Abstract: The present invention is related to a negative voltage generating circuit for reliably providing the semiconductor integrated circuit (IC) with a negative voltage. An electric charge pumping device generates a negative voltage by pumping an electric charge to a predetermined level supplied to one of a first node and a second node. A controlling device provides first and second pumping clock signal being clocked alternately every predetermined interval in response to a level of the negative voltage. A pumping controller controls an amount of electric charge supplied to the first node and the second node in response to the first and second pumping clock signals. Further, a reset controller resets the first node and the second node of the electric charge pumping means as the level of the negative voltage when the first and second pumping clock signals are inactivated.

Abstract: A semiconductor memory device reduces power consumption with maintaining quality of an internal power voltage and a core voltage. The semiconductor memory device reduces power consumption with sufficiently maintaining a core voltage during precharge.

Abstract: The present invention provides a power voltage supplier for stably supplying a noise-free power voltage without increasing a size of a reservoir capacitor by employing a sharing scheme of the reservoir capacitor. The power voltage supplier of a semiconductor memory device includes: a first power voltage supply line for supplying a first power voltage; a second power voltage supply line for supplying a second power voltage; a first reservoir capacitor for supplying the first and the second power voltages stably; and a reservoir capacitor controller for selectively connecting the first reservoir capacitor to the first power voltage supply line or the second power voltage supply line.

Abstract: The present invention provides a boosted voltage generator of a semiconductor device where a boosted voltage efficiency and drivability at a target boosted voltage level can be evaluated accurately by employing an enable signal generator. The boosted voltage generator includes a boosted voltage pad; a level detection means for detecting whether or not a present boosted voltage reaches a target boosted voltage level; an oscillation means for performing an oscillation mode in response to a signal outputted from the level detection means; a charge pumping means for outputting a level-controlled boosted voltage in response to a signal outputted from the oscillation means; and an enable signal generation means for operating the oscillation means in response to a signal outputted from the level detection means.

Abstract: A circuit and method for easily detecting skew of a transistor within a semiconductor device are provided. The circuit for detecting the skew of the transistor includes a linear voltage generating unit for outputting a linear voltage by using a first supply voltage, a first attenuation unit for reducing variation width of the linear voltage according to the performance of the transistor, a saturation voltage generating unit for outputting a saturation voltage by using a second supply voltage, and a comparison unit for comparing an output of the first attenuation unit and the saturation voltage.

Abstract: A delay detecting apparatus detects delay amounts of delay elements in a semiconductor device by using a test mode. The semiconductor device comprises a delay signal detecting unit for detecting delays of delay elements in the semiconductor device by using a signal that is synchronized with an external clock, and a delay signal outputting unit for outputting a delayed signal from the delay signal detecting unit to a data pad by using the signal that is synchronized with the external clock.

Abstract: The present invention discloses a skew detection device which can detect a skew of a transistor changed due to a driving voltage, a size and a process variable. The skew detection device includes a first potential level generator for outputting a first voltage, a second potential level generator for outputting a second voltage, a first level shifter for receiving the first voltage and outputting a first shift voltage, a second level shifter for receiving the second voltage and outputting a second shift voltage, and a comparator for comparing the first shift voltage with the second shift voltage. The first voltage is determined according to a drain-source current of a first MOS transistor operated in a linear region, and the second voltage is determined according to a drain-source current of a second MOS transistor operated in a saturation region.

Abstract: The present invention relates to an active driver for generating an internal voltage. In an active operation of a semiconductor device, after a voltage drop of a core voltage (VCORE) by consumed current of the core voltage (VCORE) is detected in a multi-step, a corresponding transistor for a driver is variably operated depending on a detected voltage drop level. Therefore, in an active operation, an increase in an active consumption current depending on an increase in the size of an output driver can be minimized.

Abstract: A semiconductor memory test device configured to reduce level variations of a core voltage and a pumping voltage by shorting an external power voltage and the pumping voltage according to input of a test signal in an operation life test or a burn-in test, and to control levels of the core voltage and a peri voltage according to a level of the external power voltage is disclosed herein. As a result, the semiconductor memory test device is configured to obtain a sufficient margin of the external power voltage and to adaptively transmit a stress voltage to 2.5 V/3.3 V DRAM.

