Abstract: A semiconductor package includes: a chip-via composite substrate including a substrate, a semiconductor chip, and a plurality of through vias, wherein the substrate has a first surface and a second surface opposite to the first surface and includes a first region and a second region around the first region, wherein the semiconductor chip is provided in the first region and has chip pads and circuit patterns that are electrically connected to the chip pads, and wherein the plurality of through vias is provided in the second region and penetrate the substrate; a first redistribution wiring layer provided on the first surface of the substrate and having first redistribution wirings that are electrically connected to the chip pads and the through vias; and a second redistribution wiring layer provided on the second surface of the substrate and having second redistribution wirings that are electrically connected to the through vias.

Abstract: Provided is a display apparatus having improved reliability by effectively controlling spreading of an organic layer. The display apparatus includes a substrate including a display area, and a peripheral area outside the display area, a display element at the display area, an input-sensing layer over the display element, and an optical functional layer on the input-sensing layer, and including a first layer, which corresponds to the display area and the peripheral area, and a second layer on the first layer, and having a greater refractive index than the first layer, wherein the first layer defines a first valley portion defining first holes that is on the peripheral area, and that surrounds the second layer.

Abstract: Provided is a plasma processing apparatus including a substrate chuck in a chamber, a restriction ring surrounding an outer perimeter of the substrate chuck, a movable ring on the restriction ring, and an actuator configured to move the movable ring, wherein grooves formed in the restriction ring are opened or closed by movement of the movable ring. In addition, provided is a plasma processing method using the plasma processing apparatus.

Abstract: Embodiments relate to a user authentication device configured to detect a face region in a target object image including at least part of a face of a target object, recognize masked or unmasked in the face region, extract target object characteristics data from the face region of the target object image, call reference data and authenticate if the target object is a registered device user based on the called reference data and the target object characteristics data. The reference data is generated from an unmasked image of the registered device user.

Abstract: A display apparatus includes: a first electrode; a bank layer defining a first opening which overlaps the first electrode in a plan view; an emission layer which overlaps the first electrode through the first opening; a second electrode on the emission layer; an encapsulation layer on the second electrode; a first insulating layer on the encapsulation layer, where the first insulating layer includes a first portion overlapping the first opening and defines a trench surrounding the first portion; a touch electrode on the first insulating layer; a second insulating layer on the touch electrode and defining a second opening which overlaps the first opening; and a third insulating layer on the second insulating layer.

Abstract: The present disclosure relates to a technology for skeleton-based action recognition based on a graph convolutional network, in which an action processing device receives a frame including a skeleton with respect to actions of an object, extracts spatiotemporal features with respect to the skeleton by using a rank adjacency matrix in which a distance between one node and another node and an adjacency ranking are considered, merges an object and vertices in the input frame based on the extracted spatiotemporal features, and performs a classification task.

Abstract: A semiconductor package includes a first redistribution wiring layer having first and second surfaces opposite to each other, the first redistribution wiring layer including a plurality of first redistribution wires and a plurality of landing pads electrically connected to the first redistribution wires, the plurality of landing pads exposed from the second surface, a second redistribution wiring layer disposed on the first surface of the first redistribution wiring layer, the second redistribution wiring layer including an insulating layer, a logic semiconductor chip provided in the insulating layer, second redistribution wires electrically connected to the logic semiconductor chip, and third redistribution wires electrically connected to the first redistribution wires, the third redistribution wires extending to penetrate the insulating layer, a third redistribution wiring layer disposed on the second redistribution wiring layer, the third redistribution wiring layer including fourth redistribution wires el

Abstract: A semiconductor package includes: a chip-via composite substrate including a substrate, a semiconductor chip, and a plurality of through vias, wherein the substrate has a first surface and a second surface opposite to the first surface and includes a first region and a second region around the first region, wherein the semiconductor chip is provided in the first region and has chip pads and circuit patterns that are electrically connected to the chip pads, and wherein the plurality of through vias is provided in the second region and penetrate the substrate; a first redistribution wiring layer provided on the first surface of the substrate and having first redistribution wirings that are electrically connected to the chip pads and the through vias; and a second redistribution wiring layer provided on the second surface of the substrate and having second redistribution wirings that are electrically connected to the through vias.

Abstract: Embodiments relate to a human behavior recognition system using hierarchical class learning considering safety, the human behavior recognition system including a behavior class definer configured to form a plurality of behavior classes by sub-setting a plurality of images each including a subject according to pre-designated behaviors and assign a behavior label to the plurality of images, a safety class definer configured to calculate a safety index for the plurality of images, form a plurality of safety classes by sub-setting the plurality of images based on the safety index, and additionally assign a safety label to the plurality of images, and a trainer configured to train a human recognition model by using the plurality of images defined as hierarchical classes by assigning the behavior label and the safety label as training images.

Abstract: Provided is a display apparatus having improved reliability by effectively controlling spreading of an organic layer. The display apparatus includes a substrate including a display area, and a peripheral area outside the display area, a display element at the display area, an input-sensing layer over the display element, and an optical functional layer on the input-sensing layer, and including a first layer, which corresponds to the display area and the peripheral area, and a second layer on the first layer, and having a greater refractive index than the first layer, wherein the first layer defines a first valley portion defining first holes that is on the peripheral area, and that surrounds the second layer.

