Patents by Inventor Junichi Ishii

Junichi Ishii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210023673
    Abstract: A polishing head includes at least: an annular ceramic ring; a template attached to the ceramic ring and having a backing pad integrated with a guide ring; and a back plate joined to the ceramic ring to form a space together with the backing pad and the ceramic ring. The polishing head holds a back surface of a wafer on a lower surface portion of the backing pad and brings a front surface of the wafer into sliding contact with a polishing pad attached on a turntable for polishing the wafer. An incompressible fluid is enclosed in the space, and has a viscosity of 10 mPa·s or more and 1200 mPa·s or less. A polishing head and polishing method is capable of reducing backing pad deformation at a small gap between the template and wafer, and improving polishing uniformity at the wafer outermost peripheral portion.
    Type: Application
    Filed: February 27, 2019
    Publication date: January 28, 2021
    Applicant: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Junichi UENO, Kaoru ISHII
  • Patent number: 10850365
    Abstract: A polishing apparatus including: a turntable with an attached polishing pad; a polishing head that holds a wafer; a tank that stores a polishing agent; a polishing agent supply mechanism which supplies the stored polishing agent to the polishing pad; a waste liquid receiver which collects the polishing agent flowing from the turntable; and a circulation mechanism which is connected to the waste liquid receiver and supplies the collected polishing agent to the tank, the polishing agent is supplied to the polishing pad from the tank with the polishing agent supply mechanism, the used polishing agent which flows from the turntable is collected by the waste liquid receiver, a surface of the wafer held by the polishing head is rubbed against the pad to polish it while supplying the collected polishing agent to the tank to circulate the polishing agent, and the waste liquid receiver is fixed to the turntable and the waste liquid receiver having a bottom plate and a removable side plate.
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: December 1, 2020
    Assignees: SHIN-ETSU HANDOTAI CO., LTD., FUJIKOSHI MACHINERY CORP.
    Inventors: Michito Sato, Junichi Ueno, Kaoru Ishii, Yosuke Kanai, Yuya Nakanishi
  • Patent number: 10835932
    Abstract: It is an object to prevent adhesion of a processing liquid to a non-processing region of a substrate. In order to achieve the object, a substrate processing apparatus includes a substrate rotating mechanism, a discharging portion for discharging a processing liquid to a substrate, a moving portion for moving a discharging portion, and a controller. The discharging portion starts to discharge the processing liquid at a first position and is moved to a second position. The first position is a position of the discharging portion where a section of a passage of the discharging portion is projected onto a first region, and the second position is a position of the discharging portion where the section of the passage is projected onto a second region. The first region is a region on the peripheral edge side of the substrate from the second region.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: November 17, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Takayuki Nishida, Akio Hashizume, Junichi Ishii
  • Patent number: 10685856
    Abstract: While a substrate is being rotated, the lower surface of a brush is moved along the upper surface of the substrate. The brush and a spray nozzle are moved upward from a takeoff position to a lower non-contact position so as to separate the lower surface of the brush from the upper surface of the substrate. The spray nozzle generates the droplets in a state where the brush and the spray nozzle are located in the lower non-contact position so as to make the droplets collide with the upper surface of the substrate, and then the droplets colliding with the upper surface of the substrate are discharged from a gap between the lower surface of the brush and the upper surface of the substrate while the droplets are being supplied to the lower surface of the brush.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: June 16, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Ryohei Hokaku, Junichi Ishii, Takashi Shinohara
  • Publication number: 20200147841
    Abstract: A vehicle interior board which is thin, lightweight, has high strength, has less degradation, peeling and the like near an end portion of a metal plate, and has high quality and excellent productivity; and a method for manufacturing the same. The vehicle interior board includes a pair of metal plates and a foamed polyurethane layer formed between the pair of metal plates. A projecting ridge projecting outwardly and extending in a predetermined direction along the outer surface is formed on an outer surface of the metal plate. Thus, it is possible to obtain desired strength and rigidity even when the metal plates or the foamed polyurethane layer are thinned or when a lightweight aluminum plate or the like is adopted as the metal plates. Therefore, it is possible to reduce weight of a vehicle interior board.
    Type: Application
    Filed: August 3, 2017
    Publication date: May 14, 2020
    Applicant: MORIDEN Co., Ltd.
