Patents by Inventor Jung-A Yang

Jung-A Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240162572
    Abstract: A battery pack includes a plurality of battery cells; a housing accommodating the plurality of battery cells; a plurality of bus bars electrically connecting the plurality of battery cells; and a first welding portion for coupling a first electrode terminal provided in each of the plurality of battery cells to the bus bar and a second welding portion for coupling a second electrode terminal provided in each of the plurality of battery cells to the bus bar. At least one of the first welding portion and the second welding portion includes a region in which a laser welding line formed on the bus bar proceeds in a direction opposite to an extension direction of the welding portion.
    Type: Application
    Filed: March 25, 2022
    Publication date: May 16, 2024
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: In-Hyuk JUNG, Jin-Oh YANG, Kwang-Keun OH, Hae-Won CHOI
  • Publication number: 20240154624
    Abstract: A flash memory storage management method includes: providing a flash memory module including single-level-cell (SLC) blocks and at least one multiple-level-cell block such as MLC block, TLC block, or QLC block; classifying data to be programmed into groups of data; respectively executing SLC programing and RAID-like error code encoding to generate corresponding parity check codes, to program the groups of data and corresponding parity check codes to the SLC blocks; when completing program of the SLC blocks, performing an internal copy to program the at least one multiple-level-cell block by sequentially reading and writing the groups of data and corresponding parity check codes from the SLC blocks to the multiple-level-cell block according to a storage order of the SLC blocks.
    Type: Application
    Filed: January 15, 2024
    Publication date: May 9, 2024
    Applicant: Silicon Motion, Inc.
    Inventors: Tsung-Chieh Yang, Hong-Jung Hsu
  • Publication number: 20240154015
    Abstract: A method includes forming a first fin and a second fin protruding from a frontside of a substrate, forming a gate stack over the first and second fins, forming a dielectric feature dividing the gate stack into a first segment engaging the first fin and a second segment engaging the second fin, and growing a first epitaxial feature on the first fin and a second epitaxial feature on the second fin. The dielectric feature is disposed between the first and second epitaxial features. The method also includes performing an etching process on a backside of the substrate to form a backside trench, and forming a backside via in the backside trench. The backside trench exposes the dielectric feature and the first and second epitaxial features. The backside via straddles the dielectric feature and is in electrical connection with the first and second epitaxial features.
    Type: Application
    Filed: March 22, 2023
    Publication date: May 9, 2024
    Inventors: Jui-Lin CHEN, Hsin-Wen SU, Chih-Ching WANG, Chen-Ming LEE, Chung-I YANG, Yi-Feng TING, Jon-Hsu HO, Lien-Jung HUNG, Ping-Wei WANG
  • Publication number: 20240150532
    Abstract: A prepreg and uses thereof are provided. The prepreg includes an organic fiber woven fabric impregnated or coated with a thermally curable resin composition, wherein the thermally curable resin composition includes: (A) a polyphenylene ether resin having an unsaturated functional group; (B) a polyfunctional vinyl aromatic copolymer; and (C) a compound having the structure of formula (I), wherein, in formula (I), X is a C1-C10 linear or branched alkylene; and the polyfunctional vinyl aromatic copolymer is prepared by copolymerizing one or more divinyl aromatic compounds with one or more monovinyl aromatic compounds.
    Type: Application
    Filed: November 10, 2022
    Publication date: May 9, 2024
    Inventors: Wei-Jung YANG, Meng-Huei CHEN
  • Publication number: 20240153949
    Abstract: Various embodiments of the present disclosure are directed towards a method for forming an integrated chip (IC). The method includes forming a first fin of semiconductor material and a second fin of semiconductor material within a semiconductor substrate. A gate structure is formed over the first fin and source/drain regions are formed on or within the first fin. The source/drain regions are formed on opposite sides of the gate structure. One or more pick-up regions are formed on or within the second fin. The source/drain regions respectively have a first width measured along a first direction parallel to a long axis of the first fin and the one or more pick-up regions respectively have a second width measured along the first direction. The second width is larger than the first width.
    Type: Application
    Filed: January 4, 2024
    Publication date: May 9, 2024
    Inventors: Hsin-Wen Su, Lien Jung Hung, Ping-Wei Wang, Wen-Chun Keng, Chih-Chuan Yang, Shih-Hao Lin
  • Patent number: 11980016
    Abstract: A semiconductor device according to the present disclosure includes a gate extension structure, a first source/drain feature and a second source/drain feature, a vertical stack of channel members extending between the first source/drain feature and the second source/drain feature along a direction, and a gate structure wrapping around each of the vertical stack of channel members. The gate extension structure is in direct contact with the first source/drain feature.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: May 7, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Chuan Yang, Chia-Hao Pao, Yu-Kuan Lin, Lien-Jung Hung, Ping-Wei Wang, Shih-Hao Lin
  • Publication number: 20240145806
    Abstract: A battery module includes battery cells stacked along one direction; a heat conducting member that transfers heat generated from the battery cells to the outside; and an insulating member surrounding the heat conducting member. At least one or more of the battery cells form a battery cell group, and at least one battery cell group is stacked to form a battery cell stack.
