Abstract: A handle for a prosthetic heart valve delivery apparatus includes a housing, a motorized mechanism, and a holding mechanism. The housing is configured to be hand-held by a user and includes a distal opening. The motorized mechanism is disposed within the housing and is configured to be releasably coupled to a proximal end portion of a first shaft of the prosthetic heart valve delivery apparatus. When actuated, the motorized mechanism is configured to rotate the first shaft relative to the housing. The holding mechanism is disposed inside the housing and is configured to engage a proximal end portion of a second shaft of the prosthetic heart valve delivery apparatus such that the second shaft is axially and rotationally fixed relative to the housing, and the first shaft extends through the second shaft.

Abstract: A filler for vacuum brazing of TU1 oxygen-free copper is an Au—Cu—Ni filler including the following elemental compositions in a specified proportion: 69% to 90% of Au, 9% to 30% of Cu, and 1% to 5% of Ni. The filler has a melting temperature of 900° C. to 910° C. The filler for vacuum brazing of TU1 oxygen-free copper can be used for brazing X-ray tube anodes, thereby realizing effective vacuum brazing.

Abstract: The present application describes antibody formulations, including monoclonal antibodies formulated in histidine-acetate buffer, as well as a formulation comprising an antibody that binds to domain II of HER2 (for example, Pertuzumab), and a formulation comprising an antibody that binds to DR5 (for example, Apomab).

Abstract: Disclosed herein are ink compositions that can be ink jetted onto a substrate with improved performance, low odor, and low migration properties. An example ink composition includes a mono-functional monomer, the mono-functional monomer including a hydrophilic mono-functional monomer; a di-functional monomer; an optional colorant; and an optional photoinitiator. Also disclosed are substrates decorated with a cured ink composition and methods of decorating a substrate with the ink compositions.

Abstract: The system monitors multiple communication channels between a first communicator and a second communicator. At least a portion of the multiple channels spatially overlap. The overlapping channels carry different communications. The system determines whether a first set of two or more channels among the multiple channels are interfering with each other. Upon detecting interference, the system obtains a first multiplicity of physical resource blocks associated with a first channel and a second multiplicity of physical resource blocks associated with a second channel, where a physical resource block comprises a frequency band of predetermined size. The system allocates a first subset of the first multiplicity of physical resource blocks to the first channel, and a second subset of the second multiplicity of physical resource blocks to the second channel, where the first subset and the second subset do not overlap.

Abstract: Systems and methods for controlling the air to ground network coverage in an underserved area include an aerial vehicle and control circuitry communicatively coupled to relay circuitry, antenna circuitry, and a ground site. The control circuitry is structured to receive signal data corresponding to a radio signal, the relay circuitry structured to convert the radio signal into a subsequent signal, determine one or more airline schedules and one or more flight statuses associated with an underserved area, based on the one or more airline schedules and the one or more flight statuses determined, determine an aerial vehicle location as the aerial vehicle navigates to the underserved area, and generate a command to activate, via the antenna circuitry, transmission of air to ground network coverage based on the subsequent signal to the underserved area when the aerial vehicle location is in the underserved area.

Abstract: A laser level system including a laser level, the laser level projecting at least one laser line. The system also includes a bracket on which the laser level is mounted and a battery pack. The bracket includes a battery pack receptacle into which the battery pack is removably coupled. The battery pack powers the laser level. The battery pack has a maximum initial battery pack voltage (measured without a workload) of at least 18 volts. The system also includes at least one electrical conductor which delivers power from the battery pack in the battery pack receptacle to the laser level.

Abstract: Provided are a multi-core processing system and an inter-core communication method therefor, and a storage medium. The method includes: reading from a shared memory a message written by a transmitting core, and parsing the message to obtain a source address of and a data length of data to be transmitted (S102); performing storage space allocation based on the data length to obtain a destination address of the data to be transmitted (S104); and transmitting the data to be transmitted from a storage space corresponding to the source address to a storage space corresponding to the destination address by means of Direct Memory Access (DMA), based on the source address, the data length, and the destination address (S106).

Abstract: The present disclosure provides a testing method and a testing device. The testing method includes: configuring one or more testing parameters for a to-be-tested object, and performing at least two testing processes to obtain a testing value of each performance index for each testing process, each of the at least two testing processes being used to test different performance index of the to-be-tested object or to test different performance indices of the to-be-tested object; and generating a testing result of the to-be-tested object in accordance with the testing value of each performance index for each testing process. According to the present disclosure, it is able to perform the multi-dimensional test, thereby to meet the requirement on the performance indices in different scenarios, improve the testing efficiency, and increase the reliability of the testing result for true performance of a terminal.

