Abstract: Provided is a pipe structure for an outdoor unit of an air conditioner, in which a length of an induction pipe of a compressor mounted in the outdoor unit is shorter than a connection pipe in the outdoor unit in order to decrease vibration of the outdoor unit of the air conditioner.

Abstract: A pipe structure of an air conditioner, wherein the pipes inside the machinery room are concentrated on one side of the compressor to form long up-down direction so that the pipes inside the machinery room of the air conditioner may be formed in a compact manner, is provided.

Abstract: An improved piping structure of an air conditioner can minimize a vibration by change in a piping shape in looped pipings. In the piping structure, a first directional piping part configured on a same plane is changed to be slanted at a predetermined angle on one end thereof, to be displaced onto a third plane, and to be connected with a second directional piping part configured on a different plane from that of the first directional piping part. Further, the piping structure comprises a vertical piping part wound in an up and down direction and a horizontal piping part connected to the vertical piping part having one end changed at a predetermined slant angle.

Abstract: Flash memory devices are provided including a power supply pad unit. The power supply pad unit includes a first power supply pad, a second power supply pad and a power level detection circuit. The first power and second power supply pads are electrically coupled to the power level detection circuit.

Abstract: An air conditioning system includes an indoor unit disposed in an interior side, an outdoor unit disposed in an exterior side to direct a refrigerant to the indoor unit, the outdoor unit comprising a compressor for compressing the refrigerant, a heat exchanger for condensing the refrigerant compressed in the compressor, a fan for forcedly generating air current, and a motor for driving the fan, and a humidity adjusting apparatus formed on one of both sides of the outdoor unit to direct humidity adjusted air to the interior side.

Abstract: Disclosed is a structure of an outdoor unit in an air conditioner, capable of reducing vibration of the pipes even more, by providing a damping member for making different pipes connected each other so that the vibration system of the pipes inside the machinery room may be changed.

Abstract: A flash memory apparatus having a single body type rotary cover, wherein a cover is not completely separated from a main body so that loss of the cover is prevented. The flash memory apparatus includes: a flash memory main body including a rectangular shaped case within which a memory element is mounted. A USB terminal piece is electrically connected with the memory element and is installed at a front end of the case to project therefrom and a hinge protuberance formed on at least one side of the case. A cover defined by a pair of parallel plate members facing each other with an interval corresponding to the thickness of the case is provided. The cover has an open front end and a closed rear end. Both lateral ends of the cover are open.

Abstract: A pipe structure of an air conditioner, wherein the pipes inside the machinery room are concentrated on one side of the compressor to form long up-down direction so that the pipes inside the machinery room of the air conditioner may be formed in a compact manner, is provided.

Abstract: Disclosed herein is a portable charger for a mobile phone. The portable charger includes a front housing, a rear housing, a belt clip, a fastening unit, a pair of clamps, a release button, an interface connector, a secondary battery and a charge control unit. The portable charger is easy to carry, can easily charge the battery of the mobile phone with direct current power charged in a secondary battery, and can simultaneously charge the secondary battery and the battery of the mobile phone using a travel adaptor.

Abstract: A photomask having small pitch images of openings for fabricating an opening of a semiconductor memory device includes a plurality of images of openings arranged in a row direction with a predetermined pitch to be used to transfer the images of openings onto a photoresist layer, and is used for a photolithographic process employing a photoresist flow process. The distance between the centers of the images of openings arranged in the photomask is larger than the pitch. A photolithographic method for fabricating reduced size openings and a semiconductor memory device having openings fabricated using the same method is also provided.

Abstract: Methods of manufacturing semiconductor devices having slopes at lower sides of an interconnection hole include an etch-stop layer and an interlayer dielectric layer sequentially formed on a semiconductor substrate having the lower conductive layer. Portions of the etch-stop layer are exposed by selectively etching the interlayer dielectric layer. A step is formed in the etch-stop layer by removing portions of the exposed etch-stop layer. And, the step is formed at a boundary between a recessed portion of the exposed etch-stop layer and a raised portion of the etch-stop layer covered with the interlayer dielectric layer. Portions of the interlayer dielectric layer are removed to expose portions of the raised portion of the etch-stop layer. And, the exposed recessed and raised portions are anisotropically etched to expose the lower conductive layer and to form the interconnection hole having the slopes, wherein the slopes are made of a residual etch-stop layer at the lower sides of the interconnection hole.

Abstract: Disclosed is a flash memory apparatus having a single body type rotary cover, wherein a cover is not completely separated from the main body in any case whatsoever so that lost of the cover is prevented.