    Type: Application
    Filed: November 3, 2022
    Publication date: May 2, 2024
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Jung Hoon LEE, Dooseung KIM, Jaehun YANG
  • Patent number: 11969397
    Abstract: The present invention relates to a composition for preventing or treating transplantation rejection or a transplantation rejection disease, comprising a novel compound and a calcineurin inhibitor. A co-administration of the present invention 1) reduces the activity of pathogenic Th1 cells or Th17 cells, 2) increases the activity of Treg cells, 3) has an inhibitory effect against side effects, such as tissue damage, occurring in the sole administration thereof, 4) inhibits various pathogenic pathways, 5) inhibits the cell death of inflammatory cells, and 6) increases the activity of mitochondria, in an in vivo or in vitro allogenic model, a transplantation rejection disease model, a skin transplantation model, and a liver-transplanted patient, and thus inhibits transplantation rejection along with mitigating side effects possibly occurring in the administration of a conventional immunosuppressant alone.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: April 30, 2024
    Assignee: THE CATHOLIC UNIVERSITY OF KOREA INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Mi-La Cho, Dong-Yun Shin, Jong-Young Choi, Chul-Woo Yang, Sung-Hwan Park, Seon-Yeong Lee, Min-Jung Park, Joo-Yeon Jhun, Se-Young Kim, Hyeon-Beom Seo, Jae-Yoon Ryu, Keun-Hyung Cho
  • Publication number: 20240133949
    Abstract: An outlier IC detection method includes acquiring first measured data of a first IC set, training the first measured data for establishing a training model, acquiring second measured data of a second IC set, generating predicted data of the second IC set by using the training model according to the second measured data, generating a bivariate dataset distribution of the second IC set according to the predicted data and the second measured data, acquiring a predetermined Mahalanobis distance on the bivariate dataset distribution of the second IC set, and identifying at least one outlier IC from the second IC set when at least one position of the at least one outlier IC on the bivariate dataset distribution is outside a range of the predetermined Mahalanobis distance.
    Type: Application
    Filed: October 3, 2023
    Publication date: April 25, 2024
    Applicant: MEDIATEK INC.
    Inventors: Yu-Lin Yang, Chin-Wei Lin, Po-Chao Tsao, Tung-Hsing Lee, Chia-Jung Ni, Chi-Ming Lee, Yi-Ju Ting
  • Publication number: 20240136213
    Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Inventors: Chun-Jung HUANG, Yung-Lin HSU, Kuang Huan HSU, Jeff CHEN, Steven HUANG, Yueh-Lun YANG
  • Patent number: 11968908
    Abstract: In an embodiment, a method includes: forming a first inter-metal dielectric (IMD) layer over a semiconductor substrate; forming a bottom electrode layer over the first IMD layer; forming a magnetic tunnel junction (MTJ) film stack over the bottom electrode layer; forming a first top electrode layer over the MTJ film stack; forming a protective mask covering a first region of the first top electrode layer, a second region of the first top electrode layer being uncovered by the protective mask; forming a second top electrode layer over the protective mask and the first top electrode layer; and patterning the second top electrode layer, the first top electrode layer, the MTJ film stack, the bottom electrode layer, and the first IMD layer with an ion beam etching (IBE) process to form a MRAM cell, where the protective mask is etched during the IBE process.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tai-Yen Peng, Hui-Hsien Wei, Han-Ting Lin, Sin-Yi Yang, Yu-Shu Chen, An-Shen Chang, Qiang Fu, Chen-Jung Wang
  • Patent number: 11963969
    Abstract: Provided is a pharmaceutical composition including gastrodin and a use thereof for the prevention or the treatment of amyotrophic lateral sclerosis. The pharmaceutical composition is effective in reducing neuronal axon degeneration and neurofibromin accumulation, improving symptoms of amyotrophic lateral sclerosis and extending life of patients of amyotrophic lateral sclerosis.
