Abstract: A memory module and a related memory system are disclosed. The memory module comprises a semiconductor memory having a data output buffer, a data input buffer, a command/address input buffer and a first termination resistor unit connected to a data bus. The memory module further comprises a second termination resistor unit connected to an internal command/address bus. First and second termination resistor units are preferably of different resistive value and/or type.

Abstract: The invention provides an improved memory system that addresses signal degradation due to transmission line effects. The improved memory system includes a first buffer, at least one first memory device coupled to the first buffer, and a plurality of signal traces. The first buffer and memory device are mounted on a motherboard. Likewise, the plurality of signal traces is routed on the motherboard. Doing so eliminates stub loads that cause signal reflection that, in turn, result in signal degradation.

Abstract: A semiconductor memory device and an arrangement method thereof are disclosed. The semiconductor memory device comprises column selecting signal lines and global data IO signal lines arranged on the same layer in the same direction above a memory cell array; word lines and first local data IO signal lines arranged on a different layer from the column selecting signal lines above the memory cell array, in a perpendicular direction to the column selecting signal lines; and second local data IO signal lines arranged on a different layer from the column selecting signal lines and the word lines above the memory cell array, in the same direction as the first local data IO signal lines.

Abstract: A semiconductor device includes a first substrate including at least one first well region and first impurity regions on portions of the substrate and a bias voltage plate on a surface of the substrate. A semiconductor device may be of a three dimensional stack structure, and in example embodiments, the semiconductor device may further include a through contact plug substantially perpendicularly penetrating at least one substrate and at least one bias voltage plate. Therefore, a design margin of a semiconductor device may be enhanced and a bias voltage may be provided reliably.

Abstract: A semiconductor memory module includes a memory module board having at least one semiconductor memory device. The semiconductor memory device includes a data input buffer that receives data and a first reference voltage via first and second input terminals, a command/address buffer that receives a command/address signal and a second reference voltage via first and second input terminals, and a first termination resistor unit connected to the first input terminal of the data input buffer. The semiconductor memory module further includes a second termination resistor unit located on the memory module board and connected to an internal command/address bus. The first termination resistor unit includes a first resistor connected between a first voltage source and the first input terminal of the data input buffer, and the second termination resistor unit includes a second resistor connected between a second voltage source and the first input terminal of the command/address input buffer.

Abstract: A data buffer, such as a data strobe input buffer or a data input buffer, which may operate in multiple modes, such as a single mode (SM) and a dual mode (DM) and where the mode is selected by providing a signal, such as an external signal such as an address signal or an external command signal. A data buffer which can be used for a SM/DM dual-use and can improve a data setup/hold margin. A semiconductor memory device including one or more of the data buffers described above. A method for controlling propagation delay times which can improve a data setup/hold margin in a SM/DM dual-use data buffer.

Abstract: A semiconductor memory device includes a controller, a plurality of substrates, and a plurality of stacked memories that are spaced apart and sequence on each of the substrates. Each of the stacked memories includes an interface chip that is connected to the respective substrate and a plurality of memory chips that are stacked on the interface chip. The controller is configured to control the stacked memories. The interface chips are configured to forward a command signal from the controller through each interface chip in the sequence of stacked memories that is intervening between the controller and a selected stacked memory to which the command signal is directed.

Abstract: A display apparatus having a display. The display apparatus includes a video signal processor having a processor to process an input video signal and a picture quality improving part to improve picture quality of the processed video signal. The video signal processor processes the video signal through a path that includes a signal processing path to selectively bypass the picture quality improving part. The display apparatus further includes a selection input part through which the user selects a bypass mode corresponding to the signal processing path. Finally, the display apparatus has a controller controlling the video signal processor to output the video signal processed through the processor to the display after bypassing the picture quality improving part when the user selects the bypass mode through the selection input part. Thus, the picture quality improving function may be omitted to thereby reduce signal processing time.

Abstract: A memory system includes a plurality of memory devices arranged in sets on at least one memory module, each set including at least one memory device. In some embodiments, the system further includes respective dedicated serial data and control busses configured to couple respective ones of the memory device sets to a memory controller external to the at least one memory module. The dedicated serial data and control busses may be configured to provide unbuffered access to the individual memory devices from the memory controller. In other embodiments, dedicated data busses are provided to an external control buffer and dedicated control busses are provided to a control buffer in the module.

Abstract: A semiconductor memory device utilizing a data coding method in an initial operation. The device includes a plurality of counters that count the number of data bits and flag information data bits. A data coding unit selectively applies a first and second operation mode. The first operation mode codes the data of the first through nth data groups such that the counted number of data bits in a first logic state is minimized. The second operation mode codes the data of the first through nth data groups such that the difference between the number of data bits and flag information bits in the first and second logic state are minimized. This prevents the initial logic state of data from being changed due to a voltage drop in the initial operation of the device.

