Patents by Inventor Jun He
Jun He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20260260093Abstract: The present disclosure provides a model training method based on a graph neural network, and the method includes: acquiring a first training graph and a label corresponding to the first training graph, wherein the first training graph is a relationship graph corresponding to training multimedia content, or the first training graph is a relationship graph corresponding to a training item; obtaining a position feature, a structure feature, and a node feature of the first training graph based on the first training graph; fusing the position feature, the structure feature, and the node feature, to obtain a fused feature; and training a target model based on the GNN according to the fused feature and the label.Type: ApplicationFiled: August 4, 2023Publication date: September 3, 2026Inventors: Yibo ZHU, Yangrui CHEN, Jun HE, Yuan LIN, Yanghua PENG
-
Patent number: 12727121Abstract: One aspect of the present disclosure pertains to an integrated circuit (IC) structure. The IC structure includes a die and an integrated heat sink structure disposed over the die. In some embodiments, the integrated heat sink structure includes a first closed-loop microchannel structure adjacent to the die and a second closed-loop microchannel structure disposed over the first closed-loop microchannel structure. In an example, the second closed-loop microchannel structure is disposed further away from the die than the first closed-loop microchannel structure. In some implementations, a plurality of microchannels and a micromixer chamber collectively provide the first and second closed-loop microchannel structures.Type: GrantFiled: May 9, 2024Date of Patent: September 1, 2026Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chien Hao Hsu, Kuo-Chin Chang, Kathy Wei Yan, Jun He
-
Publication number: 20260252998Abstract: A journey map system is configured to employ a machine-learning model to assign category tags to historical journey maps. The journey map system then generates clusters based on similarities between these journey maps. Effectiveness of these clusters in performing an operation is determined by the journey map system using performance indicator data. The journey map system identifies representative journey maps based on the performance indicator data, the clusters, and the category tags. Finally, the journey map system generates insights using a language model implemented with machine learning.Type: ApplicationFiled: February 27, 2025Publication date: August 27, 2026Applicant: Adobe Inc.Inventors: Jun He, Yantao Zheng, Xinyue Liu, Tingting Xu, Sonali Surange, Katrina Shanti Patel
-
Patent number: 12719828Abstract: A video stream acquisition method, apparatus and system, a device and a medium are provided. The video stream acquisition method is applied to a user terminal and includes: sending a stream pulling information acquisition request to a media server, to make the media server determine target stream pulling information based on a generated domain name; acquiring the target stream pulling information, performing a domain name resolution on the target stream pulling information based on a preset domain name resolution method, and obtaining the IP address of the target intranet edge server; and based on the IP address of the target intranet edge server, sending a target stream pulling request to the target intranet edge server, and acquiring a target video stream returned by the target intranet edge server based on the target stream pulling request.Type: GrantFiled: February 21, 2023Date of Patent: August 25, 2026Assignee: BEIJING BYTEDANCE NETWORK TECHNOLOGY CO., LTD.Inventors: Chenyu Li, Decai Liu, Yongkang Xu, Youlun Zhang, Zhaofei Wang, Jun He
-
Publication number: 20260246441Abstract: A filter includes a first port, a second port and at least one filtering unit. Each filtering unit includes a T network and a resonator. The T network includes a first capacitive element, a second capacitive element and a first element. The first capacitive element and the second capacitive element are connected in series between the first port and the second port, the first element is connected to a node between the first capacitive element and the second capacitive element, and the resonator is connected in parallel with T the network.Type: ApplicationFiled: July 24, 2024Publication date: August 20, 2026Inventors: Chenggong HE, Qilin SHI, Jian NIU, Chengjie ZUO, Jun HE
-
