Abstract: An internal voltage generating method performed in a semiconductor device, the internal voltage generating method including generating a plurality of initialization signals corresponding to a plurality of external power supply voltages; detecting a transition of a lastly-generated initialization signal from among the plurality of initialization signals and generating a detection signal; and generating a first internal voltage according to the detection signal.

Abstract: A semiconductor device is provided. The semiconductor device applies data applied through a bump pad on which a bump is mounted through a test pad to a test apparatus such that the reliability of the test can be improved. The amount of test pads is significantly reduced by allowing data output through bump pads to be selectively applied to a test pad. Data and signals applied from test pads are synchronized with each other and applied to bump pads during a test operation such that the reliability of the test can be improved without the need of an additional test chip.

Abstract: A memory system selectively sets signaling modes based on stack position information. The memory system includes a memory module having at least one semiconductor memory device and a memory controller configured to set a signaling mode based on stack position information of each of the semiconductor memory devices. A signaling between the memory controller and each of the semiconductor memory devices is performed in a differential signaling mode, and a signaling among the semiconductor memory devices is performed in a single-ended signaling mode. Accordingly, the memory system has reduced power consumption.

Abstract: A memory device comprises a memory cell array comprising a plurality of memory blocks each comprising a plurality of memory cells and a control setting circuit. The control setting circuit divides the memory blocks into at least first and second groups based on whether each of the memory blocks comprises at least one substandard memory cell, and sets individually control parameters of the first and second groups. The substandard memory cells are identified based on test results of the memory cells with respect to at least one of the control parameters. Each memory block in the first group comprises at least one substandard memory cell, and each memory block in the second group comprises no substandard memory cell.

Abstract: A memory device identifies memory blocks that contain substandard memory cells. The memory device then determines row address codes to apply to the memory blocks during refresh operations. The row address codes determine which memory blocks of the memory block are refreshed together. The row address codes are designed to ensure that memory blocks having substandard memory cells, which must be refreshed more frequently than other cells, are refreshed together, while memory blocks without substandard memory cells are refreshed together.

Abstract: A multi-chip memory device includes a transfer memory chip communicating input/output signals, a stacked plurality of memory chips each including a memory array having a designated bank, and a signal path extending upward from the transfer memory chip through the stack of memory chips to communicate input/output signals, wherein each bank of each memory chip in the stacked plurality of memory chips is commonly addressed to provide read data during a read operation and receive write data during a write operation, and vertically aligned within the stacked plurality of memory chips.

Abstract: A memory cell array with open bit line structure includes a first sub memory cell array, a second sub memory cell array, a sense-amplifier/precharge circuit, first capacitors and second capacitors. The first sub memory cell array is activated in response to a first word line enable signal, and the second sub memory cell array is activated in response to a second word line enable signal. The sense-amplifier/precharge circuit is connected to the first sub memory cell array through first bit lines and to the second sub memory cell array through second bit lines, and the sense-amplifier/precharge circuit precharges the first bit lines and the second bit lines and amplifies data provided from the first sub memory cell array and the second sub memory cell array.

Abstract: A semiconductor memory device is disclosed. The semiconductor device includes a memory cell array, a clock signal generator configured to receive an external clock signal from the outside of the memory device and output an internal clock signal, and a data output unit configured to receive an internal data signal from the memory cell array and output a read data signal in response to the internal clock signal. The semiconductor memory device also includes a read data strobe unit configured to output a read data strobe signal having a cycle time of n times (n is an integer equal to or more than 2) a cycle time of the internal clock signal, based on the internal clock signal.

Abstract: A multi memory chip stacked on a multi core CPU includes a plurality of memories, each memory corresponding to a CPU core from among the CPU cores and being configured to directly transmit data between the other memories of the multi memory chip.

Abstract: Disclosed is a method of controlling a deep power down mode in a multi-port semiconductor memory having a plurality of ports connected to a plurality of processors. Control of the deep power down mode in the multi-port semiconductor memory is performed such that activation/deactivation of the deep power down mode are determined in accordance with signals applied through various ports in the plurality of ports.

Abstract: A multi-chip memory device includes a transfer memory chip communicating input/output signals, a stacked plurality of memory chips each including a memory array having a designated bank, and a signal path extending upward from the transfer memory chip through the stack of memory chips to communicate input/output signals, wherein each bank of each memory chip in the stacked plurality of memory chips is commonly addressed to provide read data during a read operation and receive write data during a write operation, and vertically aligned within the stacked plurality of memory chips.