    Type: Grant
    Filed: September 16, 2022
    Date of Patent: April 23, 2024
    Assignee: BUDDHIST TZU CHI MEDICAL FOUNDATION
    Inventors: Chia-Yu Chang, Shinn-Zong Lin, Hsiao-Chien Ting, Hui-I Yang, Horng-Jyh Harn, Hong-Lin Su, Ching-Ann Liu, Yu-Shuan Chen, Tzyy-Wen Chiou, Tsung-Jung Ho
  • Patent number: 11968840
    Abstract: A thin film transistor includes an active layer located over a substrate, a first gate stack including a stack of a first gate dielectric and a first gate electrode and located on a first surface of the active layer, a pair of first contact electrodes contacting peripheral portions of the first surface of the active layer and laterally spaced from each other along a first horizontal direction by the first gate electrode, a second contact electrode contacting a second surface of the active layer that is vertically spaced from the first surface of the active layer, and a pair of second gate stacks including a respective stack of a second gate dielectric and a second gate electrode and located on a respective peripheral portion of a second surface of the active layer.
    Type: Grant
    Filed: November 10, 2021
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Yong-Jie Wu, Yen-Chung Ho, Hui-Hsien Wei, Chia-Jung Yu, Pin-Cheng Hsu, Feng-Cheng Yang, Chung-Te Lin
  • Publication number: 20240120281
    Abstract: A display device comprises a display panel substrate and a glass substrate over said display panel substrate, wherein said display panel substrate comprises multiple contact pads, a display area, a first boundary, a second boundary, a third boundary and a fourth boundary, wherein said display area comprises a first edge, a second edge, a third edge and a fourth edge, wherein said first boundary is parallel to said third boundary and said first and third edges, wherein said second boundary is parallel to said fourth boundary and said second and fourth edges, wherein a first least distance between said first boundary and said first edge, wherein a second least distance between said second boundary and said second edge, a third least distance between said third boundary and said third edge, a fourth distance between said fourth boundary and said fourth edge, and wherein said first, second, third and fourth least distances are smaller than 100 micrometers, and wherein said glass substrate comprising multiple meta
    Type: Application
    Filed: November 30, 2023
    Publication date: April 11, 2024
    Inventor: Ping-Jung Yang
  • Publication number: 20240115706
    Abstract: The present disclosure pertains to a GUCY2C-binding polypeptide and uses thereof and, specifically, to a GUCY2C-binding polypeptide, a fusion protein including same, a chimeric antigen receptor, an immune cell expressing the chimeric antigen receptor, and a use thereof for treatment and/or diagnosis of cancer.
    Type: Application
    Filed: April 7, 2022
    Publication date: April 11, 2024
    Applicant: LG CHEM, LTD.
    Inventors: Youngkyun KIM, Jung Youn SHIN, Yeongrim KO, Soyeon YANG, Beom Ju HONG, Eunhye CHOI, Nakyoung LEE
  • Publication number: 20240120313
    Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Inventors: Sheng-Yao YANG, Ling-Wei LI, Yu-Jui WU, Cheng-Lin HUANG, Chien-Chen LI, Lieh-Chuan CHEN, Che-Jung CHU, Kuo-Chio LIU
  • Patent number: 11952412
    Abstract: The present invention provides a recombinant exosome and uses thereof. More particularly, the present invention provides a recombinant exosome wherein a phagocytosis promoting protein is presented on the surface of the exosome.
    Type: Grant
    Filed: April 3, 2022
    Date of Patent: April 9, 2024
    Assignee: SHIFTBIO
    Inventors: Eun-ee Koh, Eun Jung Lee, Yoo Soo Yang, In-San Kim
  • Patent number: 11955660
    Abstract: This application relates to a separator for a lithium secondary battery, a method for manufacturing a separator for a lithium secondary battery, and a lithium secondary battery including same. The separator includes a porous substrate, a heat resistant layer positioned on at least one surface of the porous substrate and including inorganic particles, and a first adhesive layer positioned on the heat resistant layer and including a first organic polymer. The heat resistant layer includes the inorganic particles of 90 wt % to 99 wt % on the basis of total weight, the thickness of the heat resistant layer is 3.5 ?m to 7 ?m, and the thickness of the first adhesive layer is 0.5 ?m to 3.0 ?m.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: April 9, 2024
    Assignees: SAMSUNG SDI CO., LTD., SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jungsue Jang, Byungmin Lee, Hana Kim, Myungkook Park, Seung Rim Yang, Bokyung Jung, Minho Cho
  • Publication number: 20240110170
    Abstract: The present disclosure relates to a modified polypeptide having xylanase activity and the use thereof.
    Type: Application
    Filed: December 15, 2021
    Publication date: April 4, 2024
    Applicant: CJ CHEILJEDANG CORPORATION
    Inventors: Tae Joo YANG, Jihyun SHIM, Eun Jung CHOI, Byung-sam SON, Jae Yong PARK
  • Patent number: D1024051
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: April 23, 2024
    Assignee: Acer Incorporated
    Inventors: Hui-Jung Huang, Hong-Kuan Li, I-Lun Li, Ling-Mei Kuo, Kuan-Ju Chen, Fang-Ying Huang, Kai-Hung Huang, Szu-Wei Yang, Kai-Teng Cheng