Patents by Inventor Jun Lu

Jun Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240129108
    Abstract: A data processing method performed by a first device includes: generating, in response to first service data satisfying a data uploading condition, a first bit array corresponding to the first service data; encrypting the first bit array through a data key to obtain a ciphertext bit array, the data key being generated by a second device in a data intersection application run in a trusted execution environment of the second device; and transmitting the ciphertext bit array to a blockchain node for forwarding to a second device, for the second device to decrypt, in the data intersection application through the data key, the ciphertext bit array to obtain the first bit array.
    Type: Application
    Filed: December 4, 2023
    Publication date: April 18, 2024
    Inventors: Qucheng LIU, Rui GUO, Jun LIANG, Like SHU, Zongyou WANG, Hu LAN, Yang LU, Hanqing LIU, Jun LI, Hui ZHANG, Gengliang ZHU, Kaixuan NIE, Yifang SHI, Zhiyong LIAO, Yangjun HUANG
  • Patent number: 11961998
    Abstract: Provided is a method of producing multiple particulates, the method comprising: (a) dispersing multiple primary particles of an anode active material, having a particle size from 2 nm to 20 ?m, and particles of a polymer foam material, having a particle size from 50 nm to 20 ?m, and an optional adhesive or binder in a liquid medium to form a slurry; and (b) shaping the slurry and removing the liquid medium to form the multiple particulates having a diameter from 100 nm to 50 ?m; wherein at least one of the multiple particulates comprises a polymer foam material having pores and a single or a plurality of the primary particles embedded in or in contact with the polymer foam material, wherein the primary particles have a total solid volume Va, and the pores have a total pore volume Vp, and the volume ratio Vp/Va is from 0.1/1.0 to 10/1.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: April 16, 2024
    Assignee: Honeycomb Battery Company
    Inventors: Yi-Jun Lin, Yen-Po Lin, Sheng-Yi Lu, Bor Z. Jang
  • Patent number: 11960160
    Abstract: A spliced screen and a display terminal are disclosed. In the spliced screen, a structural component is disposed on two adjacent display panels and covers a splicing gap between the two adjacent display panels. A lamp plate is disposed on a surface of the structural component. When the spliced screen displays an image, a plurality of luminescent bodies disposed on the lamp plate close to the display panels also emit light, thereby preventing black strips from appearing on the image. In the spliced screen, a viewing angle of the display panels and a viewing angle of the lamp plate are same, so that a brightness of the display panels and a brightness of the lamp plates are same when the spliced screen is viewed from a lateral side. As such, display quality is improved.
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: April 16, 2024
    Assignee: TCL China Star Optoelectronics Technology Co., ltd.
    Inventors: Jun Zhao, Bin Zhao, Juncheng Xiao, Hongyuan Xu, Huajun Lu
  • Patent number: 11959945
    Abstract: Embodiments are presented herein of an open-loop test system for testing vertical-cavity surface-emitting lasers (VCSELs). A high-speed pulse generator may be used to produce nanoseconds pulses provided to the VCSEL device. A high-speed oscilloscope may be used to measure the resultant nanoseconds pulses across the VCSEL device. The VCSEL device voltage and VCSEL device current may be obtained from the measured nanosecond pulses according to compensation data derived from the system. A pre-test compensation procedure may be used to obtain the compensation data, which may include representative characteristics of each system component.
    Type: Grant
    Filed: November 26, 2020
    Date of Patent: April 16, 2024
    Assignee: National Instruments Corporation
    Inventors: Jun Lu, John George Banaska, Matthew Tate Dougan, Jeffrey Allan Cornell, Wendi Song, Xuechen Han, Kunal Harsad Patel
  • Publication number: 20240116873
    Abstract: A quinoline mercaptoacetate sulfonamide derivative, an intermediate, a pharmaceutical derivative or a formulation, and a preparation method and use therefor, wherein the structure of the quinoline mercaptoacetate sulfonamide derivative is as represented by the following formula (I). A preparation method for a compound containing a structure is also represented by the following formula. Experiments show that the compound has a good inhibitory effect on URAT1 transport uric acid in HEK293 transfected cells, and that the compound has good application prospects in the treatment of hyperuricemia or gout.
    Type: Application
    Filed: November 20, 2023
    Publication date: April 11, 2024
    Applicant: JIANGSU CHIATAI QINGJIANG PHARMACEUTICAL CO., LTD.