Abstract: Embodiments of a memory finger structure and architecture for a three-dimensional memory device and fabrication method thereof are disclosed. The method includes forming an alternating layer stack, forming a plurality of slit structures, forming a plurality of conductor/dielectric layer pairs, forming a first column of vertical memory strings, forming a second column of vertical memory strings, and forming a plurality of bitlines. The plurality of slit structures each extend vertically through the alternating layer stack and laterally along a wordline direction to divide the alternating layer stack into at least one memory finger. The vertical memory strings in the first column are displaced relative to each other along the wordline direction. The vertical memory strings in the second column are displaced relative to each other along the wordline direction. Each bitline is connected to an individual vertical memory string in the first and second columns.

Abstract: Embodiments of three-dimensional (3D) memory devices have a blocking layer and fabrication methods thereof are disclosed. In an example, a 3D memory device includes a substrate, a memory stack including interleaved conductive layers and dielectric layers above the substrate, an array of NAND memory strings each extending vertically through the memory stack, a plurality of logic devices above the array of NAND memory strings, a semiconductor layer above and in contact with the logic devices, a pad-out interconnect layer above the semiconductor layer, and a blocking layer vertically between the semiconductor layer and the pad-out interconnect layer and configured to block outgassing of hydrogen.

Abstract: A semiconductor device in a multi-chip package (MCP) includes a controller, at least one non-volatile memory die including an array of non-volatile memory cells and connected to the controller through wire bonding, and at least one volatile memory die including an array of volatile memory cells and connected to the controller through wire bonding. The controller is configured to control operations of the at least one non-volatile memory die and the at least one volatile memory die.

Abstract: A cell search method, a chip, and a mobile terminal are provided in the disclosure, which relates to the field of mobile terminal technology. The method includes the following. A network service state of a mobile terminal is determined according to a signal measurement value of a serving cell where the mobile terminal camps. A cell search for the mobile terminal is initiated when the network service state is a near-interrupted state, where the near-interrupted state is a state between a normal service state and an interrupted service state.

Abstract: Provided an intermittent characteristic-based demand-side resource coordination control method and system. The method includes: receiving a control request, where the control request is used for requesting control of demand-side resources having an intermittent characteristic; determining a target total control quantity of demand-side resources; determining a coordination strategy of multiple demand-side resources and an action quantity of each of the multiple demand-side resources; and performing coordinated control on the multiple demand-side resources based on the target total control quantity of demand-side resources, the coordination strategy, and the action quantity of each of the multiple demand-side resources.

Abstract: A single-shot Fresnel non-coherent correlation digital holographic device based on a polarization-oriented planar lens, comprising: A polarization-oriented planar lens (1) for wavefront modulation and beam splitting, a focusing element (2), a half-wave plate (3) with a small hole and a polarization imaging camera (4). Incident light passes through the polarization-oriented planar lens (1) and the focusing element (2) and is divided into two beams with different polarizations, that is, focused and parallel or focused and divergent beams, wherein the focused beam passes through the small hole of the half-wave plate (3), the parallel or divergent beam passes through the half-wave plate (3), so as to make the polarization of the two beams consistent behind pass through the half-wave plate (3).

Abstract: A method for manufacturing a light-emitting component, including forming an auxiliary electrode and a first electrode arranged at an interval on a base substrate; depositing, by means of a mask with a hollow area, a light-emitting layer on the base substrate on which the auxiliary electrode and the first electrode are formed; and forming a second electrode on the base substrate on which the light-emitting layer is formed. The light-emitting layer covers at least part of the first electrode, and at least a partial area of the auxiliary electrode is exposed outside the light-emitting layer. The second electrode covers at least part of the light-emitting layer and the at least partial area of the auxiliary electrode, and the second electrode is connected to the at least partial area of the auxiliary electrode.

Abstract: Provided are a live recombinant Mycobacterium bovis-BCG strain and a tuberculosis (TB) vaccine or immunogenic composition comprising a nucleic acid capable of overexpression, the nucleic acid encoding PhoP and PhoR proteins. A method for treatment or prophylaxis of a mammal against challenge by Mycobacterium tuberculosis or Mycobacterium bovis using the strain is also provided.

Abstract: Embodiments of semiconductor devices and fabrication methods thereof are disclosed. In an example, a semiconductor device includes a first semiconductor structure including a programmable logic device, an array of static random-access memory (SRAM) cells, and a first bonding layer including a plurality of first bonding contacts. The semiconductor device also includes a second semiconductor structure including an array of dynamic random-access memory (DRAM) cells and a second bonding layer including a plurality of second bonding contacts. The semiconductor device further includes a bonding interface between the first bonding layer and the second bonding layer. The first bonding contacts are in contact with the second bonding contacts at the bonding interface.