Abstract: A silicon carbide wafer manufacturing method includes: a bending measuring step of measuring a first edge having the greatest degree of a bending at one surface of a silicon carbide ingot having one surface; a cutting start step of starting a cutting at a second edge having a distance of r×a along an edge of the one surface from the first edge in a direction parallel to or with a predetermined off angle with respect to the one surface through the wire saw, a cutting speed being decreased to a first cutting speed in the cutting start step; a cutting proceeding step in which the first cutting speed is substantially constant within a variation of about ±5% of the first cutting speed; and a finish step in which the cutting speed is increased from the first cutting speed and the cutting of the silicon carbide ingot is completed.

Abstract: The present invention relates to a surface-treated copper foil, which has excellent adhesive strength with a resin substrate, shows low bending deformation after adhesion with a resin substrate, and is suitable as a high-frequency foil due to its low transmission loss, to a copper clad laminate comprising same, and to a printed wiring board.

Abstract: The present disclosure relates to a busbar unit for a motor, the busbar unit including: a first terminal; a second terminal provided to be spaced apart from the first terminal in a first direction; a third terminal stacked on the first terminal in a second direction perpendicular to the first direction; a fourth terminal stacked on the second terminal in the second direction; and a holder configured to support the first terminal, the second terminal, the third terminal, and the fourth terminal, thereby obtaining an advantageous effect of simplifying a structure and improving a degree of design freedom and spatial utilization.

Abstract: An antenna apparatus includes a patch antenna pattern; a first feed via to feed power to the patch antenna pattern in a non-contact manner on a first side of the patch antenna pattern; and a plurality of feed patterns disposed on the first side of the patch antenna pattern on different levels and overlapping each other, and including at least one feed pattern that is electrically connected to the first feed via, and each having a width greater than a width of the first feed via and a cross-sectional area smaller than a cross-sectional area of the patch antenna pattern.

Abstract: Provided are: a surface-treated copper foil including a surface-treated layer formed on at least one side of an untreated copper foil and an oxidation preventing layer formed on the surface-treated layer, wherein the surface-treated layer contains copper particles having an average particle diameter of about 10 nm to about 100 nm and has a 10-point average roughness, Rz, of about 0.2 ?m to about 0.5 ?m and a gloss (Gs 60°) of about 200 or more, and the oxidation preventing layer contains nickel (Ni) and phosphorus (P); a manufacturing method thereof; a copper foil laminate including the same; and a printed wiring board including the same.

Abstract: Disclosed herein are a surface-treated copper foil for a negative electrode current collector for secondary batteries, a method for producing the same, and a negative electrode for secondary batteries including the same. The surface-treated copper foil includes needle-shaped copper particles formed on at least one surface thereof, wherein the copper particles have an average major-axis length of about 0.6 ?m to about 2.0 ?m and are separated from one another by a distance of about 1 ?m to about 5 ?m.

Abstract: An antenna apparatus may include: a substrate; two feed vias disposed in the substrate; and an antenna pattern disposed on one surface of the substrate, and including a central portion and wing portions protruding from the central portion. A first wing portion and a second wing portion adjacent to the first wing portion, among the wing portions, may be disposed over the two feed vias. The antenna apparatus may be configured to selectively provide a feed signal to either one or both of the two feed vias.

Abstract: A motor torque control method for a motor-driven vehicle is carried out when a vehicle reduces its speed to a low speed or is in a stopped state, gear backlash and torsion of a drivetrain are minimized, and thus impact on the drivetrain which may occur during starting or restarting of a vehicle is minimized. The motor control method includes determining whether vehicle speed is in a speed reducing state less than a set vehicle speed or in a stopped state; determining a required torque command, an anti-jerk torque, and an additional drivetrain arrangement torque for removing drivetrain backlash based on vehicle operation state information when the speed reducing state or the stopped state is determined; and determining a motor torque command by using the required torque command, the anti-jerk torque, and the drivetrain arrangement torque.

Abstract: An antenna apparatus includes a patch antenna pattern; a first feed via to feed power to the patch antenna pattern in a non-contact manner on a first side of the patch antenna pattern; and a plurality of feed patterns disposed on the first side of the patch antenna pattern on different levels and overlapping each other, and including at least one feed pattern that is electrically connected to the first feed via, and each having a width greater than a width of the first feed via and a cross-sectional area smaller than a cross-sectional area of the patch antenna pattern.

Abstract: An antenna apparatus includes a patch antenna pattern; a first feed via to feed power to the patch antenna pattern in a non-contact manner on a first side of the patch antenna pattern; and a plurality of feed patterns disposed on the first side of the patch antenna pattern on different levels and overlapping each other, and including at least one feed pattern that is electrically connected to the first feed via, and each having a width greater than a width of the first feed via and a cross-sectional area smaller than a cross-sectional area of the patch antenna pattern.

Abstract: Provided are: a surface-treated copper foil including a surface-treated layer formed on at least one side of an untreated copper foil and an oxidation preventing layer formed on the surface-treated layer, wherein the surface-treated layer contains copper particles having an average particle diameter of about 10 nm to about 100 nm and has a 10-point average roughness, Rz, of about 0.2 ?m to about 0.5 ?m and a gloss (Gs 60°) of about 200 or more, and the oxidation preventing layer contains nickel (Ni) and phosphorus (P); a manufacturing method thereof; a copper foil laminate including the same; and a printed wiring board including the same.

Abstract: The present invention relates to an asymmetric artificial knee joint that includes a bearing member having a medial sulcus and a lateral sulcus, and a femoral component having a medial condyle and a lateral condyle and disposed on the bearing member.

Abstract: The present invention relates to an implant playing a role as a joint in coupling a revision implant in revision total knee arthroplasty and, more specifically, to an offset adapter unit comprising an adapter which couples a femoral member or a tibial member to a stem member in revision total knee arthroplasty; and a nut coupled to the adapter, thereby improving the strength by considering fracture occurring in the narrowest area.

Abstract: An antenna apparatus may include: a substrate; two feed vias disposed in the substrate; and an antenna pattern disposed on one surface of the substrate, and including a central portion and wing portions protruding from the central portion. A first wing portion and a second wing portion adjacent to the first wing portion, among the wing portions, may be disposed over the two feed vias. The antenna apparatus may be configured to selectively provide a feed signal to either one or both of the two feed vias.

Abstract: An antenna apparatus includes a patch antenna pattern; a first feed via to feed power to the patch antenna pattern in a non-contact manner on a first side of the patch antenna pattern; and a plurality of feed patterns disposed on the first side of the patch antenna pattern on different levels and overlapping each other, and including at least one feed pattern that is electrically connected to the first feed via, and each having a width greater than a width of the first feed via and a cross-sectional area smaller than a cross-sectional area of the patch antenna pattern.

Abstract: A motor torque control method for a motor-driven vehicle is carried out when a vehicle reduces its speed to a low speed or is in a stopped state, gear backlash and torsion of a drivetrain are minimized, and thus impact on the drivetrain which may occur during starting or restarting of a vehicle is minimized. The motor control method includes determining whether vehicle speed is in a speed reducing state less than a set vehicle speed or in a stopped state; determining a required torque command, an anti-jerk torque, and an additional drivetrain arrangement torque for removing drivetrain backlash based on vehicle operation state information when the speed reducing state or the stopped state is determined; and determining a motor torque command by using the required torque command, the anti-jerk torque, and the drivetrain arrangement torque.

Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.

Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.

Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.

Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.