Abstract: A semiconductor device includes a plurality of semiconductor pillars having first and second sides facing each other in a first direction, and arranged in a second direction crossing the first direction; a plurality of insulating pillars having first and second sides facing each other in the first direction, and arranged alternately with the semiconductor pillars in the second direction; a back gate line formed on the first sides of the semiconductor pillars and the first sides of the insulating pillars, and extending in the second direction; and a front gate line formed on the second sides of the semiconductor pillars and the second sides of the insulating pillars, and extending in the second direction, wherein the semiconductor pillars respectively include protrusion portions that protrude more than the insulating pillars toward the front gate line in the first direction, and the front gate line surrounds a side of the protrusion portion.

Abstract: A solar panel disassembly device for disassembling a solar panel is provided. In the solar panel, a glass plate, an encapsulant, and a solar cell are stacked in sequence. The disassembly device includes: a stage on which a laser irradiation hole is formed; a transmissive panel disposed on the stage to cover the laser irradiation hole, forming a seating surface of the glass plate; a laser irradiation unit positioned in a lower portion of the stage, and formed such that a laser beam is irradiated through the laser irradiation hole to weaken or eliminate adhesion of the encapsulant as the laser beam passes through the transmissive panel and the glass plate to heat the encapsulant; and a scraper positioned in an upper portion of the stage and formed to scrape the solar cell stacked on the glass plate while moving from one side to the other side of the stage.

Abstract: The present disclosure relates to a vehicle rear seat including: a center seat; and side seats located on the left and right of the center seat, wherein, the center seat is capable of protruding by moving the center seat forward with respect to the side seats, and in the state in which the center seat protrudes forward, it is possible to increase an inter-passenger distance so that physical contact between the passenger of the center seat and the passenger of each of the side seats can be prevented as much as possible.

Abstract: A vehicle seatback folding device includes: a cushion bracket; a back side frame rotating on the cushion bracket; a spring mounting bracket coupled to rotate integrally with the back side frame around a hinge-coupling part; a return spring for applying, to the back side frame, elastic restoring force for rotating the back side frame in the folding direction of a seatback; and a reverse spring supported in a state in which a first end portion is caught by the spring mounting bracket and a second end portion is caught by a first spring support end.

Abstract: A seat for a vehicle with a cushion tip-up and down function is provided. The seat is configured such that a cushion leg provided in a cushion is held, in a fitted manner, by a support spring of a support structure provided in a seat base, and when the cushion is rotated, the cushion leg is allowed to be folded and ejected by being automatically rotated, thereby improving the convenience of use.

Abstract: A film depositing composition including a Group 4 metal element-containing precursor compound and a method for forming a Group 4 metal element-containing film using same is described. The use of the film depositing composition including a Group 4 metal element-containing precursor compound achieves self-limiting film growth of ALD over a wide temperature range from low to high temperatures, enabling the formation of a Group 4 metal element-containing film for various purposes at various process temperatures. Particularly, according to the method for forming a Group 4 metal element-containing film of this invention, the growth per cycle (GPC) of ALD is consistent over a broad temperature range, thus making it possible to form a Group 4 metal element-containing film of uniform thickness even on surfaces with large aspect ratio trenches. Thus, the method can be advantageously utilized in manufacturing various semiconductor devices, such as DRAM, 3D NAND flash memory, and the like.

Abstract: A motor includes a stator on which an armature coil is wound, a rotor disposed inside the stator, a superconducting field coil being wound thereon and, a controller configured to control the motor, in which the controller is configured to control an armature current supplied from an AC source to the armature coil and a field current supplied from a DC source to the field coil, and charge at least a certain ratio of the field coil before starting the motor.

Abstract: Provided is a power module capable of preventing an overflow situation of solder and a movement of the solder when a chip and a spacer are bonded to each substrate by a soldering process, thereby being capable of increasing bonding quality between components through the soldering process.

Abstract: A method for fabricating a semiconductor device includes: forming a mold structure including a mold layer and a supporter layer over a semiconductor substrate; forming an opening penetrating the mold structure; forming a protective layer on a bottom surface and a sidewall of the opening; forming a lower electrode over the protective layer; selectively etching the supporter layer to form a supporter that supports the lower electrode; removing the mold layer to define a non-exposed portion and an exposed portion of an outer wall of the protective layer; and selectively trimming the exposed portion of the protective layer to form a protective layer pattern between the supporter and the lower electrode.

Abstract: A method of manufacturing a composite material pressure vessel is provided. The method may include preparing a liner provided with an entrance portion; and forming an inner shell by winding at least one composite material filament around the liner, wherein the forming of the inner shell includes simultaneously winding a plurality of enamel wire strain sensors around the liner together with the composite material filament by differentiating a start point where each of the plurality of enamel wire strain sensors manufactured in the form of a filament starts to be wound around the liner. A composite material pressure vessel is further manufactured by using the method.