    Inventors: Junichi ISHII, Masahiro KONDOU, Takumi ONO, Yoshihisa TOKUTOMI
  • Publication number: 20200086378
    Abstract: A production method includes a forging step, a flash-trimming step, and a pressing step. In the forging step, a finish-forged product with flash is formed by an upper forging, die and a lower forging die. In the forging step, an excess portion is formed on at least one crankarm which is connected to a first or third pin, in a portion near the first or third pin, on an outer periphery of a lateral part near the upper forging die, such that the excess portion protrudes from the outer periphery. In the pressing step, the excess portion is pressed by an upper die such that the excess portion bulges toward a journal. This method allows production of a forged crankshaft with a reduced weight and a sufficient rigidity in a simple facility.
    Type: Application
    Filed: October 17, 2017
    Publication date: March 19, 2020
    Inventors: Kenji TAMURA, Junichi OKUBO, Kenji IMANISHI, Kunihiro YABUNO, Sam Soo HWANG, Sho TAKAMOTO, Tadanao ISHII, Koichiro ISHIHARA
  • Patent number: 10591907
    Abstract: A work management device includes an operator information memory section, a work item memory section, an operator detection sections, and a work instruction section. The operator detection sections are installed at a plurality of spots of the electronic component mounting line and detect the operators near the spots. In a case in which the operator detection section detects the operator, when operator information regarding the operator is identical to operator information in the operator information memory section and the work item group of the work item memory section includes one work item or a plurality of work items which are able to be performed by the operator detected by the operator detection section, the work instruction section instructs the operator detected by the operator detection section in one work item or a plurality of work items selected from the one work item or the plurality of work items.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: March 17, 2020
    Assignee: FUJI CORPORATION
    Inventors: Hitoshi Kobayashi, Junichi Kako, Yoshimitsu Ishii, Kazuki Iwata
  • Patent number: 10546763
    Abstract: In parallel with a lower-side scrub cleaning step where a brush is contacted with a lower surface inclined portion of a substrate, a center-side spray cleaning step is performed where a collision position of liquid droplets with respect to an upper surface of the substrate is moved between the center of the substrate and the middle of the substrate while the liquid droplets collide with the upper surface of the substrate. Thereafter, in parallel with an upper-side scrub cleaning step where the brush is contacted with an upper surface inclined portion of the substrate, an outer circumference-side spray cleaning step is performed where the collision position of the liquid droplets with respect to the upper surface of the substrate is moved between the middle of the substrate and the outer circumference of the substrate while the liquid droplets collide with the upper surface of the substrate.
    Type: Grant
    Filed: April 22, 2016
    Date of Patent: January 28, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Shotaro Tsuda, Junichi Ishii
  • Publication number: 20200023560
    Abstract: A vehicle interior board which has less deterioration and peeling near an end portion of a metal plate, has high quality, is thin, lightweight, and has high strength and excellent productivity. The vehicle interior board includes a pair of metal plates and a foamed polyurethane layer formed between the pair of metal plates. At the peripheral edge portion of the vehicle interior board, the foamed polyurethane layer covers peripheral end portions of the metal plates and is formed flush with outer surfaces of the metal plates. This makes it possible to suppress oxidation of the peripheral end portions which are cutting surfaces of the metal plates. Further, bonding is good between the metal plates and the foamed polyurethane layer. Further, it is possible to prevent peeling of the metal plates, chipping of the foamed polyurethane layer, and the like. Furthermore, it is easy to demold a vehicle interior board.
    Type: Application
    Filed: December 28, 2016
    Publication date: January 23, 2020
    Applicant: MORIDEN Co. , Ltd.
    Inventors: Junichi ISHII, Yoshitaka MAEHARA, Takumi ONO
  • Patent number: 10537972
    Abstract: A polishing method including rubbing a wafer held by holding means against a polishing pad attached to a turntable while cooling the turntable by supplying a refrigerant to a refrigerant flow path provided in the turntable which is driven to rotate by a motor, thereby performing polishing, the polishing method being characterized in that, during standby after end of the polishing of the wafer and before performing the polishing of a next wafer, a flow volume of the refrigerant is controlled to be less than a flow volume of the refrigerant during the polishing where the wafer is polished, the turntable is rotated by the motor, and a water retaining liquid having a temperature adjusted to a room temperature or more is supplied to the polishing pad.