Patent number: 12713560Abstract: One aspect of the present disclosure pertains to an integrated circuit (IC) structure. The IC structure includes a die and an integrated heat sink structure disposed over the die. In some embodiments, the integrated heat sink structure includes a first closed-loop microchannel structure adjacent to the die and a second closed-loop microchannel structure disposed over the first closed-loop microchannel structure. In an example, the second closed-loop microchannel structure is disposed further away from the die than the first closed-loop microchannel structure. In some implementations, a plurality of microchannels and a micromixer chamber collectively provide the first and second closed-loop microchannel structures.Type: GrantFiled: July 23, 2025Date of Patent: August 18, 2026Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chien Hao Hsu, Kuo-Chin Chang, Kathy Wei Yan, Jun He
-
Publication number: 20260239989Abstract: Methods and apparatus for package level hybrid electromagnetic interference (EMI) shields are disclosed. A disclosed example shield for a die package includes a first shield portion defining a first section of a perimeter of the EMI shield, the first shield portion including a first EMI absorbing material with a first characteristic, and a second shield portion defining a second section of the perimeter, the second shield portion including a second EMI absorbing material with a second characteristic different from the first characteristic, the first and second shield portions to be electrically coupled to a ground plane of the die package when the EMI shield is coupled to the die package.Type: ApplicationFiled: March 7, 2025Publication date: August 13, 2026Inventors: Dong-Ho Han, Alonso Rodriguez Chacon, Quek Liang Wee, Jerrod Peterson, Jose Diaz, Bernardo Mora Villalobos, Bala Subramanya, Boon Ping KOH, Jun He
-
Publication number: 20260221597Abstract: A fast-charging secondary battery includes an electrode assembly. The electrode assembly includes a positive electrode plate, a negative electrode plate, and a separator. The positive electrode plate includes a positive electrode current collector, the positive electrode current collector integrally extending to form a plurality of positive electrode tabs. The negative electrode plate includes a negative electrode current collector, the negative electrode current collector integrally extending to form a plurality of negative electrode tabs. The separator includes a separator substrate, a first adhesive coating layer, and a second adhesive coating layer. The first adhesive coating layer contains a first polymer binder, an average particle size of the first polymer binder being in a range of 0.3 ?m to 3 ?m. The second adhesive coating layer contains a second polymer binder, an average particle size of the second polymer binder being in a range of 4 ?m to 15 ?m.Type: ApplicationFiled: March 24, 2026Publication date: July 30, 2026Applicant: NINGDE AMPEREX TECHNOLOGY LIMITEDInventor: Jun HE
-
Patent number: 12690440Abstract: One aspect of the present disclosure pertains to an IC packaging structure that includes a bottom circuit structure having first semiconductor devices on a first substrate, a first interconnect structure over the first semiconductor devices, and a first bonding structure over the first interconnect structure; and a top circuit structure having second semiconductor devices on a second substrate, a second interconnect structure underlying the second semiconductor devices, and a second bonding structure underlying the second interconnect structure. The first bonding structure includes a first metal feature having a first crystalline bulk layer of a metal and a first amorphous surface layer of the metal. The second bonding structure includes a second metal feature having a second crystalline bulk layer of the metal and a second amorphous surface layer of the metal. The top circuit structure is bonded to the bottom circuit structure through the first and second amorphous surface layers.Type: GrantFiled: September 13, 2023Date of Patent: July 21, 2026Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Jui Shen Chang, Yu-Chang Lai, Chen-Nan Chiu, Yao-Chun Chuang, Jun He
-
Patent number: 12690476Abstract: An adhesion layer may be formed over portions of a redistribution layer (RDL) in a redistribution structure of a semiconductor device package. The portions of the RDL over which the adhesion layer is formed may be located in the “shadow” of (e.g., the areas under and/or over and within the perimeter of) one or more through insulator layers (TIVs) that are connected with the redistribution layer structure. The adhesion layer, along with a seed layer on which the portions of the RDL are formed, encapsulate the portions of the RDL in the shadow of the one or more TIVs, which promotes and/or increases adhesion between the portions of the RDL and the polymer layers of the redistribution structure.Type: GrantFiled: July 29, 2022Date of Patent: July 21, 2026Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ting-Ting Kuo, Li-Hsien Huang, Tien-Chung Yang, Yao-Chun Chuang, Yinlung Lu, Jun He
