Patents by Inventor Jun He
Jun He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20260289188Abstract: The present disclosure relates to systems, methods, and non-transitory computer readable media that utilize machine learning to generate subject lines from subject line keywords. In one or more embodiments, the disclosed systems receive, from a client device, one or more subject line keywords. Additionally, the disclosed systems generate, utilizing a subject generation machine-learning model having learned parameters, a subject line by selecting one or more words for the subject line from a word distribution based on the one or more subject line keywords. The disclosed systems further provide, for display on the client device, the subject line.Type: ApplicationFiled: May 26, 2026Publication date: September 24, 2026Inventors: Suofei Wu, Jun He, Zhenyu Yan
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Publication number: 20260279920Abstract: A secondary battery includes an electrode assembly which includes a positive electrode sheet, a negative electrode sheet, and a separator. The positive electrode sheet includes a positive electrode current collector and a positive electrode active material layer. The positive electrode active material layer includes a positive electrode active material. The negative electrode sheet includes a negative electrode current collector and a negative electrode active material layer. The negative electrode active material layer includes a negative electrode active material. The positive electrode current collector as a whole extends to form a plurality of positive electrode tabs, and the negative electrode current collector as a whole extends to form a plurality of negative electrode tabs. A coating weight of the positive electrode active material layer is Wz, a coating weight of the negative electrode active material layer is Wf, and Wz and Wf satisfy: 1.6Wf?Wz?2.2Wf, and 3.25 mg/cm2?Wf?5.84 mg/cm2.Type: ApplicationFiled: May 8, 2026Publication date: September 17, 2026Applicant: Ningde Amperex Technology LimitedInventor: Jun HE
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Publication number: 20260279893Abstract: A secondary battery includes a positive electrode sheet, a negative electrode sheet, a separator, and an electrolyte, where the positive electrode sheet includes a positive electrode active material layer. The negative electrode sheet includes a negative electrode active material layer. A coating weight of the positive electrode active material layer is Wz, a coating weight of the negative electrode active material layer is Wf, and Wz and Wf satisfy: 1.6Wf?Wz?2.2Wf, and 3.25 mg/cm2?Wf?5.84 mg/cm2. The separator includes a separator substrate, a first adhesive coating, and a second adhesive coating, where the first adhesive coating and the second adhesive coating are respectively provided on two sides of the separator substrate. The electrolyte includes chain carboxylate. Based on a mass of the electrolyte, a mass percentage of the chain carboxylate is 6% to 56%.Type: ApplicationFiled: May 7, 2026Publication date: September 17, 2026Applicant: Ningde Amperex Technology LimitedInventors: Jun HE, Manman LIU
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Publication number: 20260279757Abstract: A secondary battery includes a positive electrode sheet including a positive electrode active material, and a negative electrode sheet including a negative electrode active material, where Dv99 of the positive electrode active material is 27 ?m to 33 ?m, and Dv99 of the negative electrode active material is 23 ?m to 28 ?m; a separator includes a separator substrate, a first adhesive coating and a second adhesive coating, where the first adhesive coating and the second adhesive coating are respectively provided on two sides of the separator substrate, the first adhesive coating includes a first polymer binder, an average particle size of the first polymer binder is 0.3 ?m to 3 ?m, the second adhesive coating includes a second polymer binder, and an average particle size of the second polymer binder is 10 ?m to 38 ?m; and an electrolyte includes an organic solvent, a lithium salt, and an additive.Type: ApplicationFiled: May 8, 2026Publication date: September 17, 2026Applicant: Ningde Amperex Technology LimitedInventor: Jun HE
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Publication number: 20260279804Abstract: A secondary battery includes a positive electrode plate, a negative electrode plate, and a separator, where the positive electrode plate includes a positive electrode active material layer, the positive electrode active material layer including a positive electrode active material; and the negative electrode plate includes a negative electrode active material layer, the negative electrode active material layer including a negative electrode active material. A coating weight of the positive electrode active material layer is Wz, and a coating weight of the negative electrode active material layer is Wf, satisfying: 1.6Wf?Wz?2.2Wf, and 3.25 mg/cm2?Wf?5.84 mg/cm2. Dv99 of the positive electrode active material is 27 ?m to 33 ?m, and Dv99 of the negative electrode active material is 23 ?m to 28 ?m. The separator includes a separator substrate, a first adhesive coating, and a second adhesive coating.Type: ApplicationFiled: May 8, 2026Publication date: September 17, 2026Applicant: Ningde Amperex Technology LimitedInventors: Jun HE, Manman LIU