    Type: Grant
    Filed: August 16, 2016
    Date of Patent: January 21, 2020
    Assignee: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Junichi Ueno, Michito Sato, Kaoru Ishii
  • Publication number: 20200020563
    Abstract: A substrate processing apparatus performs brush cleaning of a substrate. The substrate processing apparatus includes a spin base provided rotatably about a rotation axis, a spin base rotation mechanism that rotates the spin base, and a plurality of first chuck pins provided in the spin base, the first chuck pins being switchable between an opened state and a closed state and capable of clamping an end portion of the substrate from a side surface thereof in the closed state. An upper surface of each of the plurality of first chuck pins has a height the same as or lower than an upper surface of the substrate in the closed state where the end portion of the substrate is clamped.
    Type: Application
    Filed: February 20, 2018
    Publication date: January 16, 2020
    Inventors: Takayuki NISHIDA, Junichi ISHII
  • Patent number: 10532442
    Abstract: A polishing apparatus which is an index system polishing apparatus which includes a polishing head for holding a wafer, a plurality of turn tables to which polishing pads for polishing the wafer are attached, and a loading/unloading stage for loading the wafer to the polishing head or unloading the wafer from the polishing head, and which polishes the wafer while switching the turn tables to be used for polishing the wafer held at the polishing head by causing the polishing head to perform rotation movement, the polishing apparatus including a turn table upward and downward movement mechanism which allows the turn table to move upward and downward. With this polishing apparatus, it is possible to reduce an amount of displacement caused when moment load is applied on the polishing head during polishing.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: January 14, 2020
    Assignees: SHIN-ETSU HANDOTAI CO., LTD., FUJIKOSHI MACHINERY CORP.
    Inventors: Michito Sato, Junichi Ueno, Kaoru Ishii, Hiromi Kishida, Yuya Nakanishi, Ryosuke Yoda, Yosuke Kanai
  • Patent number: 10510471
    Abstract: A composition for bonded magnets according to the present invention contains from 88% by mass to 91% by mass (inclusive) of a samarium-iron-nitrogen magnet powder having an average particle diameter of from 1.8 ?m to 2.8 ?m (inclusive), from 0.5% by mass to 2.5% by mass (inclusive) of a polyamide elastomer having a tensile elongation at break of 400% or more and a bending modulus of elasticity of 100 MPa or more, from 0.5% by mass to 2.0% by mass (inclusive) of carbon fibers having fiber diameters of from 10 ?m to 12 ?m (inclusive) and from 0.3% by mass to 1.0% by mass (inclusive) of a carboxylic acid ester, with the balance made up of a polyamide resin which is composed of a polyamide 12 having a weight average molecular weight (Mw) of from 4,500 to 7,500 (inclusive) as determined by molecular weight distribution measurement.
    Type: Grant
    Filed: July 9, 2015
    Date of Patent: December 17, 2019
    Assignees: SUMITOMO METAL MINING CO., LTD., MABUCHI MOTOR CO., LTD.
    Inventors: Hideki Matsuda, Kenji Muraoka, Toshiya Iwai, Junichi Ishii, Atsushi Kawamoto, Naoki Kitahara, Isao Shibuya, Yasuhiro Yamagata
  • Publication number: 20190344966
    Abstract: To provide an instruction device and a sorting system capable of contributing to increase in working efficiency. An instruction device of a sorting system includes an illumination means device that illuminates light and an angle adjusting mechanism that moves the illumination means device. In addition, the instruction device includes a control means part that controls the illumination means device and the angle adjusting mechanism. The illumination means device formed of a spotlight draws a light path to a container as a next illumination position based on control by the control means part.
    Type: Application
    Filed: January 30, 2017
    Publication date: November 14, 2019
    Applicant: OKURA YUSOKI KABUSHIKI KAISHA
    Inventors: Hironori ISHII, Shuji TODOROKI, Junichi FUJIMOTO
  • Patent number: 10414017
    Abstract: A polishing apparatus includes: a plurality of polishing heads for holding a wafer, a polishing pad for polishing the wafer, a rotatable turn table having the polishing pad attached thereto, a turn table driving mechanism for rotating the turn table, a plurality of wafer-detecting sensors for detecting coming off of the wafer from the polishing head during polishing, wherein the polishing apparatus has the wafer-detecting sensor disposed above peripheral portions of the respective polishing heads and on each downstream side in a rotation direction of the turn table with respect to the respective polishing heads. The polishing apparatus can detect coming off of a wafer from a polishing head during polishing more rapidly, and can prevent a breakage of the wafer thereby.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: September 17, 2019
    Assignees: SHIN-ETSU HANDOTAI CO., LTD., FUJIKOSHI MACHINERY CORP.