    Inventors: Jie CHEN, Jun Lu, Fujia XIE, Lv HUANG
  • Patent number: 11955636
    Abstract: An electrochemical device includes a cathode comprising a first cathode component of lithium and SexSy; and a second cathode component of an alkali metal and/or alkaline earth metal sulfur and/or selenide, different from the first cathode component; an initial discharge product of a polyselenide and/or polysulfide anion charge compensated by an alkali metal and/or alkaline earth metal cation; an anode; a porous separator; and a non-aqueous electrolyte with one or more lithium salts, and one or more solvents; wherein the electrochemical device is a lithium sulfur and/or lithium selenide battery.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: April 9, 2024
    Assignee: UCHICAGO ARGONNE, LLC
    Inventors: Matthew Li, Khalil Amine, Jun Lu
  • Publication number: 20240114397
    Abstract: The system determines that an application running user equipment (UE) is requesting a throughput intensive communication over a network. The throughput intensive communication can require a predetermined downlink and uplink throughput. The system sends a first indication to the network, specifying to a base station of the network that the UE is requesting the throughput intensive communication. The base station determines whether it can provide the downlink throughput and the uplink throughput to the UE. Upon determining that the base station cannot provide the downlink or the uplink throughput to the UE, the base station sends a first message to the UE, indicating that the throughput intensive communication is of low quality. Upon receiving the first message, the UE waits for a predetermined criterion to be satisfied before attempting to engage in the throughput intensive communication, thereby reducing network traffic by eschewing sending repeated requests for the throughput intensive communication.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Inventors: Kun Lu, Egil Gronstad, Jun Liu, Lin Zhang
  • Patent number: 11947498
    Abstract: Methods, systems, and computer program products for de-duplicating data in executable files in a container image are disclosed. The method may include receiving a request to read a file in a first layer in a container image including a plurality of layers, wherein the file is a delta file which is from an updated executable file based on a base executable file, the base executable file is in a lower layer than the first layer in the container image, and the delta file includes block mappings between the updated executable file and the base executable file and different data between the two files, and blocks included in the two files are based on respective file structure. The method may also include restoring the updated executable file based on the delta file and the base executable file. The method may further include returning data in the updated executable file.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: April 2, 2024
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Dong Hui Liu, Peng Hui Jiang, Jing Lu, Xiao Yan Tang, Jun Su, Jia Yu, Yong Yin
  • Publication number: 20240105545
    Abstract: Semiconductor packages including an integrated heat spreader and methods of fabrication are described. In an embodiment, a semiconductor package includes a first package level, a second package level including one or more second-level chiplets, and a heat spreader bonded to the second package level with a metallic layer, which may include one or more intermetallic compounds formed by transient liquid phase bonding.
    Type: Application
    Filed: September 22, 2022
    Publication date: March 28, 2024
    Inventors: Jiongxin Lu, Kunzhong Hu, Jun Zhai, Sanjay Dabral
  • Publication number: 20240100488
    Abstract: Provided are a high temperature-resistant composite nanofiltration membrane and a preparation method thereof. The high temperature-resistant composite nanofiltration membrane includes a base membrane and a polyamide membrane arranged on the base membrane; wherein the polyamide membrane is prepared from raw materials comprising: an amine, an inorganic salt, a silane additive, a polyacyl chloride, and an oil phase solvent; and the silane additive is at least one selected from the group consisting of 3-aminopropyltriethoxysilane, divinyltriaminopropyltrimethoxysilane, N-cyclohexyl-?-aminopropyltrimethoxysilane, and trimethoxy[3-(phenylamino)propyl]silane.
    Type: Application
    Filed: July 13, 2023
    Publication date: March 28, 2024
    Inventors: Hui YU, Hongwei LU, Bo PENG, Qunhui HU, Qian LIAO, Pan HE, Yanbo HE, Jun PENG
  • Publication number: 20240105704
    Abstract: Semiconductor packages formed utilizing wafer reconstitution and optionally including an integrated heat spreader and methods of fabrication are described. In an embodiment, a semiconductor package includes a first package level, a second package level including one or more second-level chiplets. A heat spreader may be bonded to the second package level with a metallic layer, which may include one or more intermetallic compounds formed by transient liquid phase bonding. The chiplets within the first and/or second package levels may optionally be connected with one or more optical interconnect paths.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 28, 2024
    Inventors: Chonghua Zhong, Jiongxin Lu, Kunzhong Hu, Jun Zhai, Sanjay Dabral
  • Publication number: 20240105702
    Abstract: Semiconductor packages formed utilizing wafer reconstitution and optionally including an integrated heat spreader and methods of fabrication are described. In an embodiment, a semiconductor package includes a first package level, a second package level including one or more second-level chiplets, and a heat spreader bonded to the second package level with a metallic layer, which may include one or more intermetallic compounds formed by transient liquid phase bonding.
    Type: Application
    Filed: March 6, 2023
    Publication date: March 28, 2024
    Inventors: Chonghua Zhong, Jiongxin Lu, Kunzhong Hu, Jun Zhai, Sanjay Dabral
  • Patent number: 11942445
    Abstract: A semiconductor device is provided. The semiconductor device includes a substrate having a surface. The semiconductor device includes a conductive pad over a portion of the surface. The conductive pad has a curved top surface, and a width of the conductive pad increases toward the substrate. The semiconductor device includes a device over the conductive pad. The semiconductor device includes a solder layer between the device and the conductive pad. The solder layer covers the curved top surface of the conductive pad, and the conductive pad extends into the solder layer.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-En Yen, Chin-Wei Kang, Kai-Jun Zhan, Wen-Hsiung Lu, Cheng-Jen Lin, Ming-Da Cheng, Mirng-Ji Lii
  • Patent number: 11943928
    Abstract: Embodiments of a channel hole plug structure of 3D memory devices and fabricating methods thereof are disclosed. The memory device includes an alternating layer stack disposed on a substrate, an insulating layer disposed on the alternating dielectric stack, a channel hole extending vertically through the alternating dielectric stack and the insulating layer, a channel structure including a channel layer in the channel hole, and a channel hole plug in the insulating layer and above the channel structure. The channel hole plug is electrically connected with the channel layer. A projection of the channel hole plug in a lateral plane covers a projection of the channel hole in the lateral plane.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: March 26, 2024
    Assignee: Yangtze Memory Technologies Co., Ltd.