Abstract: A photomask having small pitch images of openings for fabricating an opening of a semiconductor memory device includes a plurality of images of openings arranged in a row direction with a predetermined pitch to be used to transfer the images of openings onto a photoresist layer, and is used for a photolithographic process employing a photoresist flow process. The distance between the centers of the images of openings arranged in the photomask is larger than the pitch. A photolithographic method for fabricating reduced size openings and a semiconductor memory device having openings fabricated using the same method is also provided.

Abstract: A photomask having small pitch images of openings for fabricating an opening of a semiconductor memory device includes a plurality of images of openings arranged in a row direction with a predetermined pitch to be used to transfer the images of openings onto a photoresist layer, and is used for a photolithographic process employing a photoresist flow process. The distance between the centers of the images of openings arranged in the photomask is larger than the pitch. A photolithographic method for fabricating reduced size openings and a semiconductor memory device having openings fabricated using the same method is also provided.

Abstract: In video compression processing, such as MPEG-2 compression processing, the quantization (Q) matrix used to quantize discrete cosine transform (DCT) coefficients is updated from frame to frame based on a parameterized Q matrix adaptation algorithm. According to the algorithm, the Q matrix for the current frame is generated based on DCT coefficient data from the previously encoded frame of the same type (e.g., I, P, or B) as the current frame. In particular, the Q matrix is generated using a function based on shape parameters (e.g., the slope of the diagonal of the Q matrix and/or the convexity of the diagonal of the Q matrix), where the diagonal slope for the Q matrix of the current frame is generated based on the diagonal slope of a DCT map for the previously encoded frame. Before using the generated Q matrix to quantize the DCT coefficients for the current frame, the Q matrix is preferably adjusted for changes in the target mean from the previously encoded frame to the current frame.

Abstract: Disclosed is a semiconductor package and a method for manufacturing the same. A planar or substantially planar die pad is disposed within a leadframe and is connected to the leadframe by a plurality of tie bars. An perimeter of an upper and lower surface of the die pad is half-etched to increase the moisture-permeation path of the finished package. A plurality of rectangular leads extends from the leadframe toward the die pad without contacting the die pad. A silver-plating layer may be formed on the upper surface of the leadframe. A semiconductor chip is mounted on the upper surface of the die pad in the leadframe. After deflashing, the package is treated with a sulfuric (H2SO4)-based solution to restore the internal leads to their original color. Prior to singulation, the externally exposed bottom surfaces of the leads are plated with copper, gold, solder, tin, nickel, palladium, or an alloy thereof to form a predetermined thickness of a plating layer.

Abstract: An input buffer capable of achieving quick response. The input buffer includes first and second direct-current (DC) voltage controllers and first and second drivers. The first and second DC voltage controllers generate first and second alternating current (AC) signals having AC voltage components of the buffer input signal reflected thereon, respectively. The first driver drives the voltage level of a buffer output signal to the level of a first voltage, that is, a power supply voltage, in response to the first AC signal. The second driver drives the voltage level of a buffer output signal to the level of a second voltage, that is, a ground voltage, in response to the second AC signal. The first and second AC signals respond to a buffer input signal quickly. The first and the second drivers drive the levels of the buffer output signal to the power supply voltage level and the ground voltage level quickly and by a large amount.

Abstract: A photomask having small pitch images of openings for fabricating an opening of a semiconductor memory device includes a plurality of images of openings arranged in a row direction with a predetermined pitch to be used to transfer the images of openings onto a photoresist layer, and is used for a photolithographic process employing a photoresist flow process. The distance between the centers of the images of openings arranged in the photomask is larger than the pitch. A photolithographic method for fabricating reduced size openings and a semiconductor memory device having openings fabricated using the same method is also provided.

Abstract: Disclosed are a printed circuit board and a method for wiring signal lines on the same. Connecting lines for electrically connecting chip select pins of a semiconductor chip, no connect pins and address designate pins, are formed on a PCB. In case of an unstack type, a pad is connected to chip select pin and no connect functioning pin of other semiconductor chip via a first signal line. In case of a stack type, another pad used with a pad is connected to a no connect functioning pin and a chip select pin of the corresponding semiconductor chip having no connection with the first signal line via a second signal line. According to the type of semiconductor chip, e.g. unstack or stack type, a second connecting pad selectively connecting by a first jumper having almost zero resistance value, is disposed between the first and the second signal lines. A first connecting pad is also disposed at the second signal line, the first pad is selectively connected by a second jumper having zero resistance value.

Abstract: The present invention is directed to a floor for a passenger conveyor which includes floor rollers mounted below the floor, floor roller guide rails mounted upon a machine room for guiding the rollers, and a lift mounted in the machine room to be in contact with a bottom of the floor, wherein the floor can be easily opened and closed by one person without any other instrument in repair or maintenance, and wherein it is not needed to move the floor to another place after opening because the floor can stand upright in its place after opening the floor, so improving efficiency of working.