Abstract: Disclosed is an internal voltage generator which generates a stable internal voltage using two power up sensing means. Clamp means outputs a first voltage. First and second power up sensing means sense the external applied to the semiconductor device and output first and second control signals, respectively. A first switch receives the first voltage and a switch controller receives the first and second control signals from the first and second power up sensing means and controls turn on/off of the first switch. A second switch is turned on/off according to the second control signal from the second power up sensing means and receives a second voltage. An amplifier selectively receives the first and second voltages from the first and second switches and outputs the second voltage.

Abstract: Disclosed is an internal voltage generator which generates a stable internal voltage using two power up sensing means. Clamp means outputs a first voltage. First and second power up sensing means sense the external applied to the semiconductor device and output first and second control signals, respectively. A first switch receives the first voltage and a switch controller receives the first and second control signals from the first and second power up sensing means and controls turn on/off of the first switch. A second switch is turned on/off according to the second control signal from the second power up sensing means and receives a second voltage. An amplifier selectively receives the first and second voltages from the first and second switches and outputs the second voltage.

Abstract: The present invention relates to an active driver for generating an internal voltage. In an active operation of a semiconductor device, after a voltage drop of a core voltage (VCORE) by consumed current of the core voltage (VCORE) is detected in a multi-step, a corresponding transistor for a driver is variably operated depending on a detected voltage drop level. Therefore, in an active operation, an increase in an active consumption current depending on an increase in the size of an output driver can be minimized.

Abstract: An internal voltage generating apparatus for a semiconductor memory device is described herein. The internal voltage generating apparatus is configured to execute an internal voltage margin test with a small number of pads by installing a forcing pad and fuse (or switch) in an initial reference voltage generating terminal during a multi-chip product test of the DRAM to cut down expenses, and to overcome load or noise due to the forcing pad by cutting (switching off) the fuse after a wafer level test during a normal operation.

Abstract: A semiconductor memory test device configured to reduce level variations of a core voltage and a pumping voltage by shorting an external power voltage and the pumping voltage according to input of a test signal in an operation life test or a burn-in test, and to control levels of the core voltage and a peri voltage according to a level of the external power voltage is disclosed herein. As a result, the semiconductor memory test device is configured to obtain a sufficient margin of the external power voltage and to adaptively transmit a stress voltage to 2.5 V/3.3 V DRAM.

Abstract: An internal voltage generating apparatus for a semiconductor memory device is described herein. The internal voltage generating apparatus is configured to execute an internal voltage margin test with a small number of pads by installing a forcing pad and fuse (or switch) in an initial reference voltage generating terminal during a multi-chip product test of the DRAM to cut down expenses, and to overcome load or noise due to the forcing pad by cutting (switching off) the fuse after a wafer level test during a normal operation.

Abstract: A method for fabricating a semiconductor device is disclosed. In a process for fabricating a CMOS transistor of a high integrated semiconductor device and a cell of a DRAM, a process for forming a dual gate electrode having a layered structure of a tungsten layer and a polysilicon layer includes the steps of forming a gate electrode shape from an undoped polysilicon layer, forming an insulating film spacer at sidewalls of the polysilicon layer, forming an LDD region, removing a portion of the undoped polysilicon layer to leave a predetermined thickness and to form an opening in which the tungsten layer will be formed, and respectively implanting different impurity ions into the undoped polysilicon layer respectively formed in the PMOS region and the NMOS region before forming the tungsten layer. Thus, it is possible to prevent etching residue from occurring and also prevent the semiconductor substrate from being damaged.

Abstract: There is disclosed a method of manufacturing a CMOS transistor, by which ion implantation process is selectively performed to the gate formed region of a polysilicon film after a NMOS transistor region and a PMOS transistor region are defined in the process of manufacturing a CMOS transistor. Thus, it can obtain a reliable device by solving the problem occurring when polysilicon films doped with different impurities are simultaneously etched and the problem that a tungsten film is oxidized due to a selective oxidization process after forming a tungsten gate electrode.

Abstract: A method for fabricating a semiconductor device is disclosed. In a process for fabricating a CMOS transistor of a high integrated semiconductor device and a cell of a DRAM, a process for forming a dual gate electrode having a layered structure of a tungsten layer and a polysilicon layer includes the steps of forming a gate electrode shape from an undoped polysilicon layer, forming an insulating film spacer at sidewalls of the polysilicon layer, forming an LDD region, removing a portion of the undoped polysilicon layer to leave a predetermined thickness and to form an opening in which the tungsten layer will be formed, and respectively implanting different impurity ions into the undoped polysilicon layer respectively formed in the PMOS region and the NMOS region before forming the tungsten layer. Thus, it is possible to prevent etching residue from occurring and also prevent the semiconductor substrate from being damaged.