Abstract: Methods of manufacturing semiconductor devices having slopes at lower sides of an interconnection hole include an etch-stop layer and an interlayer dielectric layer sequentially formed on a semiconductor substrate having the lower conductive layer. Portions of the etch-stop layer are exposed by selectively etching the interlayer dielectric layer. A step is formed in the etch-stop layer by removing portions of the exposed etch-stop layer. And, the step is formed at a boundary between a recessed portion of the exposed etch-stop layer and a raised portion of the etch-stop layer covered with the interlayer dielectric layer. Portions of the interlayer dielectric layer are removed to expose portions of the raised portion of the etch-stop layer. And, the exposed recessed and raised portions are anisotropically etched to expose the lower conductive layer and to form the interconnection hole having the slopes, wherein the slopes are made of a residual etch-stop layer at the lower sides of the interconnection hole.

Abstract: Disclosed herein is a method of manufacturing a multilayered ceramic capacitor by a spin coating process, and a multilayered ceramic capacitor obtained by the above method. The method of the current invention provides a plurality of dielectric layers formed by spin coating, in which the process of coating the dielectric layer and the process of printing the inner electrode can be provided as a single process. Therefore, the thickness of the dielectric layer is easily controlled while the dielectric layer is formed to be thin. Further, since the dielectric layers and the inner electrodes are formed successively, the processes of separating and layering the dielectric layers, and the process of compressing the ceramic multilayered body can be omitted. Thereby, the ceramic multilayered body need not be compressed, and thus, a pillowing phenomenon does not occur in the multilayered ceramic capacitor.

Abstract: A driving circuit and a display device including the driving circuit are presented. The driving circuit has a controller, a driving voltage generator, and a gate signal generator. The driving voltage generator generates a first voltage; the controller receives the first voltage and generates a second voltage according to an ambient temperature; and the gate signal generator generates a third voltage based on the second voltage. Accordingly, since only the gate-on voltage Von is designed to change, problems associated with a change in the driving voltage AVDD, such as deterioration of image quality, an increase in power consumption, an increase in operating temperature of the drivers, and shortening of the lifespan of a product, can be reduced or eliminated.

Abstract: Disclosed herein is a portable charger for a mobile phone. The portable charger includes a front housing, a rear housing, a belt clip, a fastening unit, a pair of clamps, a release button, an interface connector, a secondary battery and a charge control unit. The portable charger is easy to carry, can easily charge the battery of the mobile phone with direct current power charged in a secondary battery, and can simultaneously charge the secondary battery and the battery of the mobile phone using a travel adaptor.

Abstract: A flash memory device including memory cells, each memory cell configured to store bits, a sensing circuit configured to sequentially sense, for each memory cell, sets of the bits of the memory cell, a data rearrangement unit configured to receive words of data and to rearrange bits of the words to be stored in the memory cells, and an output circuit configured to output a group of the words using the sets of bits from one sensing, at least as early as during a subsequent sensing of sets of bits.

Abstract: Provided is an improved blower fan structure in which length of blades is increased and inlet and outlet angles of the blades are optimized for highly increasing an efficiency of the blower fan. Particularly, an outer diameter of the blades is more than or equal to two times of an inner diameter thereof, for increasing the efficiency without generating a noise.

Abstract: Methods of manufacturing semiconductor devices having slopes at lower sides of an interconnection hole include an etch-stop layer and an interlayer dielectric layer sequentially formed on a semiconductor substrate having the lower conductive layer. Portions of the etch-stop layer are exposed by selectively etching the interlayer dielectric layer. A step is formed in the etch-stop layer by removing portions of the exposed etch-stop layer. And, the step is formed at a boundary between a recessed portion of the exposed etch-stop layer and a raised portion of the etch-stop layer covered with the interlayer dielectric layer. Portions of the interlayer dielectric layer are removed to expose portions of the raised portion of the etch-stop layer. And, the exposed recessed and raised portions are anisotropically etched to expose the lower conductive layer and to form the interconnection hole having the slopes, wherein the slopes are made of a residual etch-stop layer at the lower sides of the interconnection hole.

Abstract: A piping structure of an air conditioner causes a looped main piping connected to a compressor of an outdoor unit of the air conditioner to be branched into two or more branch pipings within a predetermined interval of the main piping and cause the branch pipings to be jointed at an arbitrary location. According to the piping structure, it is possible to reduce a vibration by an interference phenomenon, which is generated when either a refrigerant pulsation or a periodic vibration of the compressor is divided and then combined.

