Abstract: This disclosure relates to a polishing method and a substrate treating apparatus. The polishing method includes a rotating step of rotating a substrate W in a horizontal posture, an etching step of supplying an etching solution to a back face of the substrate W to remove a film formed on the back face of the substrate W, and a polishing step of polishing the back face of the substrate W in a chemo-mechanical grinding manner by contacting a polisher 96 against the back face of the substrate W after the film on the back face of the substrate W is removed, the polisher 96 having a resin body where abrasive grains are distributed.

Abstract: This disclosure relates to a substrate treating method and a substrate treating system. The substrate treating method includes a rotating step of rotating a substrate in a horizontal posture by a holding rotator, a polishing step of performing polishing to a back face of the substrate in a chemo-mechanical grinding manner by contacting a polisher against the back face of the rotating substrate, the polisher having a resin body where abrasive grains are distributed, a heating step of heating the substrate while the polishing is performed, a resist coating step of coating a front face of the substrate, whose back face is subject to the polishing, with a resist, and an exposing step of exposing the resist with which the front face of the substrate is coated.

Abstract: A substrate treating apparatus includes an indexer robot configured to load and unload a substrate to and from a carrier, a polishing unit configured to polish a back face of the substrate while heating the substrate, and a substrate transporting robot configured to transport the substrate, fed from the indexer robot, to the polishing unit. The polishing unit includes a holding rotator configured to rotate the substrate while holding the substrate in a horizontal posture, a hot plate configured to heat the substrate, and a polisher configured to polish the back face of the substrate in a chemo-mechanical grinding manner by contacting against the back face of the substrate that is rotated while being heated.

Abstract: A substrate is held in a horizontal attitude by a substrate holder. At a processing position, a lower surface of the substrate held by the substrate holder is cleaned by a lower-surface brush. The lower-surface brush is cleaned by a brush cleaner at a waiting position that overlaps with the substrate held by the substrate holder in an up-and-down direction and is below a processing position. The lower-surface brush is lifted and lowered by a lower-surface brush lifting-lowering driver between the processing position and the waiting position.

Abstract: This disclosure relates to a polishing device, a substrate treating apparatus, and a polishing method. The polishing device includes a polishing unit 22. The polishing unit 22 includes a holding rotator 35 configured to rotate the substrate W while holding the substrate W in a horizontal posture, a hot plate 45 configured to heat the substrate W, and a polisher 96 having a resin body where abrasive grains are distributed and configured to polish a back face of the substrate W in a chemo-mechanical grinding manner by contacting against the back face of the substrate W that is rotated while being heated.

Abstract: A substrate cleaning device includes an upper holding device. The upper holding device holds a substrate in a horizontal attitude without rotating the substrate, while being in contact with an outer peripheral end of the substrate. A lower-surface brush wetted with a cleaning liquid is pressed against a lower-surface center region of the substrate held by the upper holding device. In this state, the lower-surface brush is rotated or moved with respect to the lower-surface center region of the substrate. Thus, the lower-surface center region of the substrate is cleaned.

Abstract: In a substrate treating apparatus, an indexer block, a polishing block, a coating block, and an interface block are arranged horizontally and linearly in this order. The coating block includes a coating unit PR-configured to coat a front face of a substrate with a resist. The polishing unit includes a polishing unit configured to polish a back face of the substrate. The polishing unit includes a holding rotator configured to rotate the substrate while holding the substrate in a horizontal posture, a heating member configured to heat the substrate, and a polisher having a resin body where abrasive grains are distributed and configured to polish the back face of the substrate in a chemo-mechanical grinding manner by contacting against the back face of the substrate that is rotated while being heated.

Abstract: The substrate processing system is provided with a first substrate holding unit which includes a first base that faces from below a substrate having a protected target surface and a cleaning target surface on the opposite side of the protected target surface and holds the substrate in a first posture in which the protected target surface is facing upward, a protective film coating nozzle which coats a protective film at least at a peripheral edge portion of the protected target surface of the substrate that is held by the first substrate holding unit, a first turning unit which turns around the substrate while in contact with a peripheral edge portion of the substrate so that the posture of the substrate can be changed from the first posture to a second posture in which the protected target surface is facing downward, a second substrate holding unit which includes a second base that faces the substrate from below and holds the substrate in the second posture, and a cleaning unit which cleans the cleaning targ

Abstract: A substrate cleaning device includes a substrate holder, a lower-surface brush, a first liquid nozzle and a second liquid nozzle. The substrate holder holds a substrate in a horizontal attitude. The lower-surface brush is configured to be movable between a processing position for cleaning of the substrate and a waiting position that overlaps with the substrate held by the substrate holder in an up-and-down direction. Further, the lower-surface brush is configured to be rotatable about an axis extending in the up-and-down direction. The lower-surface brush cleans a lower surface of the substrate by coming into contact with the lower surface of the substrate. The first liquid nozzle discharges a cleaning liquid to a center portion of the lower-surface brush, at a waiting position. The second liquid nozzle discharges a cleaning liquid to an end portion of the lower-surface brush, at the waiting position.

Abstract: A cleaner comes into contact with a lower-surface center region of a substrate held by a first holder, so that the lower-surface center region is cleaned. The cleaner comes into contact with a lower-surface outer region of the substrate rotated by a second holder, so that the lower-surface outer region of the substrate is cleaned. During cleaning of the lower-surface center region, the second holder is rotated about a vertical axis while not holding the substrate. Alternatively, during cleaning of the lower-surface center region, the gas injector arranged between the cleaner and the second holder injects gas toward the substrate from a first height spaced apart from the substrate by a predetermined distance. Further, during drying of the lower-surface center region, the gas injector injects gas toward the substrate from a second height closer to the substrate than the first height.