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Publication number: 20260279892Abstract: A secondary battery includes a positive electrode sheet, a negative electrode sheet, and an electrolyte. The positive electrode sheet includes a positive electrode current collector and a positive electrode active material layer. The negative electrode sheet includes a negative electrode current collector and a negative electrode active material layer. The positive electrode current collector integrally extends to form multiple positive electrode tabs. The negative electrode current collector integrally extends to form multiple negative electrode tabs. The positive electrode active material layer includes a positive electrode active material, and Dv99 of the positive electrode active material is 27 ?m to 33 ?m. The negative electrode sheet includes the negative electrode active material layer, the negative electrode active material layer includes a negative electrode active material, and Dv99 of the negative electrode active material is 23 ?m to 28 ?m.Type: ApplicationFiled: May 7, 2026Publication date: September 17, 2026Applicant: Ningde Amperex Technology LimitedInventors: Jun HE, Chao GAO
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Publication number: 20260260093Abstract: The present disclosure provides a model training method based on a graph neural network, and the method includes: acquiring a first training graph and a label corresponding to the first training graph, wherein the first training graph is a relationship graph corresponding to training multimedia content, or the first training graph is a relationship graph corresponding to a training item; obtaining a position feature, a structure feature, and a node feature of the first training graph based on the first training graph; fusing the position feature, the structure feature, and the node feature, to obtain a fused feature; and training a target model based on the GNN according to the fused feature and the label.Type: ApplicationFiled: August 4, 2023Publication date: September 3, 2026Inventors: Yibo ZHU, Yangrui CHEN, Jun HE, Yuan LIN, Yanghua PENG
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Patent number: 12727121Abstract: One aspect of the present disclosure pertains to an integrated circuit (IC) structure. The IC structure includes a die and an integrated heat sink structure disposed over the die. In some embodiments, the integrated heat sink structure includes a first closed-loop microchannel structure adjacent to the die and a second closed-loop microchannel structure disposed over the first closed-loop microchannel structure. In an example, the second closed-loop microchannel structure is disposed further away from the die than the first closed-loop microchannel structure. In some implementations, a plurality of microchannels and a micromixer chamber collectively provide the first and second closed-loop microchannel structures.Type: GrantFiled: May 9, 2024Date of Patent: September 1, 2026Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chien Hao Hsu, Kuo-Chin Chang, Kathy Wei Yan, Jun He
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Publication number: 20260252998Abstract: A journey map system is configured to employ a machine-learning model to assign category tags to historical journey maps. The journey map system then generates clusters based on similarities between these journey maps. Effectiveness of these clusters in performing an operation is determined by the journey map system using performance indicator data. The journey map system identifies representative journey maps based on the performance indicator data, the clusters, and the category tags. Finally, the journey map system generates insights using a language model implemented with machine learning.Type: ApplicationFiled: February 27, 2025Publication date: August 27, 2026Applicant: Adobe Inc.Inventors: Jun He, Yantao Zheng, Xinyue Liu, Tingting Xu, Sonali Surange, Katrina Shanti Patel
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Patent number: 12719828Abstract: A video stream acquisition method, apparatus and system, a device and a medium are provided. The video stream acquisition method is applied to a user terminal and includes: sending a stream pulling information acquisition request to a media server, to make the media server determine target stream pulling information based on a generated domain name; acquiring the target stream pulling information, performing a domain name resolution on the target stream pulling information based on a preset domain name resolution method, and obtaining the IP address of the target intranet edge server; and based on the IP address of the target intranet edge server, sending a target stream pulling request to the target intranet edge server, and acquiring a target video stream returned by the target intranet edge server based on the target stream pulling request.Type: GrantFiled: February 21, 2023Date of Patent: August 25, 2026Assignee: BEIJING BYTEDANCE NETWORK TECHNOLOGY CO., LTD.Inventors: Chenyu Li, Decai Liu, Yongkang Xu, Youlun Zhang, Zhaofei Wang, Jun He