-
Patent number: 12688373Abstract: The present disclosure relates to systems, methods, and non-transitory computer readable media that utilize machine learning to generate subject lines from subject line keywords. In one or more embodiments, the disclosed systems receive, from a client device, one or more subject line keywords. Additionally, the disclosed systems generate, utilizing a subject generation machine-learning model having learned parameters, a subject line by selecting one or more words for the subject line from a word distribution based on the one or more subject line keywords. The disclosed systems further provide, for display on the client device, the subject line.Type: GrantFiled: October 27, 2022Date of Patent: July 21, 2026Assignee: Adobe Inc.Inventors: Suofei Wu, Jun He, Zhenyu Yan
-
Publication number: 20260182423Abstract: A semiconductor device with a multi-tier construction includes a first tier having a first die, a second die spaced apart from the first die in a first direction and a fill material therebetween. A second tier overlays the first tier, and includes a bridge die partially overlaying the fill material and the first and second dies. The bridge die provides an electrical interconnection between the first and second dies in the first tier. The device also has a first protective structure aligned with a first interface between an end of the first die and the fill material that includes a first part formed on a first side of the first die at the end of the first die; and a second part formed on a first side of the bridge die. The first and second parts are aligned and form the first protective structure, mitigating cracking near the bridge die.Type: ApplicationFiled: February 10, 2026Publication date: June 25, 2026Inventors: Li-Hsien Huang, Jun He, Yinlung Lu, Yao-Chun Chuang
-
Publication number: 20260176640Abstract: Provided is a promoter, which has a nucleotide sequence shown in SEQ ID NO. 1. The promoter is obtained by means of rationally designing the promoter of a dapA gene, has obviously reduced transcriptional activity and can be used for the weakened expression of microorganism genes. Substituting the original promoters of the dapA gene, a ddh gene, an ilvA gene, a tdcB gene and a gltA gene in Corynebacterium glutamicum by using the promoter enables the expression levels of these genes to be significantly reduced, the carbon metabolic in a recombinant microorganism constructed thereby flows more to a threonine anabolism pathway, and the recombinant microorganism has a significantly improved production of threonine in comparison with an original strain and has good growth performance.Type: ApplicationFiled: December 28, 2022Publication date: June 25, 2026Inventors: Pei KANG, Zhiquan WANG, Weibo GONG, Jun HE, Yan LI
-
Patent number: 12650295Abstract: A scattering measurement method and a scattering measurement device are disclosed. In the scattering measurement method, wide-band IR measurement light is directed onto a substrate and then passes through a surface of the substrate and reaches a unit under measurement. The IR measurement light has a wavelength in the range of 2 ?m to 7.5 ?m, or of 25 ?m to 35 ?m. Scattered IR measurement light is then received from the substrate and the unit under measurement, from which characterizing parameters of the unit under measurement are determined.Type: GrantFiled: August 5, 2024Date of Patent: June 9, 2026Assignee: HANGZHOU HFC SEMICONDUCTOR CO.Inventors: Zheng Zou, Jun He, Lezhong Wu
-
Publication number: 20260155045Abstract: The present application discloses a method, an electronic device, and a storage medium for determining traffic risk value. In the method, by means of real-time vehicle information of vehicles within the traffic-accident prone area, first real-time risk values of other vehicles to a target vehicle can be determined; by means of the real-time vehicle information and real-time environmental information, a second real-time risk value of a traffic-accident prone area can be determined; when the first real-time risk values or the second real-time risk value increase, a target real-time risk value increases accordingly.Type: ApplicationFiled: January 28, 2026Publication date: June 4, 2026Inventors: Shangyun YANG, Chuanyu LV, Chunyang LIU, Jun HE, Shaojie XUE
-
Publication number: 20260154290Abstract: Providing Quality of Service (QoS) for replicating datasets including: receiving, by a target data repository from a source data repository, a checkpoint describing one or more updates to one or more datasets stored in the source data repository and the target data repository; adding, by the target data repository, the checkpoint to a first queue for checkpoints directed to one or more volumes in the target data repository, wherein the first queue is included in a plurality of queues for the target data repository; selecting, by the target data repository, one or more queues from the plurality of queues; and servicing an operation from each of the selected one or more queues.Type: ApplicationFiled: January 22, 2026Publication date: June 4, 2026Inventors: DANIEL SONNER, JUN HE, ZONG WANG, JOHN COLGROVE, MATTHEW FAY
