Abstract: A wireless power transmission/reception system includes a wireless power transmission circuit and a wireless power reception circuit. The wireless power transmission circuit includes an oscillator, a DC-AC converter that converts a direct current to an alternating current and is turned on/off in response to a control signal, a power transmission coil that transmits AC power, a signal reception coil, and a signal receiver that transfers the control signal to the DC-AC converter. The wireless power reception circuit includes a power reception coil, a rectifier that converts an alternating current to a direct current and is turned on or off in response to the control signal, an control signal generator that generates the control signal, a signal transmission coil, and a signal transmitter that transmits the control signal through the signal transmission coil.

Abstract: A semiconductor integrated circuit includes a multi-chip package having a plurality of semiconductor chips. The semiconductor integrated circuit includes a signal line; and a signal loading compensation section in a semiconductor chip among the plurality of semiconductor chips, configured to apply a designed signal loading to the signal line in response to activation of a test signal. Here, the designed signal loading has a value corresponding to a signal loading component of another semiconductor chip among the plurality of semiconductor chips to the signal line.

Abstract: A system for repairing a plurality of semiconductor chips each comprising a data storage region including electric fuses connected to the data storage regions of the plurality of semiconductor chips, a defect determination unit configured to read the data of a chip that is actually accessed and the data of an idle chip in the data storage regions, compare the actually accessed and read data with the data of the idle chip, and detect a defect based on a result of the comparison, a storage unit configured to store the defective position of the defect according to a result of the defect determination unit, and a repair unit configured to repair the defect through an E fuse connected to the position of the defect using a reset signal.

Abstract: A semiconductor wafer includes at least one chip formed on a substrate, and a scribe line region surrounding the chip. The chip includes a device formation region, and a chip boundary region surrounding the device formation region and formed between the device formation region and the scribe line region. The chip boundary region includes a guard ring structure which physically separates the device formation region from the scribe line region. The guard ring structure includes a signal transfer element which transfers an electric signal between the device formation region and the scribe line region.

Abstract: A semiconductor integrated circuit includes: a semiconductor chip; a through-chip via passing through a conductive pattern disposed in the semiconductor chip and cutting the conductive pattern; and an insulation pattern disposed on an outer circumference surface of the through-chip via to insulate the conductive pattern from the through-chip via.

Abstract: A fuse circuit includes a plurality of fuse cells, an amplification unit, and a plurality of registers. The amplification unit is configured to sequentially amplify data stored in the fuse cells. The registers are configured to sequentially store data amplified by the amplification unit.

Abstract: A fuse circuit includes an electric fuse coupled to a first voltage source; a low resistance unit coupled to the electric fuse and having a junction which is capable of breaking down; and a switching unit coupled between the low resistance unit and a second voltage source.

Abstract: A semiconductor wafer includes at least one chip formed on a substrate, and a scribe line region surrounding the chip. The chip includes a device formation region, and a chip boundary region surrounding the device formation region and formed between the device formation region and the scribe line region. The chip boundary region includes a guard ring structure which physically separates the device formation region from the scribe line region. The guard ring structure includes a signal transfer element which transfers an electric signal between the device formation region and the scribe line region.

Abstract: A semiconductor integrated circuit includes: a semiconductor chip; a through-chip via passing through a conductive pattern disposed in the semiconductor chip and cutting the conductive pattern; and an insulation pattern disposed on an outer circumference surface of the through-chip via to insulate the conductive pattern from the through-chip via.

Abstract: A semiconductor wafer includes at least one chip formed on a substrate, and a scribe line region surrounding the chip. The chip includes a device formation region, and a chip boundary region surrounding the device formation region and formed between the device formation region and the scribe line region. The chip boundary region includes a guard ring structure which physically separates the device formation region from the scribe line region. The guard ring structure includes a signal transfer element which transfers an electric signal between the device formation region and the scribe line region.