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Publication number: 20260246441Abstract: A filter includes a first port, a second port and at least one filtering unit. Each filtering unit includes a T network and a resonator. The T network includes a first capacitive element, a second capacitive element and a first element. The first capacitive element and the second capacitive element are connected in series between the first port and the second port, the first element is connected to a node between the first capacitive element and the second capacitive element, and the resonator is connected in parallel with T the network.Type: ApplicationFiled: July 24, 2024Publication date: August 20, 2026Inventors: Chenggong HE, Qilin SHI, Jian NIU, Chengjie ZUO, Jun HE
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Patent number: 12713560Abstract: One aspect of the present disclosure pertains to an integrated circuit (IC) structure. The IC structure includes a die and an integrated heat sink structure disposed over the die. In some embodiments, the integrated heat sink structure includes a first closed-loop microchannel structure adjacent to the die and a second closed-loop microchannel structure disposed over the first closed-loop microchannel structure. In an example, the second closed-loop microchannel structure is disposed further away from the die than the first closed-loop microchannel structure. In some implementations, a plurality of microchannels and a micromixer chamber collectively provide the first and second closed-loop microchannel structures.Type: GrantFiled: July 23, 2025Date of Patent: August 18, 2026Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chien Hao Hsu, Kuo-Chin Chang, Kathy Wei Yan, Jun He
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Publication number: 20260239989Abstract: Methods and apparatus for package level hybrid electromagnetic interference (EMI) shields are disclosed. A disclosed example shield for a die package includes a first shield portion defining a first section of a perimeter of the EMI shield, the first shield portion including a first EMI absorbing material with a first characteristic, and a second shield portion defining a second section of the perimeter, the second shield portion including a second EMI absorbing material with a second characteristic different from the first characteristic, the first and second shield portions to be electrically coupled to a ground plane of the die package when the EMI shield is coupled to the die package.Type: ApplicationFiled: March 7, 2025Publication date: August 13, 2026Inventors: Dong-Ho Han, Alonso Rodriguez Chacon, Quek Liang Wee, Jerrod Peterson, Jose Diaz, Bernardo Mora Villalobos, Bala Subramanya, Boon Ping KOH, Jun He
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Publication number: 20260221597Abstract: A fast-charging secondary battery includes an electrode assembly. The electrode assembly includes a positive electrode plate, a negative electrode plate, and a separator. The positive electrode plate includes a positive electrode current collector, the positive electrode current collector integrally extending to form a plurality of positive electrode tabs. The negative electrode plate includes a negative electrode current collector, the negative electrode current collector integrally extending to form a plurality of negative electrode tabs. The separator includes a separator substrate, a first adhesive coating layer, and a second adhesive coating layer. The first adhesive coating layer contains a first polymer binder, an average particle size of the first polymer binder being in a range of 0.3 ?m to 3 ?m. The second adhesive coating layer contains a second polymer binder, an average particle size of the second polymer binder being in a range of 4 ?m to 15 ?m.Type: ApplicationFiled: March 24, 2026Publication date: July 30, 2026Applicant: NINGDE AMPEREX TECHNOLOGY LIMITEDInventor: Jun HE
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Patent number: 12690440Abstract: One aspect of the present disclosure pertains to an IC packaging structure that includes a bottom circuit structure having first semiconductor devices on a first substrate, a first interconnect structure over the first semiconductor devices, and a first bonding structure over the first interconnect structure; and a top circuit structure having second semiconductor devices on a second substrate, a second interconnect structure underlying the second semiconductor devices, and a second bonding structure underlying the second interconnect structure. The first bonding structure includes a first metal feature having a first crystalline bulk layer of a metal and a first amorphous surface layer of the metal. The second bonding structure includes a second metal feature having a second crystalline bulk layer of the metal and a second amorphous surface layer of the metal. The top circuit structure is bonded to the bottom circuit structure through the first and second amorphous surface layers.Type: GrantFiled: September 13, 2023Date of Patent: July 21, 2026Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Jui Shen Chang, Yu-Chang Lai, Chen-Nan Chiu, Yao-Chun Chuang, Jun He