Abstract: A method and circuit are provided for driving a word line. The word line driving circuit includes first and second power drivers, a switching unit and a word line driver. The first power driver is driven to a boosting voltage level and the second power driver is driven to an internal power voltage level. The switching unit transfers a first output of the first power driver to the word line driver in response to a first switching signal and transfers a second output of the second power driver to the word line driver in response to a second switching signal. The word line driver alternately drives a word line to the first output and the second output transferred from the switching unit in response to a word line driving signal.

Abstract: According to one embodiment, a method of performing fast locking in a delay locked loop circuit is disclosed. The method includes performing a first comparison comparing an input clock signal to a first feedback clock signal that is a non-inverted feedback clock signal, and performing a second comparison comparing the input clock signal to a second feedback clock signal that is the feedback clock signal inverted. The method also includes, based on the first and second comparisons, selecting one of the non-inverted feedback clock signal or the inverted feedback clock signal to synchronize with the input clock signal. In addition, the method includes synchronizing the selected clock signal with the input clock signal.

Abstract: A semiconductor memory module includes a memory module board having at least one semiconductor memory device, an advanced memory buffer (AMB) for receiving the data and the command/address signal from a host and providing the data and the command/address signal to the at least one semiconductor memory device, and a second termination resistor unit located on the memory module board and electrically connected to the AMB. The at least one semiconductor memory device includes a data input buffer for receiving data via a first input terminal and receiving a first reference voltage via a second input terminal, a command/address input buffer for receiving a command/address signal via a first input terminal and receiving a second reference voltage via a second input terminal, and a first termination resistor unit connected to the first input terminal of the data input buffer.

Abstract: A memory module and a related memory system are disclosed. The memory module comprises a semiconductor memory having a data output buffer, a data input buffer, a command/address input buffer and a first termination resistor unit connected to a data bus. The memory module further comprises a second termination resistor unit connected to an internal command/address bus. First and second termination resistor units are preferably of different resistive value and/or type.

Abstract: A semiconductor memory device includes a sense amplifier, a sense amplifier driving signal driver, and a controller. The sense amplifier is configured to sense and amplify a signal of a bit line and a signal of a complementary bit line in response to a sense amplifier driving signal. The sense amplifier driving signal driver includes a first driving signal driver configured to drive via a transmission line the sense amplifier driving signal in response to a first sense amplifier control signal, and a second driving signal driver configured to drive via the transmission line the sense amplifier driving signal in response to a second sense amplifier control signal. The controller activates the first sense amplifier control signal in response to an active command, and toggles the second sense amplifier control signal while the first sense amplifier control signal is activated.

Abstract: A semiconductor memory device includes a plurality of memory banks; a plurality of temperature sensing circuits, and a shared control circuit. The temperature sensing circuits correspond to the memory banks and each is disposed in the vicinity of a corresponding memory bank. The shared control circuit is connected to the plurality of temperature sensing circuits and a plurality of refresh circuits for refreshing the plurality of memory banks, performs calibration on the plurality of temperature sensing circuits, performs digital processing on signals for separately controlling refresh intervals for the plurality of memory banks, and transmits the processed signals to the plurality of refresh circuits. Therefore, the refresh intervals for individual channels or banks are separately or selectively controlled. Further, since the plurality of temperature sensing circuits are connected to the shared temperature control circuit, the occupied area of the circuits in a chip is reduced or minimized.

Abstract: A semiconductor memory device includes a bit line sense amplifier, a bit line pair that includes a bit line and a complementary bit line, the bit line and the complementary bit line of the bit line pair each being coupled to the bit line sense amplifier, a memory cell array having a plurality of memory banks, the memory banks including word lines and a plurality of memory cells, and a word line activation control unit that performs a control to access data corresponding to an externally same address in at least two memory cells by simultaneously activating a predetermined number of word lines from among the word lines sharing the bit line sense amplifier, and the word line activation control unit operates in response to a determination mode allowing signal that is set in accordance with a used memory density.

Abstract: A memory module and a related memory system are disclosed. The memory module comprises a semiconductor memory having a data output buffer, a data input buffer, a command/address input buffer and a first termination resistor unit connected to a data bus. The memory module further comprises a second termination resistor unit connected to an internal command/address bus. First and second termination resistor units are preferably of different resistive value and/or type.