Abstract: Provided is a pipe structure for an outdoor unit of an air conditioner, in which a length of an induction pipe of a compressor mounted in the outdoor unit is shorter than a connection pipe in the outdoor unit in order to decrease vibration of the outdoor unit of the air conditioner.

Abstract: A pipe structure of an air conditioner, wherein the pipes inside the machinery room are concentrated on one side of the compressor to form long up-down direction so that the pipes inside the machinery room of the air conditioner may be formed in a compact manner, is provided.

Abstract: An improved piping structure of an air conditioner can minimize a vibration by change in a piping shape in looped pipings. In the piping structure, a first directional piping part configured on a same plane is changed to be slanted at a predetermined angle on one end thereof, to be displaced onto a third plane, and to be connected with a second directional piping part configured on a different plane from that of the first directional piping part. Further, the piping structure comprises a vertical piping part wound in an up and down direction and a horizontal piping part connected to the vertical piping part having one end changed at a predetermined slant angle.

Abstract: Flash memory devices are provided including a power supply pad unit. The power supply pad unit includes a first power supply pad, a second power supply pad and a power level detection circuit. The first power and second power supply pads are electrically coupled to the power level detection circuit.

Abstract: An air conditioning system includes an indoor unit disposed in an interior side, an outdoor unit disposed in an exterior side to direct a refrigerant to the indoor unit, the outdoor unit comprising a compressor for compressing the refrigerant, a heat exchanger for condensing the refrigerant compressed in the compressor, a fan for forcedly generating air current, and a motor for driving the fan, and a humidity adjusting apparatus formed on one of both sides of the outdoor unit to direct humidity adjusted air to the interior side.

Abstract: Disclosed is a structure of an outdoor unit in an air conditioner, capable of reducing vibration of the pipes even more, by providing a damping member for making different pipes connected each other so that the vibration system of the pipes inside the machinery room may be changed.

Abstract: A flash memory apparatus having a single body type rotary cover, wherein a cover is not completely separated from a main body so that loss of the cover is prevented. The flash memory apparatus includes: a flash memory main body including a rectangular shaped case within which a memory element is mounted. A USB terminal piece is electrically connected with the memory element and is installed at a front end of the case to project therefrom and a hinge protuberance formed on at least one side of the case. A cover defined by a pair of parallel plate members facing each other with an interval corresponding to the thickness of the case is provided. The cover has an open front end and a closed rear end. Both lateral ends of the cover are open.

Abstract: A pipe structure of an air conditioner, wherein the pipes inside the machinery room are concentrated on one side of the compressor to form long up-down direction so that the pipes inside the machinery room of the air conditioner may be formed in a compact manner, is provided.

Abstract: Disclosed herein is a portable charger for a mobile phone. The portable charger includes a front housing, a rear housing, a belt clip, a fastening unit, a pair of clamps, a release button, an interface connector, a secondary battery and a charge control unit. The portable charger is easy to carry, can easily charge the battery of the mobile phone with direct current power charged in a secondary battery, and can simultaneously charge the secondary battery and the battery of the mobile phone using a travel adaptor.

Abstract: A photomask having small pitch images of openings for fabricating an opening of a semiconductor memory device includes a plurality of images of openings arranged in a row direction with a predetermined pitch to be used to transfer the images of openings onto a photoresist layer, and is used for a photolithographic process employing a photoresist flow process. The distance between the centers of the images of openings arranged in the photomask is larger than the pitch. A photolithographic method for fabricating reduced size openings and a semiconductor memory device having openings fabricated using the same method is also provided.

Abstract: Methods of manufacturing semiconductor devices having slopes at lower sides of an interconnection hole include an etch-stop layer and an interlayer dielectric layer sequentially formed on a semiconductor substrate having the lower conductive layer. Portions of the etch-stop layer are exposed by selectively etching the interlayer dielectric layer. A step is formed in the etch-stop layer by removing portions of the exposed etch-stop layer. And, the step is formed at a boundary between a recessed portion of the exposed etch-stop layer and a raised portion of the etch-stop layer covered with the interlayer dielectric layer. Portions of the interlayer dielectric layer are removed to expose portions of the raised portion of the etch-stop layer. And, the exposed recessed and raised portions are anisotropically etched to expose the lower conductive layer and to form the interconnection hole having the slopes, wherein the slopes are made of a residual etch-stop layer at the lower sides of the interconnection hole.

Abstract: Disclosed is a flash memory apparatus having a single body type rotary cover, wherein a cover is not completely separated from the main body in any case whatsoever so that lost of the cover is prevented.