Abstract: A reconfigurable semiconductor memory apparatus may include a memory cell array including a plurality of sub arrays. The reconfigurable semiconductor memory apparatus may include an information storage unit configured to store status information for each sub array, and a reset address according to the status information.

Abstract: A refresh control device is disclosed, which relates to a technology for efficiently storing weak cell refresh addresses. The refresh control device includes a weak cell address storage circuit to store a weak address, a weak cell address control circuit, and a row address control circuit. The weak cell address control circuit outputs a weak enable signal and a row address by comparing a refresh address with the weak address, and only activates the refresh address according to the comparison result or activates both the refresh address and the row address. The row address control circuit controls a refresh operation by selectively activating a word line of a bank in response to the refresh address, the weak enable signal, and the row address.

Abstract: A memory apparatus includes a first memory bank, a second memory bank, a row decoder and repair circuit, and an input/output driver controller. The row decoder and repair circuit is coupled to the first and second memory banks in common. The row decoder and repair circuit generates a shared repair signal according to whether a word line disposed in a first memory bank is replaced with a word line disposed in a second memory bank. The input/output driver controller allows read or write operations for one of the first and second memory banks to be performed based on the shared repair signal and an operation signal.

Abstract: A semiconductor apparatus includes an individual chip designating code setting block configured to generate a plurality of individual chip designating code of different values; an individual chip activation block configured to enable an individual chip activation signal among a plurality of individual chip activation signals, which corresponds to individual chip designating code, when the individual chip designating code matches the individual chip control code; and a control block configured to set the individual chip control code or output chip selection address as the individual chip control code in response to chip selection fuse signals and test fuse signals.

Abstract: A reconfigurable semiconductor memory apparatus may include a memory cell array including a plurality of sub arrays. The reconfigurable semiconductor memory apparatus may include an information storage unit configured to store status information for each sub array, and a reset address according to the status information.

Abstract: A system for repairing a plurality of semiconductor chips each comprising a data storage region including electric fuses connected to the data storage regions of the plurality of semiconductor chips, a defect determination unit configured to read the data of a chip that is actually accessed and the data of an idle chip in the data storage regions, compare the actually accessed and read data with the data of the idle chip, and detect a defect based on a result of the comparison, a storage unit configured to store the defective position of the defect according to a result of the defect determination unit, and a repair unit configured to repair the defect through an E fuse connected to the position of the defect using a reset signal.

Abstract: A semiconductor integrated circuit includes a multi-chip package having a plurality of semiconductor chips. The semiconductor integrated circuit includes a signal line; and a signal loading compensation section in a semiconductor chip among the plurality of semiconductor chips, configured to apply a designed signal loading to the signal line in response to activation of a test signal. Here, the designed signal loading has a value corresponding to a signal loading component of another semiconductor chip among the plurality of semiconductor chips to the signal line.

Abstract: A system for repairing a plurality of semiconductor chips each comprising a data storage region including electric fuses connected to the data storage regions of the plurality of semiconductor chips, a defect determination unit configured to read the data of a chip that is actually accessed and the data of an idle chip in the data storage regions, compare the actually accessed and read data with the data of the idle chip, and detect a defect based on a result of the comparison, a storage unit configured to store the defective position of the defect according to a result of the defect determination unit, and a repair unit configured to repair the defect through an E fuse connected to the position of the defect using a reset signal.

Abstract: A fuse circuit includes an electric fuse coupled to a first voltage source; a low resistance unit coupled to the electric fuse and having a junction which is capable of breaking down; and a switching unit coupled between the low resistance unit and a second voltage source.

Abstract: A semiconductor memory apparatus includes a clock control unit configured to receive a first clock when an enable signal is activated and generate a second clock which has a cycle closer in length to a target clock cycle than the first clock; a DLL input clock generation unit configured to output one of the first clock and the second clock as a DLL input clock according to a DLL select signal; and an address/command input clock generation unit configured to output one of the first clock and the second clock as an AC input clock according to the enable signal.

Abstract: Provided is a semiconductor integrated circuit. The semiconductor integrated circuit comprises: a pair of interconnections; a fuse connecting the pair of interconnections; and one or more heat dissipation patterns connecting the pair of interconnections and are disposed around the fuse.