-
Publication number: 20260156780Abstract: A two-phase cooling system includes an enclosure with a first volume, a second volume, and a heat source located in the first volume. The first volume is configured to contain a liquid coolant such that the liquid coolant is in contact with the heat source, and the second volume is configured to contain a vapor of the liquid coolant. The two-phase cooling system includes a condenser located in the second volume that removes heat from the vapor so that the vapor condenses into a liquid that returns to the first volume. A deflector located in the first volume controls a path of vapor generated by the heat source. A method of cooling a heat source includes diverting, with the deflector, a fraction of vapor generated by a first component away from a second component, thus avoiding decrease in liquid coolant density near the second component thereby increasing cooling efficiency.Type: ApplicationFiled: November 29, 2024Publication date: June 4, 2026Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ching WANG, Bang-Li WU, Chien-Chang WANG, Kuo-Chin CHANG, Kathy Wei YAN, Jun HE
-
Publication number: 20260150675Abstract: A package structure and method for manufacturing the same are provided. The package structure includes a package component and a protruding feature attached to the package component. The package structure further includes a lid disposed over the package component and the protruding feature and a first thermal interface material under a bottom surface of the lid and at a first side of the protruding feature. The package structure includes a second thermal interface material. In addition, the second thermal interface material includes a first portion under the bottom surface of the lid and at a second side of the protruding feature, a second portion over a bottom portion of the lid, and a third portion through the bottom portion of the lid and connecting with the first portion and the second portion.Type: ApplicationFiled: November 22, 2024Publication date: May 28, 2026Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Bang-Li WU, Chien-Chang WANG, Ching WANG, Kuo-Chin CHANG, Kathy Wei YAN, Jun HE
-
Publication number: 20260121674Abstract: Provided is an apparatus including interface circuitry, machine-readable instructions, and processing circuitry. The processing circuitry is configured to execute the machine-readable instructions to receive data indicating a frequency range used by a computing platform for wireless communication. The computing platform includes a notch filter for filtering platform noise from communication signals of the wireless communication. The machine-readable instructions further include instructions to search a database based on the received data. The comprises multiple frequency ranges for a respective notch filter configuration. The machine-readable instructions further include instructions to, if the database comprises a notch filter configuration for the frequency range of the received data, apply the respective notch filter configuration to the notch filter.Type: ApplicationFiled: December 18, 2024Publication date: April 30, 2026Inventors: Dong-Ho HAN, Hagay BAREL, Shlomi VITURI, Noam KOGOS, Michael SHUSTERMAN, Joy PODDAR, Amit ZEEVI, Jun HE
-
Publication number: 20260115645Abstract: A multistage uniform temperature phase change absorption tower for capturing high-concentration carbon dioxide is provided, including an absorption tower, where the absorption tower is provided with multiple inlets, packing layers, and redistributors distributed from top to bottom; a phase separation tank, where a bottom of the phase separation tank is in communication with a bottom of the absorption tower through the pipelines, and a top of the phase separation tank is in communication with the third inlet and the first inlet through the pipelines; a heat exchanger, where the heat exchanger is in communication with the bottom of the phase separation tank through a rich liquid pump, and the heat exchanger is in communication with the fourth inlet and the second inlet through the pipelines; and a desorption tower, where the desorption tower is connected with a reboiler and connected with the heat exchanger through the pipelines.Type: ApplicationFiled: August 15, 2025Publication date: April 30, 2026Inventors: Tingyu ZHU, Wenqing XU, Yang YANG, Jun HE, Zanbu GENG