lan-Lin Chao
  • Electrical connector and plug-in module for the same
    Patent number: 9466932
    Abstract: The present disclosure discloses an electrical connector and a plug-in module. The plug-in module includes a base, a plurality of input terminals, a plurality of output terminals and a PCB module. The base includes a bottom plate, a front plate and a back plate, and a tongue plate extending from the bottom plate forward beyond the front plate; the plurality of input terminals are fixed to the back plate, and two ends of each of the input terminals extend respectively beyond a top end of the back plate and a bottom end of the bottom plate; the plurality of output terminals are fixed to the tongue plate and the front plate, and two ends of each of the output terminals extend respectively beyond a top end of the front plate and the tongue plate; and the PCB module includes at least one circuit board.
    Type: Grant
    Filed: May 4, 2015
    Date of Patent: October 11, 2016
    Assignee: DELTA ELECTRONICS (CHEN ZHOU) CO. LTD.
    Inventors: Zhixiang Hou, Wangjun He, Sisi Yang, Jung-jui Wang
  • Forming pixel units of image sensors through bonding two chips
    Patent number: 9443836
    Abstract: A device includes a first chip including an image sensor therein, and a second chip bonded to the first chip. The second chip includes a logic device selected from the group consisting essentially of a reset transistor, a selector, a row selector, and combinations thereof therein. The logic device and the image sensor are electrically coupled to each other, and are parts of a same pixel unit.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: September 13, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Szu-Ying Chen, Meng-Hsun Wan, Tzu-Jui Wang, Dun-Nian Yaung, Jen-Cheng Liu
  • Wrench quick release apparatus and wrench quick release handle
    Patent number: 9441653
    Abstract: A wrench quick release apparatus includes a sleeve, a positioning unit, a wrench unit and an elasticity unit. The sleeve includes a channel and an engaging section for engaging to a first plate. The positioning unit inserts in the channel of the sleeve, and includes one end inserted through the first plate and an opposite end protrudes out from the channel of the sleeve. The wrench unit is pivotally connected to the positioning unit and protrudes out from one end of the sleeve. The elasticity unit includes one end pushed against the positioning unit and an opposite end pushed against the sleeve. Accordingly, the wrench quick release apparatus is first engaged to the first plate through the sleeve and then engaged to or disengaged from a second plate.
    Type: Grant
    Filed: September 15, 2015
    Date of Patent: September 13, 2016
    Assignee: DTECH PRECISION INDUSTRIES CO., LTD.
    Inventor: Ting-Jui Wang
  • ROLLER STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20160238080
    Abstract: A roller structure and a manufacturing method thereof are introduced. The roller structure includes a roller rotatable about an axial portion; a bush with an end disposed to an end of the axial portion and has a first stop portion positioned proximate to one side of the roller and another end having an engaging portion coupled to a load; and a second stop portion disposed to the other end of the axial portion and positioned proximate to the other side of the roller such that the roller rotates between the first stop portion and the second stop portion. Hence, the roller structure and the manufacturing method thereof provide a modularized roller structure for carrying a load, effectuate modularized assembly and production, enhance assembly efficiency, attain structural streamlining, and cut costs.
    Type: Application
    Filed: April 27, 2016
    Publication date: August 18, 2016
    Inventors: TING-JUI WANG, MARTIN CHAO, AIAS LIN
  • Image Sensor Device and Method
    Publication number: 20160233347
    Abstract: A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration.
    Type: Application
    Filed: April 18, 2016
    Publication date: August 11, 2016
    Inventors: Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu, Bruce C.S. Chou, Jung-Kuo Tu, Cheng-Chieh Hsieh
  • High-k Dielectric Liners in Shallow Trench Isolations
    Publication number: 20160233256
    Abstract: A circuit structure includes a semiconductor substrate having a top surface. A dielectric material extends from the top surface into the semiconductor substrate. A high-k dielectric layer is formed of a high-k dielectric material, wherein the high-k dielectric layer comprises a first portion on a sidewall of the dielectric material, and a second portion underlying the dielectric material.