    Inventors: Junichi Ueno, Michito Sato, Kaoru Ishii, Hiromi Kishida, Yosuke Kanai, Yuya Nakanishi
  • Publication number: 20190256733
    Abstract: Provided is a coating material composition that enables an efficient repair operation of a coating film after coating, a (meth)acrylic copolymer that is suitable for obtaining the coating material composition, and a coated article and a method for forming a multilayer coating film using the coating material composition. The (meth)acrylic copolymer includes: a constituent unit derived from a macromonomer (a); and a constituent unit derived from a vinyl monomer (b), a hydroxyl value of the (meth)acrylic copolymer is equal to or greater than 120 mgKOH/g and equal to or less than 260 mgKOH/g, and the content of a constituent unit that has a primary hydroxyl group of the (meth)acrylic copolymer is equal to or less than 30 parts by mass with respect to 100 parts by mass of the constituent unit derived from the macromonomer (a) and the constituent unit derived from the vinyl monomer (b).
    Type: Application
    Filed: May 2, 2019
    Publication date: August 22, 2019
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Takuhiro ISHII, Junichi NAKAMURA, Shinsuke HARAGUCHI
  • Patent number: 10335837
    Abstract: A technique for reducing the amount of particles adhering to a substrate with a simple structure is provided. A substrate processing apparatus is an apparatus for processing a substrate by ejecting a processing liquid from a nozzle. The substrate processing apparatus includes supply piping and an air-bubble capturing part. One end of the supply piping is connected via a first filter for removing particles to a tank of a processing-liquid supply part that supplies the processing liquid, and the other end of the supply piping is connected to the nozzle. The air-bubble capturing part is inserted at a position between the first filter and the nozzle in the supply piping, and captures air bubbles contained in the processing liquid. Pressure loss caused by the air-bubble capturing part is approximately equal to or smaller than pressure loss caused by the first filter.
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: July 2, 2019
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Junichi Ishii, Koichi Okamoto
  • Publication number: 20190186050
    Abstract: Provided are a composite molding composition such as a composite film and a composite fiber that have properties such as an improved tensile strength, strain and toughness as a result of blending a peptide or polyamino acid having a ?-sheet structure with a natural or artificially modified fibroin-derived protein; a method for producing such composite molding composition; and a method for improving the physical properties of a composite molding composition containing a fibroin-derived protein.
    Type: Application
    Filed: July 24, 2017
    Publication date: June 20, 2019
    Applicants: RIKEN, SPIBER INC.
    Inventors: Keiji NUMATA, Kousuke TSUCHIYA, Junichi SUGAHARA, Takaoki ISHII, Hongfang CHI
  • Publication number: 20190157117
    Abstract: In parallel with a lower-side scrub cleaning step where a brush is contacted with a lower surface inclined portion of a substrate, a center-side spray cleaning step is performed where a collision position of liquid droplets with respect to an upper surface of the substrate is moved between the center of the substrate and the middle of the substrate while the liquid droplets collide with the upper surface of the substrate. Thereafter, in parallel with an upper-side scrub cleaning step where the brush is contacted with an upper surface inclined portion of the substrate, an outer circumference-side spray cleaning step is performed where the collision position of the liquid droplets with respect to the upper surface of the substrate is moved between the middle of the substrate and the outer circumference of the substrate while the liquid droplets collide with the upper surface of the substrate.
    Type: Application
    Filed: April 22, 2016
    Publication date: May 23, 2019
    Inventors: Shotaro TSUDA, Junichi ISHII
  • Publication number: 20180261474
    Abstract: While a substrate is being rotated, the lower surface of a brush is moved along the upper surface of the substrate. The brush and a spray nozzle are moved upward from a takeoff position to a lower non-contact position so as to separate the lower surface of the brush from the upper surface of the substrate. The spray nozzle generates the droplets in a state where the brush and the spray nozzle are located in the lower non-contact position so as to make the droplets collide with the upper surface of the substrate, and then the droplets colliding with the upper surface of the substrate are discharged from a gap between the lower surface of the brush and the upper surface of the substrate while the droplets are being supplied to the lower surface of the brush.
    Type: Application
    Filed: January 10, 2018
    Publication date: September 13, 2018
    Inventors: Ryohei HOKAKU, Junichi ISHII, Takashi SHINOHARA