Abstract: A semiconductor memory apparatus includes a clock control unit configured to receive a first clock when an enable signal is activated and generate a second clock which has a cycle closer in length to a target clock cycle than the first clock; a DLL input clock generation unit configured to output one of the first clock and the second clock as a DLL input clock according to a DLL select signal; and an address/command input clock generation unit configured to output one of the first clock and the second clock as an AC input clock according to the enable signal.

Abstract: Provided is a semiconductor integrated circuit. The semiconductor integrated circuit comprises: a pair of interconnections; a fuse connecting the pair of interconnections; and one or more heat dissipation patterns connecting the pair of interconnections and are disposed around the fuse.

Abstract: A semiconductor package capable of being efficiently stacked and a method of manufacturing the same is presented. The semiconductor package includes a semiconductor chip, an insulation layer, and a through-electrode. The semiconductor chip has a first surface and a second surface, a circuit section in the semiconductor chip, an internal circuit pattern electrically connected to the circuit section, and a through-hole that passes through the internal circuit pattern and through the first and second surfaces. The insulation layer is on a through-hole of the semiconductor chip and has an opening which exposes the internal circuit pattern which was exposed by the through-hole. The through-electrode is in the through-hole and electrically coupled to the internal circuit pattern which is exposed through the opening of the insulation layer.

Abstract: A semiconductor device includes an interface pad, and an antenna formed to surround the interface pad. The semiconductor device may further include a buffer configured to receive a first input signal applied to the interface pad, a driver configured to output a first output signal to the interface pad a receiver configured to receive a second input signal transferred to the antenna, and a transmitter configured to output a second output signal to the antenna.

Abstract: The present invention discloses a circuit providing a power for a sense amplifier that stabilizes a power voltage supplied to the sense amplifier by compensating a noise generated in the power voltage when the sense amplifier operates with an selectively generated decoupling noise. The circuit providing a power for a sense amplifier includes a sense amplifying circuit sensing and amplifying data loaded on a bit line with a first power. A power supplying unit provides the first power to the sense amplifying circuit. A decoupling unit generates a decoupling noise with a second power and provides the decoupling noise to the first power voltage. The decoupling noise is maintained for a period including a time point of an operation of the sense amplifying circuit and a predetermined time thereafter.

Abstract: A voltage supply apparatus includes a power noise sensing unit, a voltage selecting unit, a first power voltage supply unit and a second power voltage supply unit. The power noise sensing unit senses noise from first and second powers and outputs a power noise sensing signal. The voltage selecting unit outputs first and second driving signals in response to a voltage-supply-enable-signal and the power noise sensing signal. The first power voltage supply unit applies a voltage of the first power in response to the first and second driving signals. The second power voltage supply unit applies a voltage of the second power in response to the first and second driving signals.

Abstract: A fuse circuit includes a plurality of fuse cells, an amplification unit, and a plurality of registers. The amplification unit is configured to sequentially amplify data stored in the fuse cells. The registers are configured to sequentially store data amplified by the amplification unit.

Abstract: A semiconductor memory apparatus includes a clock control unit configured to receive a first clock when an enable signal is activated and generate a second clock which has a cycle closer in length to a target clock cycle than the first clock; a DLL input clock generation unit configured to output one of the first clock and the second clock as a DLL input clock according to a DLL select signal; and an address/command input clock generation unit configured to output one of the first clock and the second clock as an AC input clock according to the enable signal.

Abstract: A semiconductor integrated circuit includes: a semiconductor chip; a through-chip via passing through a conductive pattern disposed in the semiconductor chip and cutting the conductive pattern; and an insulation pattern disposed on an outer circumference surface of the through-chip via to insulate the conductive pattern from the through-chip via.

Abstract: A semiconductor wafer includes at least one chip formed on a substrate, and a scribe line region surrounding the chip. The chip includes a device formation region, and a chip boundary region surrounding the device formation region and formed between the device formation region and the scribe line region. The chip boundary region includes a guard ring structure which physically separates the device formation region from the scribe line region. The guard ring structure includes a signal transfer element which transfers an electric signal between the device formation region and the scribe line region.