Abstract: A lower-surface center region of a substrate held by a first holder is cleaned by a cleaner. A lower-surface outer region of the substrate rotated by a second holder is cleaned by the cleaner. A mobile base provided with the second holder and the cleaner is moved in a horizontal plane such that a reference position of the first holder coincides with a center axis of the second holder in a plan view when the substrate is received and transferred between the first holder and the second holder, and is moved in the horizontal plane such that the cleaner overlaps with the lower-surface center region of the substrate held by the first holder and a center axis of the cleaner coincides with a first portion different from a center of the substrate in the plan view when the lower-surface center region is cleaned.

Abstract: An upper holding device holds a substrate in a horizontal attitude without rotating the substrate. A lower holding device rotates a substrate while holding the substrate by suction. A substrate held by the upper holding device is cleaned with use of a cleaning liquid, and a substrate held by the lower holding device is cleaned with use of a cleaning liquid. Gas in a processing space is exhausted by exhaust equipment of a factory through an exhaust system. When a substrate is held by the upper holding device, gas in the processing space is not exhausted or gas in the processing space is exhausted at a first flow rate. Gas in the processing space is exhausted at a second or third flow rate that is higher than the first flow rate when the substrate is held by the lower holding device.

Abstract: A substrate alignment device includes first and second support members that are arranged to be opposite to each other and be spaced apart from each other in a plan view, and respectively support an outer peripheral end of a substrate from a position below the substrate. Further, the substrate alignment device includes a first pressing member that is arranged to be opposite to the first support member in a plan view, and moves the substrate by pressing one portion of the outer peripheral end of the substrate in a first direction directed from the second support member toward the first support member with the substrate supported by the first and second support members. The first support member includes a movement limiter that limits movement of the substrate in the first direction past a predetermined prescribed position.

Abstract: A cleaner comes into contact with a lower-surface center region of a substrate held by a first holder, so that the lower-surface center region is cleaned. The cleaner comes into contact with a lower-surface outer region of the substrate rotated by a second holder, so that the lower-surface outer region of the substrate is cleaned. During cleaning of the lower-surface center region, the second holder is rotated about a vertical axis while not holding the substrate. Alternatively, during cleaning of the lower-surface center region, the gas injector arranged between the cleaner and the second holder injects gas toward the substrate from a first height spaced apart from the substrate by a predetermined distance. Further, during drying of the lower-surface center region, the gas injector injects gas toward the substrate from a second height closer to the substrate than the first height.

Abstract: A lower-surface center region of a substrate held by a first holder is cleaned by a cleaner. A lower-surface outer region of the substrate rotated by a second holder is cleaned by the cleaner. A mobile base provided with the second holder and the cleaner is moved in a horizontal plane such that a reference position of the first holder coincides with a center axis of the second holder in a plan view when the substrate is received and transferred between the first holder and the second holder, and is moved in the horizontal plane such that the cleaner overlaps with the lower-surface center region of the substrate held by the first holder and a center axis of the cleaner coincides with a first portion different from a center of the substrate in the plan view when the lower-surface center region is cleaned.

Abstract: A first cleaner cleans an upper surface of a substrate by scanning above the substrate to pass through a first point in an outer edge of the substrate in a plan view. A second cleaner cleans an outer peripheral end of the substrate by coming into contact with a second point in the outer edge of the substrate in a plan view. A virtual first straight line passing through the first point and the second point and a virtual second straight line passing through a center of the substrate and is parallel to the first straight line are defined. A third cleaner is arranged below the substrate and opposite to the first cleaner and the second cleaner with the second straight line located between the third cleaner, and the first cleaner and the second cleaner, and cleans a lower surface of the substrate.

Abstract: A substrate is held in a horizontal attitude by a substrate holder. At a processing position, a lower surface of the substrate held by the substrate holder is cleaned by a lower-surface brush. The lower-surface brush is cleaned by a brush cleaner at a waiting position that overlaps with the substrate held by the substrate holder in an up-and-down direction and is below a processing position. The lower-surface brush is lifted and lowered by a lower-surface brush lifting-lowering driver between the processing position and the waiting position.

Abstract: Provided is a polyimide having a repeating unit represented by the following Formula (1): wherein R1 represents a tetravalent group; R2 represents a divalent group; provided that at least one of R1's is represented by the following Formula (2); and among R2's, at least one group is represented by the following Formula (3), and at least one other group is represented by the following Formula (4):

Abstract: A vehicle interior board which is thin, lightweight, has high strength, has less degradation, peeling and the like near an end portion of a metal plate, and has high quality and excellent productivity; and a method for manufacturing the same. The vehicle interior board includes a pair of metal plates and a foamed polyurethane layer formed between the pair of metal plates. A projecting ridge projecting outwardly and extending in a predetermined direction along the outer surface is formed on an outer surface of the metal plate. Thus, it is possible to obtain desired strength and rigidity even when the metal plates or the foamed polyurethane layer are thinned or when a lightweight aluminum plate or the like is adopted as the metal plates. Therefore, it is possible to reduce weight of a vehicle interior board.

Abstract: The substrate processing system is provided with a first substrate holding unit which includes a first base that faces from below a substrate having a protected target surface and a cleaning target surface on the opposite side of the protected target surface and holds the substrate in a first posture in which the protected target surface is facing upward, a protective film coating nozzle which coats a protective film at least at a peripheral edge portion of the protected target surface of the substrate that is held by the first substrate holding unit, a first turning unit which turns around the substrate while in contact with a peripheral edge portion of the substrate so that the posture of the substrate can be changed from the first posture to a second posture in which the protected target surface is facing downward, a second substrate holding unit which includes a second base that faces the substrate from below and holds the substrate in the second posture, and a cleaning unit which cleans the cleaning targ