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Patent number: 12690476Abstract: An adhesion layer may be formed over portions of a redistribution layer (RDL) in a redistribution structure of a semiconductor device package. The portions of the RDL over which the adhesion layer is formed may be located in the “shadow” of (e.g., the areas under and/or over and within the perimeter of) one or more through insulator layers (TIVs) that are connected with the redistribution layer structure. The adhesion layer, along with a seed layer on which the portions of the RDL are formed, encapsulate the portions of the RDL in the shadow of the one or more TIVs, which promotes and/or increases adhesion between the portions of the RDL and the polymer layers of the redistribution structure.Type: GrantFiled: July 29, 2022Date of Patent: July 21, 2026Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ting-Ting Kuo, Li-Hsien Huang, Tien-Chung Yang, Yao-Chun Chuang, Yinlung Lu, Jun He
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Patent number: 12688373Abstract: The present disclosure relates to systems, methods, and non-transitory computer readable media that utilize machine learning to generate subject lines from subject line keywords. In one or more embodiments, the disclosed systems receive, from a client device, one or more subject line keywords. Additionally, the disclosed systems generate, utilizing a subject generation machine-learning model having learned parameters, a subject line by selecting one or more words for the subject line from a word distribution based on the one or more subject line keywords. The disclosed systems further provide, for display on the client device, the subject line.Type: GrantFiled: October 27, 2022Date of Patent: July 21, 2026Assignee: Adobe Inc.Inventors: Suofei Wu, Jun He, Zhenyu Yan
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Publication number: 20260176640Abstract: Provided is a promoter, which has a nucleotide sequence shown in SEQ ID NO. 1. The promoter is obtained by means of rationally designing the promoter of a dapA gene, has obviously reduced transcriptional activity and can be used for the weakened expression of microorganism genes. Substituting the original promoters of the dapA gene, a ddh gene, an ilvA gene, a tdcB gene and a gltA gene in Corynebacterium glutamicum by using the promoter enables the expression levels of these genes to be significantly reduced, the carbon metabolic in a recombinant microorganism constructed thereby flows more to a threonine anabolism pathway, and the recombinant microorganism has a significantly improved production of threonine in comparison with an original strain and has good growth performance.Type: ApplicationFiled: December 28, 2022Publication date: June 25, 2026Inventors: Pei KANG, Zhiquan WANG, Weibo GONG, Jun HE, Yan LI
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Publication number: 20260182423Abstract: A semiconductor device with a multi-tier construction includes a first tier having a first die, a second die spaced apart from the first die in a first direction and a fill material therebetween. A second tier overlays the first tier, and includes a bridge die partially overlaying the fill material and the first and second dies. The bridge die provides an electrical interconnection between the first and second dies in the first tier. The device also has a first protective structure aligned with a first interface between an end of the first die and the fill material that includes a first part formed on a first side of the first die at the end of the first die; and a second part formed on a first side of the bridge die. The first and second parts are aligned and form the first protective structure, mitigating cracking near the bridge die.Type: ApplicationFiled: February 10, 2026Publication date: June 25, 2026Inventors: Li-Hsien Huang, Jun He, Yinlung Lu, Yao-Chun Chuang
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Patent number: 12650295Abstract: A scattering measurement method and a scattering measurement device are disclosed. In the scattering measurement method, wide-band IR measurement light is directed onto a substrate and then passes through a surface of the substrate and reaches a unit under measurement. The IR measurement light has a wavelength in the range of 2 ?m to 7.5 ?m, or of 25 ?m to 35 ?m. Scattered IR measurement light is then received from the substrate and the unit under measurement, from which characterizing parameters of the unit under measurement are determined.Type: GrantFiled: August 5, 2024Date of Patent: June 9, 2026Assignee: HANGZHOU HFC SEMICONDUCTOR CO.Inventors: Zheng Zou, Jun He, Lezhong Wu