    Type: Application
    Filed: April 15, 2016
    Publication date: August 11, 2016
    Inventors: Szu-Ying Chen, Tzu-Jui Wang, Jen-Cheng Liu, Dun-Nian Yaung
  • Method and apparatus for image sensor packaging
    Patent number: 9412725
    Abstract: Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a sensor device with an application specific integrated circuit (ASIC) are disclosed. According to an embodiment, a sensor device may be bonded together face-to-face with an ASIC without using a carrier wafer, where corresponding bond pads of the sensor are aligned with bond pads of the ASIC and bonded together, in a one-to-one fashion. A column of pixels of the sensor may share a bond bad connected by a shared inter-metal line. The bond pads may be of different sizes and configured in different rows to be disjoint from each other. Additional dummy pads may be added to increase the bonding between the sensor and the ASIC.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: August 9, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Szu-Ying Chen, Ping-Yin Liu, Calvin Yi-Ping Chao, Tzu-Jui Wang, Jen-Cheng Liu, Dun-Nian Yaung, Lan-Lin Chao
  • Apparatus and method for backside illuminated image sensors
    Patent number: 9406711
    Abstract: A backside illuminated image sensor comprises a photodiode and a first transistor located in a first substrate, wherein the first transistor is electrically coupled to the photodiode. The backside illuminated image sensor further comprises a plurality of logic circuits formed in a second substrate, wherein the second substrate is stacked on the first substrate and the logic circuit are coupled to the first transistor through a plurality of bonding pads.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: August 2, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Szu-Ying Chen, Tzu-Jui Wang, Jen-Cheng Liu, Dun-Nian Yaung, Ping-Yin Liu, Lan-Lin Chao
  • PHOTO DIODE AND METHOD OF FORMING THE SAME
    Publication number: 20160218131
    Abstract: A photo diode includes a pixel unit, a photo conversion layer, and a dielectric layer. The pixel unit includes a pair of pixels. The photo conversion layer is above the pixel unit and has a pair of portions, each of which corresponds to a respective one of the pixels. The dielectric layer is between the portions of the photo conversion layer. A method of manufacturing the photo diode is also disclosed.
    Type: Application
    Filed: April 1, 2016
    Publication date: July 28, 2016
    Inventors: TZU-JUI WANG, KENG-YU CHOU, CHUN-HAO CHUANG, MING-CHIEH HSU, REN-JIE LIN, JEN-CHENG LIU, DUN-NIAN YAUNG
  • Method and apparatus for image sensor packaging
    Patent number: 9379093
    Abstract: Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a sensor device with an application specific integrated circuit (ASIC) are disclosed. According to an embodiment, a sensor device may be bonded together face-to-face with an ASIC without using a carrier wafer, where corresponding bond pads of the sensor are aligned with bond pads of the ASIC and bonded together, in a one-to-one fashion. A column of pixels of the sensor may share a bond bad connected by a shared inter-metal line. The bond pads may be of different sizes and configured in different rows to be disjoint from each other. Additional dummy pads may be added to increase the bonding between the sensor and the ASIC.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: June 28, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Szu-Ying Chen, Ping-Yin Liu, Calvin Yi-Ping Chao, Tzu-Jui Wang, Jen-Cheng Liu, Dun-Nian Yaung, Lan-Lin Chao
  • Wrench quick release apparatus
    Patent number: 9360037
    Abstract: A wrench quick release apparatus includes a sleeve, a positioning unit, a wrench unit and an elasticity unit. The sleeve includes a channel and an engaging section for engaging to a first plate. The positioning unit inserts in the channel of the sleeve, and includes one end inserted through the first plate and an opposite end protrudes out from the channel of the sleeve. The wrench unit is pivotally connected to the positioning unit and protrudes out from one end of the sleeve. The elasticity unit includes one end pushed against the positioning unit and an opposite end pushed against the sleeve. Accordingly, the wrench quick release apparatus is first engaged to the first plate through the sleeve and then engaged to or disengaged from a second plate.
    Type: Grant
    Filed: September 24, 2014
    Date of Patent: June 7, 2016
    Assignee: DTECH PRECISION INDUSTRIES CO., LTD.
    Inventor: Ting-Jui Wang
  • ROLLER STRUCTURE AND METHOD OF USING THE SAME
    Publication number: 20160152073
    Abstract: A roller structure and method of using the same are introduced. The roller structure includes a first sleeve having a mounting portion for mounting a roller portion and a first connection portion for mounting a carried object, wherein the roller portion is disposed at the mounting portion; and a positioning element disposed at the first sleeve and the roller portion to cause the roller portion to rotate relative to the mounting portion. The roller structure can be conveniently and quickly amounted on the carried object, roller frame or circuit board such that roller structure gets standardized and modularized to serve an industrial purpose and provides rollers rotatable in all directions and suitable for use in SMT (Surface Mount Technology) processes and automated assembly operation.