Abstract: A semiconductor package capable of being efficiently stacked and a method of manufacturing the same is presented. The semiconductor package includes a semiconductor chip, an insulation layer, and a through-electrode. The semiconductor chip has a first surface and a second surface, a circuit section in the semiconductor chip, an internal circuit pattern electrically connected to the circuit section, and a through-hole that passes through the internal circuit pattern and through the first and second surfaces. The insulation layer is on a through-hole of the semiconductor chip and has an opening which exposes the internal circuit pattern which was exposed by the through-hole. The through-electrode is in the through-hole and electrically coupled to the internal circuit pattern which is exposed through the opening of the insulation layer.

Abstract: The present invention discloses a circuit providing a power for a sense amplifier that stabilizes a power voltage supplied to the sense amplifier by compensating a noise generated in the power voltage when the sense amplifier operates with an selectively generated decoupling noise. The circuit providing a power for a sense amplifier includes a sense amplifying circuit sensing and amplifying data loaded on a bit line with a first power. A power supplying unit provides the first power to the sense amplifying circuit. A decoupling unit generates a decoupling noise with a second power and provides the decoupling noise to the first power voltage. The decoupling noise is maintained for a period including a time point of an operation of the sense amplifying circuit and a predetermined time thereafter.

Abstract: A semiconductor memory apparatus includes a clock control unit configured to receive a first clock when an enable signal is activated and generate a second clock which has a cycle closer in length to a target clock cycle than the first clock; a DLL input clock generation unit configured to output one of the first clock and the second clock as a DLL input clock according to a DLL select signal; and an address/command input clock generation unit configured to output one of the first clock and the second clock as an AC input clock according to the enable signal.

Abstract: A voltage supply apparatus includes a power noise sensing unit, a voltage selecting unit, a first power voltage supply unit and a second power voltage supply unit. The power noise sensing unit senses noise from first and second powers and outputs a power noise sensing signal. The voltage selecting unit outputs first and second driving signals in response to a voltage-supply-enable-signal and the power noise sensing signal. The first power voltage supply unit applies a voltage of the first power in response to the first and second driving signals. The second power voltage supply unit applies a voltage of the second power in response to the first and second driving signals.

Abstract: A semiconductor apparatus includes an individual chip designating code setting block configured to generate a plurality of individual chip designating code of different values; an individual chip activation block configured to enable an individual chip activation signal among a plurality of individual chip activation signals, which corresponds to individual chip designating code, when the individual chip designating code matches the individual chip control code; and a control block configured to set the individual chip control code or output chip selection address as the individual chip control code in response to chip selection fuse signals and test fuse signals.

Abstract: A fuse circuit includes an electric fuse coupled to a first voltage source; a low resistance unit coupled to the electric fuse and having a junction which is capable of breaking down; and a switching unit coupled between the low resistance unit and a second voltage source.

Abstract: Provided is a semiconductor integrated circuit. The semiconductor integrated circuit comprises: a pair of interconnections; a fuse connecting the pair of interconnections; and one or more heat dissipation patterns connecting the pair of interconnections and are disposed around the fuse.

Abstract: A semiconductor integrated circuit includes a multi-chip package having a plurality of semiconductor chips. The semiconductor integrated circuit includes a signal line; and a signal loading compensation section in a semiconductor chip among the plurality of semiconductor chips, configured to apply a designed signal loading to the signal line in response to activation of a test signal. Here, the designed signal loading has a value corresponding to a signal loading component of another semiconductor chip among the plurality of semiconductor chips to the signal line.

Abstract: The present invention discloses a circuit providing a power for a sense amplifier that stabilizes a power voltage supplied to the sense amplifier by compensating a noise generated in the power voltage when the sense amplifier operates with an selectively generated decoupling noise. The circuit providing a power for a sense amplifier includes a sense amplifying circuit sensing and amplifying data loaded on a bit line with a first power. A power supplying unit provides the first power to the sense amplifying circuit. A decoupling unit generates a decoupling noise with a second power and provides the decoupling noise to the first power voltage. The decoupling noise is maintained for a period including a time point of an operation of the sense amplifying circuit and a predetermined time thereafter.