    Inventors: Li Hong Xiao, Zhenyu Lu, Qian Tao, Yushi Hu, Jun Chen, LongDong Liu, Meng Wang
  • Patent number: 11943744
    Abstract: A sidelink communication method, a terminal device, and a network device are provided. In some embodiments, a terminal device receives resource configuration information sent by a network device, where the resource configuration information is for configuring a common resource for the terminal device, and the common resource is a resource that is configured by the network device for all terminal devices within coverage of the network device and that is to be used by all the terminal devices to perform sidelink communication. The terminal device receives sidelink BWP indication information sent by the network device, where the sidelink BWP indication information indicates N sidelink bandwidth parts SL-BWPs, and the N SL-BWPs include a frequency domain resource corresponding to the common resource, where N is a positive integer. The terminal device performs sidelink communication with another terminal device in the N SL-BWPs.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: March 26, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Hongjia Su, Jun Luo, Jinfang Zhang, Lei Lu
  • Publication number: 20240098182
    Abstract: Aspects of this disclosure are directed to a method and a terminal device, and a computer-readable storage medium. The terminal device includes processing circuitry that obtains n voice messages from at least one user account. n is a positive integer. The processing circuitry displays a voice message presentation interface. The voice message presentation interface is configured to display virtual characters corresponding to the n voice messages in a virtual world. Locations of the n voice messages in the virtual world are based on whether the n voice messages are unplayed. The virtual characters can be based on respective message attributes of the n voice messages.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 21, 2024
    Applicant: Tencent Technology (Shenzhen) Company Limited
    Inventors: Wei DAI, Kun LU, Qinghua ZHONG, Jun WU, Yingren WANG, Rong HUANG
  • Publication number: 20240095359
    Abstract: An embodiment includes generating a caller list of callers that issue requests for calling a designated program at runtime. The embodiment also includes generating an authorized caller list of authorized callers allowed to call the designated program, wherein the authorized callers are selected from among callers on the caller list. The embodiment also includes generating an authorization key for each of the authorized callers that the designated program will require as a condition for completing call requests.
    Type: Application
    Filed: September 20, 2022
    Publication date: March 21, 2024
    Applicant: International Business Machines Corporation
    Inventors: Dong Hui Liu, Peng Hui Jiang, Jing Lu, Jia Yu, Jun Su, Xiao Yan Tang, Yong Yin
  • Publication number: 20240091366
    Abstract: The present invention relates to the field of pharmaceutical and chemical engineering, and specifically relates to a weakly acidic microenvironment-sensitive aptamer for tumors, a triptolide conjugate. The conjugate is formed by conjugation between the 14-position hydroxyl group of triptolide and the aptamer via an acetal ester linking bond, which is an acid-sensitive linking bond with a cleavage condition of (pH=3.5-6.5), which is much less pH-sensitive and is more likely to cleave under the tumor microenvironment. Based on the characteristics of the aptamer targeting the highly expressed proteins on the membrane surface of tumor cells, the conjugate delivered triptolide targeted to tumor cells and mediated endocytosis to reach the lysosome; based on the characteristics of the acidic environment of lysosomes, the acetal ester linking bond released intact triptolide in the lysosomal acidic environment, targeting and killing of tumor cells.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 21, 2024
    Inventors: Jun LU, Yun DENG, Yao CHEN, Jirui YANG, Yi ZUO, Xiao LI, Qing REN
  • Publication number: 20240091716
    Abstract: An electrolytic eluent generator includes an electrolyte reservoir, an eluent generation chamber, and an ion exchange membrane stack. The electrolyte reservoir includes a chamber containing an aqueous electrolyte solution including an electrolyte; and a first electrode. The eluent generation chamber including a second electrode. The ion exchange connector includes an ion exchange membrane stack, and a compression block.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 21, 2024
    Inventors: Zhongqing LU, Yan LIU, Christopher A. POHL, Jinhua CHEN, Jun CHENG
  • Patent number: D1018087
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: March 19, 2024
    Assignees: Zhejiang Geely Holding Group CO. LTD., Shanghai Geely Diran Automobile Design CO. LTD
    Inventors: Jun Lu, Justin Maurice Francis Scully, Ning Huang, Guy Donovan Burgoyne, Peter Horbury