Abstract: Disclosed is a disinfection robot capable of autonomous driving and recognition of a disinfection target. The disinfection robot includes: a recognition unit configured to generate recognition information by recognizing a surrounding environment of the disinfection robot; a movement unit configured to move a position of the disinfection robot; a light source unit configured to emit a light of a predetermined wavelength area for disinfection; an injection unit configured to inject a fluid for disinfection; and a control unit configured to move the disinfection robot through the movement unit based on the recognition information, wherein the control unit is configured to identify a disinfection target from the recognition information and control at least one of the light source unit and the injection unit to perform disinfection to at least one of the surrounding environment of the disinfection robot and the disinfection target.

Abstract: A direction change valve failure prediction system includes: a data obtainer, degradation index value calculator, and a determiner. The obtainer is configured to repeatedly detect operation times of direction change valves over an equipment operation elapsed time to obtain operation time data of each valve. The valves are configured to communicate with a cylinder including a piston rod to change a direction a working fluid is supplied to the cylinder to change rod operation direction. The calculator is configured to calculate degradation index values of statistical degradation indexes representing a failure of the valves based on the time data. The determiner is configured to sequence the index values calculated for the valves according to size, to give scores to valves of higher values within or beyond a predetermined range among the sequenced index values, and to determine a valve expected to fail based on the score sum.

Abstract: Proposed is a bobbin for a superconducting motor by which cooling performance can be obtained and structural stability can be expected. The bobbin for a motor includes a bobbin body on which a superconducting coil is wound and a reinforcement including a reinforced plastic including reinforcing fiber and surrounding a side surface of the bobbin body.

Abstract: A method for preparing a recycled polymer is provided. The method includes: bringing a recovered polymer containing an additive into contact with an impregnation solvent in an impregnation tank to obtain a slurry containing a swollen polymer and an eluate; separating the slurry into a solid mixture containing the swollen polymer and a liquid mixture containing the eluate in a solid-liquid separator; and obtaining a recycled polymer from the solid mixture and recovering the additive from the liquid mixture, wherein the impregnation solvent is a mixed solvent of two or more solvents.

Abstract: Disclosed is an air heating apparatus including a burner configured to cause a combustion reaction, a main passage, through which water flows while circulating, a heat exchanging device configured to receive heat from combustion gas generated by the combustion reaction and heat the water flowing along the main passage, a heating heat exchanger configured to receive the water heated by the heat exchanging device and exchange heat with the air for heating, a fan configured to send the air to the heating heat exchanger, and a hot water discharge port connected to the main passage such that the water heated by the heat exchanging device is discharged to an outside of the main passage.

Abstract: Provided is a batch type substrate processing apparatus that generates plasma by a plurality of electrodes to perform a processing process on a substrate. The batch type substrate processing apparatus includes a reaction tube, a plurality of electrodes disposed to be spaced apart from each other, and an electrode protection part configured to protect the plurality of electrodes. The plurality of electrodes includes first and second power supply electrodes spaced apart from each other, and a ground electrode provided between the first power supply electrode and the second power supply electrode. The electrode protection part includes a plurality of first electrode protection tubes provided in the first and second power supply electrodes, respectively, a second electrode protection tube provided in the ground electrode, and a plurality of connection tubes configured to connect each of the plurality of first electrode protection tubes to the second electrode protection tube so as to communicate with each other.

Abstract: A semiconductor device may include a bit line extending in a third direction, a plurality of active layers extending in a first direction and contacting the bit line, a plurality of word lines extending in a second direction and each disposed at an top surface or bottom surface of each of the plurality of active layers, a plurality of capacitors contacting the plurality of active layers, and a contact formed in at least one active layer disposed at the uppermost part of the bit line, among the plurality of active layers. The bit line and the contact may be electrically connected or separated by using, as a control line, a word line disposed in the top surface or bottom surface of the at least one active layer, among the plurality of word lines.

Abstract: A method of manufacturing interior parts for a vehicle includes: forming a first plating layer on a surface of an injection molded product through electroless plating; printing a symbol part on the first plating layer; partially removing the first plating layer to a size corresponding to the symbol part from a rear surface of the injection molded product; forming a second plating layer on the first plating layer; and removing the symbol part and the first plating layer from the surface of the injection molded product on which the second plating layer is formed.

Abstract: The present invention relates to induction-heated soldering automation equipment and, particularly, to equipment comprising: a jig unit for fixing a substrate on which an electronic element is mounted; a first conveyor for transferring the jig unit; an induction heating unit which is provided above the jig unit so as to be movable in the X-axis, Y-axis, and Z-axis directions, and which includes a magnetic induction coil for soldering the electronic element by induction-heating the substrate fixed to the jig unit; and a controller for controlling the first conveyor and the induction heating unit, wherein continuously supplied molded interconnected devices (MIDs), PCBs, or FPCBs are locally heated through contactless induction heating so that electronic elements can be automatically soldered in a state in which thermal damage is minimized.