    Type: Application
    Filed: November 18, 2015
    Publication date: June 2, 2016
    Inventor: TING-JUI WANG
  • Photo diode and method of forming the same
    Patent number: 9356069
    Abstract: A method for forming a photo diode is provided. The method includes: forming a first pair of electrodes and a second pair of electrodes over a substrate by using a conductive layer; forming a dielectric layer over the substrate; patterning the dielectric layer over the substrate; forming a photo conversion layer over the substrate; and forming a color filter layer over the photo conversion layer, wherein at least a portion of the dielectric layer separates a first portion of the color filter layer corresponding to a first pixel from a second portion of the color filter layer corresponding to a second pixel, and a refractive index of the dielectric layer is lower than a refractive index of the color filter layer, wherein the first pair of electrodes corresponds to the first pixel and the second pair of electrodes corresponds to the second pixel.
    Type: Grant
    Filed: June 5, 2015
    Date of Patent: May 31, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Tzu-Jui Wang, Keng-Yu Chou, Chun-Hao Chuang, Ming-Chieh Hsu, Ren-Jie Lin, Jen-Cheng Liu, Dun-Nian Yaung
  • Touch Polarizer and Touch Display Device
    Publication number: 20160147113
    Abstract: A touch polarizer and a touch display device are provided. The touch polarizer includes a first substrate, a transparent electrode layer, a wire-grid electrode layer, and a touch circuit. The transparent electrode layer is disposed on the first substrate. The wire-grid electrode layer is disposed on one side of the transparent electrode layer and includes a plurality of wires arranged parallel to each other and spaced to form a wire-grid. The touch circuit respectively connects to the transparent electrode layer and the plurality of wires and generates a touch signal based on a feedback from the transparent electrode layer and the wire-grid electrode layer.
    Type: Application
    Filed: November 24, 2015
    Publication date: May 26, 2016
    Inventors: Chih-Sheng Chang, Sheng-Ming Huang, Sheng-Kai Lin, Wei-Chi Wang, Hui-Ku Chang, Ying-Hui Lai, Han-Sheng Nian, Ming-Jui Wang
  • ELECTRICAL CONNECTOR AND COMMUNICATION DEVICE
    Publication number: 20160141813
    Abstract: The disclosure provides an electrical connector and a communication device. The electrical connector includes an insulator, on which at least one docking socket and at least one module socket are provided; a housing provided outside the insulator; a plug-in module provided on the insulator; and a signal display unit, which comprises a signal display circuit board, at least one SMD (surface-mounted-device) LED electrically coupled to the signal display circuit board, and at least two connection terminals electrically coupled to the signal display circuit board used to transmit signal of the signal display unit.
    Type: Application
    Filed: August 31, 2015
    Publication date: May 19, 2016
    Inventors: Qing LI, Wangjun HE, Jung-jui WANG
  • ELECTRICAL CONNECTOR, MANUFACTURING METHOD THEREOF AND COMMUNICATION DEVICE
    Publication number: 20160141811
    Abstract: The disclosure provides an electrical connector, its manufacturing method, and a communication device. The electrical connector includes an insulator, on which at least one docking socket is provided; a housing provided outside the insulator; a signal processing unit provided in the insulator; and a signal display unit comprising a signal display circuit board, at least one SMD (surface-mounted-device) LED electrically coupled to the signal display circuit board, and at least one connection terminal electrically coupled to an exterior circuit board or the signal processing unit.
    Type: Application
    Filed: July 12, 2015
    Publication date: May 19, 2016
    Inventors: Zhixiang HOU, Wangjun HE, Jung-jui WANG
  • ROLLER STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20160138647
    Abstract: A roller structure and a manufacturing method thereof are introduced. The roller structure includes a roller rotatable about an axial portion; a bush with an end disposed to an end of the axial portion and has a first stop portion positioned proximate to one side of the roller and another end having an engaging portion coupled to a load; and a second stop portion disposed to the other end of the axial portion and positioned proximate to the other side of the roller such that the roller rotates between the first stop portion and the second stop portion. Hence, the roller structure and the manufacturing method thereof provide a modularized roller structure for carrying a load, effectuate modularized assembly and production, enhance assembly efficiency, attain structural streamlining, and cut costs.
    Type: Application
    Filed: November 13, 2015
    Publication date: May 19, 2016
    Inventors: TING-JUI WANG, MARTIN CHAO, AIAS LIN