Abstract: A millimeter-wave radar housing material capable of being laser welded, and a preparation method therefor, which belong to the technical field of millimeter-wave radar housing manufacturing. The millimeter-wave radar housing material specifically comprises the following components in parts by weight: 50-90 parts of polypropylene, 10-50 parts of glass fiber, 0.2-0.8 part of a nucleating agent, 0.5-1 part of a compatibilizer, 0.1-0.5 part of a black colorant, 0.1-0.5 part of an antioxidant, and 0.1-0.8 part of a light stabilizer. The radar housing material disclosed by the present invention has the advantages of low dielectricity, being lightweight, high strength and high heat resistance, can transmit a near-infrared light beam, and has laser weldability.

Abstract: A semiconductor package comprises a lead frame, an FET, a copper layer, a source metal clip, and a molding encapsulation. The FET comprises a gate bus line, a gate electrode, and a source electrode on a top surface of the FET and a drain electrode on a bottom surface of the FET. A method comprises the steps of providing a wafer; attaching a seed layer; applying a photoresist layer; forming openings; electro plating of copper; removing the photoresist layer; removing the seed layer; applying a grinding process; applying a dicing process; attaching a lead frame; mounting source metal clips; forming a molding encapsulation; and applying a singulation process.

Abstract: A modified polyvinyl acetal resin comprising residues of a cyclic aldehyde is provided for use in forming interlayers for making laminated glass. Interlayers as described herein exhibit desirable optical and acoustic properties and are more easily recycled than those without the modified polyvinyl acetal resin.

Abstract: Embodiments relate to sensors, sensor assemblies, and methods of making sensor coatings where the sensors comprise ACM or SAW based sensors with applied humidity tolerant coatings that target adsorption and desorption of selected refrigerant gas molecules via MOF coatings and particularly A2L and A3 refrigerants such as R32 and R290.

Abstract: A microphone body and a desktop microphone are provided. The desktop microphone includes a wireless communicator for connecting with a terminal. The microphone body includes a housing, a main control assembly, a wire interface assembly, and a wireless assembly. The housing has an accommodating chamber; at least part of the main control assembly is located inside the accommodating chamber and connected to the housing. The main control assembly is used to control transmission and reception of audio signals; at least part of the wire interface assembly is located within the accommodating chamber, and the wire interface assembly is electrically connected to the main control assembly; at least part of the wireless assembly is located inside the accommodating chamber, and the wireless assembly is electrically connected to the main control assembly. The wireless assembly is used for wireless communication with the wireless communicator.

Abstract: It is proposed LED modules for providing uniform light, each module being connected with one other LED module to form a string with a driver side to be connected to a driver and an opposing side, said LED module extends along a length of the LED module, comprising a LED lighting arrangement (D1 to D9); a first interconnection pair (X1, X5) and a first wire (40) connecting the first interconnection pair (X1, X5), across the length of the LED module, adapted to couple to a first output (+) of the driver and to a first interconnection pair (X1, X5) of the other LED module; a second interconnection pair (X4, X8) and a second wire (42) connecting the second interconnection pair (X4, X8), across the length of the LED module, adapted to couple to a second interconnection pair (X4, X5) of the other LED module and a second output (?) of the driver; and a third interconnection pair (X2, X6) and a third wire (44) connecting the third interconnection pair (X2, X6), across the length of the LED module and adapted to coupl

Abstract: An ion implanter may include an ion source, arranged to generate a continuous ion beam, a DC acceleration system, to accelerate the continuous ion beam, as well as an AC linear accelerator to receive the continuous ion beam and to output a bunched ion beam. The ion implanter may also include an energy spreading electrode assembly, to receive the bunched ion beam and to apply an RF voltage between a plurality of electrodes of the energy spreading electrode assembly, along a local direction of propagation of the bunched ion beam.

Abstract: A heat dissipating lid includes a first surface configured to be connected to the chip, and a groove located on the first surface. The first surface includes a first contact region. In a chip package structure, a boundary of an orthographic projection of the chip on the first surface coincides with a boundary of the first contact region. The groove is located outside the first contact region and connected to the first contact region, and the groove extends along at least a portion of the boundary of the first contact region. The heat dissipating lid is applicable to the chip package structure and configured to dissipate heat for the chip.

Abstract: This application provides a service chain fault protection method, an apparatus, a device, a service chain fault protection system, and a storage medium, and relates to the field of communications technologies. In this application, in an SRV6 static service chain scenario, when a link between an SF network element and an SFF accessed by the SF network element is faulty, a secondary SID is introduced to update a destination address field of a packet header of a packet to the secondary SID, so that the packet is bypassed, based on the secondary SID, to another SFF accessed by the SF network element, thereby implementing fault protection in the link between the SFF and the SF network element.