Abstract: A semiconductor packaging apparatus and methods of manufacturing semiconductor devices using the same. The semiconductor packaging apparatus includes a process unit, and a controller associated with the process unit. The process unit includes a bonding part that bonds a semiconductor substrate and a carrier substrate to each other to form a bonded substrate, a cooling part that cools the bonded substrate, and a detection part in the cooling part and configured to detect a defect of the bonded substrate. The controller is configured to control the process unit using data obtained from the detection part.

Abstract: A display apparatus includes: a first electrode; a bank layer defining a first opening which overlaps the first electrode in a plan view; an emission layer which overlaps the first electrode through the first opening; a second electrode on the emission layer; an encapsulation layer on the second electrode; a first insulating layer on the encapsulation layer, where the first insulating layer includes a first portion overlapping the first opening and defines a trench surrounding the first portion; a touch electrode on the first insulating layer; a second insulating layer on the touch electrode and defining a second opening which overlaps the first opening; and a third insulating layer on the second insulating layer.

Abstract: A semiconductor package includes; a first redistribution structure, a chip disposed on the first redistribution structure, and a package body disposed on the first redistribution structure and covering opposing side surfaces of the chip. The first redistribution structure includes; a vertically stacked plurality of redistribution layers, a respectively intervening plurality of passivation layers insulating the plurality of redistribution layers, and a plurality of redistribution vias penetrating the plurality of passivation layers to electrically connect redistribution layers among the plurality of redistribution layers, wherein each passivation layer among the plurality of passivation layers includes a diffusion barrier layer formed on a corresponding redistribution layer among the plurality of redistribution layers, and a warpage control layer formed on the diffusion barrier layer.

Abstract: An organic light emitting display device includes: a substrate; a first electrode on the substrate; a pixel defining layer on the substrate, the pixel defining layer defining a first opening which exposes at least a part of the first electrode; an organic light emitting layer on the first electrode; a second electrode on the organic light emitting layer; a thin film encapsulation layer on the second electrode; a sensing electrode on the thin film encapsulation layer; a low refractive index layer on the sensing electrode, the low refractive index layer defining a second opening which overlaps the first opening; and a high refractive index layer on the thin film encapsulation layer. A gap between an edge of the first opening and an edge of the second opening is constant irrespective of direction.

Abstract: Embodiments relate to a method for supporting X-ray image reading including receiving information associated with a reading target positioned in a reading space where X-rays pass through or are reflected off, acquiring a non X-RAY image of an item object based on the information associated with the reading target, and generating a fake X-RAY image of the item object by applying the non X-RAY image of the item object to the image transform model, and a system for performing the same.

Abstract: Disclosed are an X-RAY image reading support method including the steps of acquiring a target X-RAY image photographed by transmitting or reflecting X-RAY in a reading space in which an object to be read is disposed; applying the target X-RAY image to a reading model that extracts features from an input image; and identifying the object to be read as an object corresponding to a classified class when the object to be read is classified as a set class based on a first feature set extracted from the target X-RAY image, and an X-RAY image reading support system performing the method.

Abstract: Disclosed is a device and method for inferring a correlation between objects through image recognition. The device for inferring a correlation between objects through image recognition according to an embodiment comprises a communicator and an interaction inferencer configured to select a main object interacting with a target object at a predetermined distance in the input image or generate a social graph including the main object and the target object.

Abstract: A kiosk for providing a recommendation service according to an embodiment displays an orderer's past ordered product as a recommended product on the screen of the kiosk, the past ordered product read based on a similarity calculation result between a current input attribute representing a contextual feature of a current order status and a past input attribute stored in memory.

Abstract: A semiconductor memory device including a device isolation layer in a substrate to define first and second active portions, a first contact on the substrate, first and second memory cells spaced apart from the first contact in a first direction by first and second distances, respectively, first and second conductive lines connected to the first and second memory cells, respectively, and extending in a second direction, and first and second selection transistors respectively connected to the first and second conductive lines. A length of a bottom surface of a first gate electrode of the first selection transistor overlapping the first active portion in a third direction may be different from a length of a bottom surface of a second gate electrode of the second selection transistor overlapping the second active portion in the third direction.

Abstract: A method of manufacturing a semiconductor package includes preparing a core substrate having an upper surface and a lower surface, and including a cavity. A passive component is disposed in the cavity. A first insulating layer is formed on the upper surface of the core substrate and in the cavity and encapsulates the passive component. Through-vias are formed that penetrate the core substrate and the first insulating layer, and a first wiring layer is formed on the first insulating layer. The first wiring layer connects the through-vias and the passive component. A connection structure including an insulating member is formed on the first insulating layer and a redistribution layer is formed in the insulating member. The redistribution layer is connected to the first wiring layer. A semiconductor chip is disposed on an upper surface of the connection structure. The semiconductor chip has connection pads connected to the redistribution layer.