Abstract: A memory cell array with open bit line structure includes a first sub memory cell array, a second sub memory cell array, a sense-amplifier/precharge circuit, first capacitors and second capacitors. The first sub memory cell array is activated in response to a first word line enable signal, and the second sub memory cell array is activated in response to a second word line enable signal. The sense-amplifier/precharge circuit is connected to the first sub memory cell array through first bit lines and to the second sub memory cell array through second bit lines, and the sense-amplifier/precharge circuit precharges the first bit lines and the second bit lines and amplifies data provided from the first sub memory cell array and the second sub memory cell array.

Abstract: An output driver controls impedance using a mode register set. The output driver includes a main driving circuit that outputs and drives a main signal based on a data signal to a predetermined transmission line, an auxiliary driving circuit that outputs and drives an auxiliary signal to the transmission line, and a mode register set. The mode register set generates an impedance control signal group, a driving width control signal group and a delay control signal group. The amount of an auxiliary impedance (SIM), and the driving width and driving time point of an auxiliary signal (XSDR) can be controlled using the impedance control signal group, the driving width control signal group and the delay control signal group. Therefore, in accordance with the output driver of the present invention, the amount of output impedance (OIM), a pre-emphasis width and a pre-emphasis time point can be readily controlled, and the efficiency of the transmission of an output signal to a reception system is improved.

Abstract: The invention relates generally to a multi-chip package (MCP) memory device, and more particularly, but without limitation, to a MCP memory device having a reduced size. In one embodiment, the MCP memory device includes: a transfer memory chip; and a plurality of memory chips coupled to the transfer memory chip, each of the plurality of memory chips including an internal voltage generating circuit, the transfer memory chip configured to receive a plurality of command signals from outside the MCP memory device, the transfer memory chip further configured to output a plurality of control signals to the plurality of memory chips based on the plurality of command signals. Embodiments of the invention also relate to a method of controlling an internal voltage of the MCP memory device.

Abstract: The present invention provides an apparatus including a stacked plurality of devices and a related method. The apparatus includes a stacked plurality of devices including a master device and at least one secondary device; a plurality of segments, each segment being associated with one of the stacked plurality of devices; and a plurality of N vertical connection paths traversing the stacked plurality of devices. The apparatus further includes a plurality of M vertical signal paths configured from the plurality of N vertical connections paths, wherein M is less than N, and at least one of the plurality of M vertical signal paths is a merged vertical signal path adaptively configured by the master device using at least one segment from each one of at least two of the plurality of N vertical connection paths.

Abstract: A multi-chip memory device includes a transfer memory chip communicating input/output signals, a stacked plurality of memory chips each including a memory array having a designated bank, and a signal path extending upward from the transfer memory chip through the stack of memory chips to communicate input/output signals, wherein each bank of each memory chip in the stacked plurality of memory chips is commonly addressed to provide read data during a read operation and receive write data during a write operation, and vertically aligned within the stacked plurality of memory chips.

Abstract: A data buffer, such as a data strobe input buffer or a data input buffer, which may operate in multiple modes, such as a single mode (SM) and a dual mode (DM) and where the mode is selected by providing a signal, such as an external signal such as an address signal or an external command signal. A data buffer which can be used for a SM/DM dual-use and can improve a data setup/hold margin. A semiconductor memory device including one or more of the data buffers described above. A method for controlling propagation delay times which can improve a data setup/hold margin in a SM/DM dual-use data buffer.

Abstract: An internal voltage generating circuit is provided. The internal voltage generating circuit of a semiconductor device includes a control signal generating circuit for generating a control signal according to a number of data bits, a comparator for comparing a reference voltage to an internal voltage to generate a driving signal when the control signal is inactivated, a driving signal control circuit for inactivating the driving signal when the control signal is activated, and an internal voltage driving circuit for receiving an external power voltage and generating the internal voltage in response to the driving signal. Therefore, an internal voltage can be turned to a reference voltage level or to an external power voltage level according to the number of data input and/or output bits of a semiconductor device, and even when the number of data input and/or output bits is increased, a data access speed can be improved.

Abstract: A semiconductor memory device includes a stacked plurality of interposer chips, each interposer chip seating a smaller corresponding memory chip, wherein a lowermost interposer chip in the stacked plurality of interposer chips is mounted on a buffer chip. Each one of the stacked plurality of interposer chips includes a central portion having bond pads seating the corresponding memory device and a peripheral portion having a plurality of through silicon vias (TSVs). The respective pluralities of TSVs for adjacent interposer chips in the stacked plurality of interposer chips are connected via vertical connection elements to form multiple internal signal paths communicating write data from and read data to the buffer chip from respective memory chips.

Abstract: A stress detection circuit includes a function block and a detection signal generation circuit. The function block outputs a first voltage such that the first voltage is varied depending on an extent that the function block is stressed. The detection signal generation circuit generates a stress detection signal based on the first voltage and a second voltage during a test mode. The stress detection signal represents integration of the function block, and a level of the second voltage corresponds to a level of the first voltage before the function block is stressed.

Abstract: In a communication system, data is selectively transmitted using single-ended or differential signaling. The data is transmitted in relation to a plurality of clock signals having different relative phases. When the data is transmitted using single-ended signaling, data on adjacent signal lines undergo logic transitions at different times in relation to the plurality of clock signals.