Abstract: A soldering component and a method of fitting it to boards are introduced. The soldering component includes a body and a fitting portion. The fitting portion is fitted to an object. The body has an engaging portion with an elastic retraction space conducive to elastic retraction of two or more engagement portions, allowing the engagement portions to engage with another object. The soldering component has a weldable surface to be soldered to a weldable surface of the object. The weldable surface of the object has a built-in solder layer adapted to be heated for soldering the soldering component and the weldable surface of the object together. The soldering component is disposed in a carrier, taken out with a tool, compared with the object by a comparison device to determine a fitting position on the object, positioned at the fitting position with the tool, thereby being fitted to the object.

Abstract: A near-eye display device, including a substrate, a light-emitting element, an active element, an optical layer, and a light guide structure, is provided. The light-emitting element is located on the substrate and includes a first type semiconductor pattern. The active element is located adjacent to the light-emitting element. A channel layer of the active element and the first type semiconductor pattern of the light-emitting element belong to the same layer. The optical layer covers the light-emitting element and the active element. The light guide structure is located on the optical layer and includes an in-coupling portion and an out-coupling portion, wherein an orthogonal projection of the in-coupling portion on the substrate is overlapped with an orthogonal projection of the light-emitting element on the substrate. A manufacturing method of the near-eye display device is also provided.

Abstract: A fastener structure includes a head portion, rod member and fitting member. The head portion has a lateral holding portion and vertical receiving portion. The rod member has a lateral attaching portion and engaging member. The rod member is penetratingly disposed at the receiving portion to allow the attaching portion to correspond in position to the holding portion. The fitting member is penetratingly disposed at the attaching portion and the holding portion to fit the head portion and the rod member together. To couple two objects together, the head portion drives an engaging portion of the rod member, such that the engaging portion penetrates one object before being fastened to the other object. To unfasten the objects, the head portion is moved reversely to remove the engaging portion from the other object, effecting separation of the objects, so as to achieve quick coupling and easy unfastening.

Abstract: A heat dissipation module and an assembly method thereof are introduced. The heat dissipation module includes a body, which is provided with a liquid cooler, and the heat dissipation module is disposed at a heat generator to perform heat dissipation. Thus, the heat dissipation module and the assembly method thereof provide a stable configuration and an efficiently improved heat dissipation effect.

Abstract: A display device includes a first image generating unit and a first waveguide glass. The first image generating unit is configured to emit first light. The first waveguide glass faces toward the first image generating unit. The first waveguide glass includes a first microstructure, two second microstructures and a third microstructure. The first microstructure is located between two ends at the same side of the two second microstructures. The third microstructure is located between the two second microstructures. The third microstructure has a first grating and a second grating. An extending direction of the first grating is different from an extending direction of the second grating. The second microstructure is configured to receive the first light of the first image generating unit transmitted through the first microstructure and transmit the first light to the third microstructure.

Abstract: An assembly module includes a first assembly mold, a second assembly mold and at least one coupling mold. The first assembly mold has at least one first setup portion, the second assembly mold has at least one second setup portion, and the second assembly mold corresponds to the first assembly mold. The coupling mold is removably disposed at a position corresponding to the at least one first setup portion, at least one second setup portion, or the least one first setup portion and the at least one second setup portion. The coupling mold is provided with a limiting portion, and the first assembly mold or the second assembly mold is provided with a corresponding limiting portion. The coupling mold provides mutual corresponding limiting or anti-rotation against the corresponding limiting portion by using the limiting portion.

Abstract: A head-up display includes an image generating unit and a waveguide glass. The waveguide glass faces toward the image generating unit. The waveguide glass includes a first microstructure, a second microstructure and a third microstructure. The first microstructure has a first width. The second microstructure is adjacent to the first microstructure. The third microstructure is adjacent to the second microstructure. The third microstructure has tiling areas adjacent to each other. A gap between the two adjacent tiling areas is less than half of the first width.

Abstract: The present disclosure relates to an image sensor including a first semiconductor layer having a first doping type. A second semiconductor layer having the first doping type is between sidewalls of the first semiconductor layer and extends vertically along the sidewalls of the first semiconductor layer from a bottom side of the first semiconductor layer toward a top side of the first semiconductor layer. A first doped region having the first doping type is in the first semiconductor layer and laterally beside the second semiconductor layer. The first doped region extends vertically along a sidewall of the second semiconductor layer. A second doped region having a second doping type is in the first semiconductor layer and laterally beside the first doped region. The second doped region extends vertically along a side of the first doped region and forms a p-n junction with the first doped region.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor. The image sensor includes a first chip bonded to a second chip. The first chip includes a semiconductor substrate. The first chip includes a first transistor cell and a second transistor cell. The second transistor cell is laterally spaced from the first transistor cell. A first through-substrate via (TSV) extends vertically through the semiconductor substrate. The first transistor cell is electrically coupled to the first TSV. A second TSV extends vertically through the first semiconductor substrate. The second transistor cell is electrically coupled to the second TSV. The second chip comprises a first readout circuit that is electrically coupled to the first TSV and the second TSV. The first readout circuit is disposed laterally between the first TSV and the second TSV. The first readout circuit is configured to receive a first signal from the first transistor cell.

