Abstract: Provided is a room management method. A room management method according to one aspect includes: receiving, by a central terminal, a service request of a room from a user terminal; analyzing, by the central terminal, the received service request to determine a manager terminal of a manager managing the room from which the service request has been received; and transmitting, by the central terminal, service request information to the determined manager terminal.

Abstract: A solder comprising a bismuth matrix, between about 5-24% copper; and about 0.5-36% tin or antimony or zinc; having a solidus temperature of ?271° C., a reflow temperature of ?375° C., and at least one intermetallic composition precipitate comprising copper and at least one of tin, antimony and zinc substantially excluding bismuth formed within the solidus phase.

Abstract: A method for forming a film on a conductive substrate, comprising immersing a substrate having a conductive portion in a solution comprising a metal ion ceramic precursor for the film and a peroxide; applying a voltage potential to the conductive portion with respect to a counter electrode in the solution, sufficient to protect the conductive portion from corrosion by the solution, and drive formation of a film on the substrate, controlling a pH of the solution while limiting a production of hydrogen by electrolysis of the solution proximate to the conductive portion; and maintaining the voltage potential for a sufficient duration to produce a film on the conductive portion. An electrode may be formed over the film to produce an electrical device. The film may be, for example, insulating, dielectric, resistive, semiconductive, magnetic, or ferromagnetic.

Abstract: A method for coating for a substrate, comprising applying an underlayer of a self assembling monolayer well ordered array of long chain molecules on the substrate; and applying a top layer, over the underlayer, wherein the self-assembling monolayer well ordered array serves as a molecular template organizing formation of said top layer, comprising at least one of a thermally-resistant polymer layer over said self assembling monolayer selected from the group consisting of epoxies, and phosphorus-based polyimides; and a metal oxide, metal nitride, or a ceramic. The self assembling monolayer may be selectively applied to a portion of the substrate, leaving an uncoated region, and the top layer formed only over the areas of the substrate coated with the self-assembling monolayer, resulting in at least one region of the substrate which is not coated with the top layer.

Abstract: A 3D image display includes a display panel operated in 2D and 3D driving modes and a barrier panel turned off in the 2D driving mode and turned on in the 3D driving mode to separate an image output from the display panel to left and right-eye images. The barrier panel includes a reference electrode, first barrier electrodes arranged in a first direction, second barrier electrodes alternately arranged with the first barrier electrodes along the first direction, and a liquid crystal layer interposed between the reference electrode and the first and second barrier electrodes. Each first barrier electrode includes first electrode pieces arranged in a zigzag fashion along a second direction different from the first direction, and each second barrier electrode includes second electrode pieces arranged in the zigzag fashion.

Abstract: A bi- or multi-layer coating is deposited upon a substrate using a low temperature process. The bi-layer is a lower layer of a SAM coating, which is overlaid with a hard coating. The hard coating can be made of materials such as: polymer, Si3N4, BN, TiN, Si02, Al203, Zr02, YSZ, and other ceramic materials, and the underlying, compliant, SAM coating can comprise substances containing long chain molecules that chemically bond to the substrate. This bi-layer provides both environmental and hermetical protection to electronic hardware and MEMS systems, without employing expensive packaging materials and processes. Multiple bi-layers may be combined to form multi-layer coatings. A protective polymer or other material may optionally be formed as an outside layer.

Abstract: Provided are nanoscale, mineralized structures from naturally-occurring materials and related methods for manufacturing these structures. The structures are useful in construction of photovoltaic devices and sensor applications.

Abstract: A method for forming a film on a conductive substrate, comprising immersing a substrate having a conductive portion in a solution comprising a metal ion ceramic precursor for the film and a peroxide; applying a voltage potential to the conductive portion with respect to a counter electrode in the solution, sufficient to protect the conductive portion from corrosion by the solution, and drive formation of a film on the substrate, controlling a pH of the solution while limiting a production of hydrogen by electrolysis of the solution proximate to the conductive portion; and maintaining the voltage potential for a sufficient duration to produce a film on the conductive portion. An electrode may be formed over the film to produce an electrical device. The film may be, for example, insulating, dielectric, resistive, semiconductive, magnetic, or ferromagnetic.

Abstract: A bi- or multi-layer coating is deposited upon a substrate using a low temperature process. The bi-layer is a lower layer of a SAM coating, which is overlaid with a hard coating. The hard coating can be made of materials such as: polymer, Si3N4, BN, TiN, SiO2, Al2O3, ZrO2, YSZ, and other ceramic materials, and the underlying, compliant, SAM coating can comprise substances containing long chain molecules that chemically bond to the substrate. This bi-layer provides both environmental and hermetical protection to electronic hardware and MEMS systems, without employing expensive packaging materials and processes. Multiple bi-layers may be combined to form multi-layer coatings. A protective polymer or other material may optionally be formed as an outside layer.