Abstract: A sound card includes a shell, a control assembly, and a light emitting assembly. The shell is provided with an accommodating chamber. The control assembly includes a first circuit board arranged in the accommodating chamber, and a plurality of function keys. The light emitting assembly arranged in the accommodating chamber and electrically connected to the first circuit board. The light emitting assembly is configured to emit light. The function keys are configured for controlling and adjusting the sound card, light emitted by the lighting emitting assembly illuminates the function keys including the outer surfaces thereof exposed to outside of the shell. By using the light emitting assembly to transmit light from the inside of the shell to the outside of the shell, the buttons have the light transmittance effect, allowing users to enjoy auditory effects while combining visual effects to create a more three-dimensional atmosphere.

Abstract: A cylindrical battery having a wound jelly roll configuration that includes an anode current collector having a first surface and an opposing second surface; at least one anode disposed on the first surface of the anode current collector; at least one Li metal film disposed on the first surface anode current collector, wherein the at least one Li metal film is spaced apart from the anode; a cathode current collector having a first surface and an opposing second surface; at least one cathode disposed on the first surface of the cathode current collector; and a first membrane separator positioned between the anode and the cathode.

Abstract: This application provides a service chain fault protection method, an apparatus, a device, a service chain fault protection system, and a storage medium, and relates to the field of communications technologies. In this application, in an SRV6 static service chain scenario, when a link between an SF network element and an SFF accessed by the SF network element is faulty, a secondary SID is introduced to update a destination address field of a packet header of a packet to the secondary SID, so that the packet is bypassed, based on the secondary SID, to another SFF accessed by the SF network element, thereby implementing fault protection in the link between the SFF and the SF network element.

Abstract: Embodiments of this application disclose a chip package structure and an electronic device. The chip package structure includes a substrate and a housing; a chip and a supporting member, disposed on a first surface of the substrate, where the supporting member is disposed around the chip, and both the chip and the supporting member are located in a cavity; a spraying module which is disposed on the housing; and a first sealing member which is disposed between the supporting member and the housing. In this way, heat may be dissipated for the chip in a liquid cooling manner, thereby improving heat dissipation performance of the chip. The sealing member is disposed between the supporting member and the housing along a radial direction, to seal a region outside the first surface of the substrate. In addition, this facilitates disassembly/assembly, and reduces pressure on the chip during mounting.

Abstract: A microphone includes a shell assembly, a sound pickup assembly, a control assembly and a light emitting assembly. The shell assembly includes a shell body with a first accommodating chamber. The sound pickup assembly includes a microphone head for sound pickup, wherein the microphone head is arranged on the shell assembly. The control assembly includes a circuit board. The circuit board is arranged in the first accommodating chamber, and is electrically connected to the microphone head. The light emitting assembly includes a light emitting unit. The light emitting unit is arranged in the first accommodating chamber and is electrically connected to the circuit board. The light emitting unit is configured to allow emitted light to pass through a portion of the shell body.

Abstract: Provided is a product quality detection method in a complex industrial process fusing prior knowledge. Related data of product production in the complex industrial process is acquired to serve as samples; The acquired samples are preprocessed and a training data set is constructed by the preprocessed samples; a product quality detection model in the complex industrial process fusing prior knowledge is constructed; the product quality detection model is trained by the training data set; and the trained quality detection model is used for product quality detection to obtain product quality. The present invention designs that feature extraction on multiple scales is supported by a multi-scale feature extraction network with convolutional kernels with different sizes, and designs that the extracted features of each process are fused by a multi-process feature fusion method of the prior knowledge, thereby obtaining more accurate feature representation and increasing the production benefit.

Abstract: Provided is a product quality detection method in a complex industrial process fusing prior knowledge. Related data of product production in the complex industrial process is acquired to serve as samples; The acquired samples are preprocessed and a training data set is constructed by the preprocessed samples; a product quality detection model in the complex industrial process fusing prior knowledge is constructed; the product quality detection model is trained by the training data set; and the trained quality detection model is used for product quality detection to obtain product quality. The present invention designs that feature extraction on multiple scales is supported by a multi-scale feature extraction network with convolutional kernels with different sizes, and designs that the extracted features of each process are fused by a multi-process feature fusion method of the prior knowledge, thereby obtaining more accurate feature representation and increasing the production benefit.