Abstract: An assembly module, an assembly apparatus, and a method of operating the assembly module are introduced. The assembly module includes a first assembly die, a second assembly die and at least one engagement die. The first assembly die has a plurality of first fitting portions. The second assembly die has a plurality of second fitting portions and corresponds in position to the first assembly die. The engagement die is removably disposed at a related point of at least one first fitting portion, at a related point of at least one second fitting portion or at related points of at least one first fitting portion and at least one second fitting portion. Therefore, the assembly module is effective in fitting a component and an assembly target together, easy to operate, and conducive to quick assembly.

Abstract: A lateral locating device includes a body, which is for assembling in a first direction thereof to a first object. The body has in a second direction a fastening portion or a leaning portion for fastening connecting, interfering or bearing in the second direction a second object or another object. Thus, the body can be securely coupled at the first object, and the second object or the another object can be coupled or removed by using the fastening portion or the leaning portion, so as to complete coupling or separation of at least two objects, achieving the effect of repeated quick coupling and separation.

Abstract: The present disclosure provides an engaging connection structure and an engaging connection method thereof. The engaging connection structure includes at least one vertical insert portion and an assembly portion. The assembly portion is configured to be assembled at an object, and the vertical insert portion is configured for an insert to be inserted vertically therein. Thus, the engaging connection structure and the engaging connection method thereof of the present disclosure are enabled to provide a required object and an insert with a stable assembly effect.

Abstract: An assembly module, an assembly apparatus, and a method of operating the assembly module are introduced. The assembly module includes a first assembly die, a second assembly die and at least one engagement die. The first assembly die has a plurality of first fitting portions. The second assembly die has a plurality of second fitting portions and corresponds in position to the first assembly die. The engagement die is removably disposed at a related point of at least one first fitting portion, at a related point of at least one second fitting portion or at related points of at least one first fitting portion and at least one second fitting portion. Therefore, the assembly module is effective in fitting a component and an assembly target together, easy to operate, and conducive to quick assembly.

Abstract: Various embodiments of the present disclosure are directed towards a stacked complementary metal-oxide semiconductor (CMOS) image sensor with a high full well capacity (FWC). A first integrated circuit (IC) chip and a second IC chip are stacked with each other. The first IC chip comprises a first semiconductor substrate, and the second IC chip comprises a second semiconductor substrate. A pixel sensor is in and spans the first and second IC chips. The pixel sensor comprises a transfer transistor and a pinned photodiode adjoining the transfer transistor at the first semiconductor substrate, and further comprises a plurality of additional transistors (e.g., a reset transistor, a source-follower transistor, etc.) at the second semiconductor substrate. A bulk of the first semiconductor substrate and a bulk of the second semiconductor substrate are electrically isolated from each other and are configured to be biased with different voltages (e.g., a negative voltage and ground).

Abstract: A pull handle structure includes a carrier mounted on a first object, a pull handle movably assembled to the carrier, and a limiting section located on the pull handle for connecting to, interfering with or engaging with a second object. By operating the pull handle to move the carrier, the first object can be engaged with or separated from the second object. Therefore, the pull handle structure has the advantages of being securely lockable in place and operable in an easy, convenient, effortless and quick manner.

Abstract: A photovoltaic cell includes a germanium-containing well embedded in a single crystalline silicon substrate and extending to a proximal horizontal surface of the single crystalline silicon substrate, wherein germanium-containing well includes germanium at an atomic percentage greater than 50%. A silicon-containing capping structure is located on a top surface of the germanium-containing well and includes silicon at an atomic percentage greater than 42%. The silicon-containing capping structure prevents oxidation of the germanium-containing well. A photovoltaic junction may be formed within, or across, the trench by implanting dopants of a first conductivity type and dopants of a second conductivity type.

Abstract: An electronic device including a pixel array structure, a redistribution structure, and a plurality of conductive via structures is provided. The pixel array structure includes a plurality of signal lines. The redistribution structure overlaps the pixel array structure and includes a plurality of conductive lines. The conductive via structures electrically connect the signal lines of the pixel array structure and the conductive lines of the redistribution structure. At least one of the conductive via structures shares at least one conductive layer with the pixel array structure.

Abstract: A construction system for construction work is applied to set up a construction object on a target position, and includes a carrier device, a coating structure, and a setup structure. A feed structure is arranged on the carrier device and is used to provide an intermediate material. The coating structure is used to coat the target position with the intermediate material. The setup structure is used to set up the construction object on the target position via the intermediate material.

Abstract: The disclosure provides a joint structure, a joint module and a method of assembling a joint structure on an object. The joint structure includes a body part and an actuating piece. The actuating piece combines movably with the body part, the actuating piece has a first joint part, the first joint part is located outside of the body part, the first joint part can carry out a vertical movement, lateral movement or rotational movement. Accordingly, the body part of the disclosure can go with the actuating piece or the first joint part, and combine to the first object and the second object, or disengage from the first object and the second object for achieving the effect of combining or separating at least two objects.

Abstract: The present disclosure provides a communicating structure applied to a first communicating body and including a door assembly. The door assembly is assembled in the first communicating body, and includes a door movably connected to the first communicating body, and a connecting structure allowing movement of the door. The connecting structure includes an actuating portion, and the door is provided with a connecting portion. The actuating portion is for acting on the connecting portion or performing a lever operation on the connecting portion so as to move the door.