Patents by Inventor Junichi Kimura

Junichi Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7626353
    Abstract: When the mobile type information terminal is transferred between an operating state and a standby state, self diagnosis is performed. The fuel cell charges the secondary cells with a normal current of fixed value I1, and when the output voltage of the boost DC/DC converter (when PG=L), the charge current is reduced to the fixed value and aging is performed. After aging is performed for 60 seconds, charging is performed once again performed at the normal fixed value I1. This type of operation is repeated 30 times. During aging, when the output voltage from the boost DC/DC converter is reduced (when PG=L), aging is stopped and after 20 seconds aging is performed again, and this operation is done 10 times. The mobile type information terminal can perform self diagnosis and retrial of regeneration without the user being aware, in which secondary batteries and a fuel cell are loaded.
    Type: Grant
    Filed: October 19, 2005
    Date of Patent: December 1, 2009
    Assignee: Hitachi, Ltd.
    Inventors: Akihiko Kanouda, Mutsumi Kikuchi, Yasuaki Norimatsu, Junichi Kimura, Eisaku Fujita, Makoto Suzuki, Akira Ishii, Manabu Murakawa, Hideaki Koyama, Kazuaki Adachi
  • Patent number: 7532485
    Abstract: A multilayer module includes a parts-containing module whose circuit board has been mounted at one surface with an electronic component and the electronic component is covered with a resin layer. Connection terminals are provided either at the resin layer or at the other surface of the circuit board, and a through hole is provided for connection between the two surfaces of the module. Also included is a module, which is provided with connection terminals at a place corresponding to the connection terminal, and the through hole for connection between the connection terminals and electronic component. An insulation layer is disposed between conductor layers, the insulation layer having a conductive bond for connection between connection terminals, respectively. Locations of a through hole and an electronic component in the module are not restricted by a location of the through hole.
    Type: Grant
    Filed: May 18, 2006
    Date of Patent: May 12, 2009
    Assignee: Panasonic Corporation
    Inventors: Junichi Kimura, Kazuhiko Honjo, Eiji Kawamoto, Shinji Harada, Motoyoshi Kitagawa
  • Patent number: 7520616
    Abstract: A vehicular visual assistance system includes: a retro-reflective surface formed on an inside face of a pillar that is in a position obstructing the view of a vehicle driver seated on a driver's seat within a vehicle compartment; a camera mounted on the vehicle outside the vehicle compartment for taking an image outward from the pillar in a direction that is substantially the same as the line of vision of the vehicle driver on the driver's seat; and a projector for projecting in real time the image taken by the camera toward the retro-reflective surface of the pillar. The projector is fixedly disposed within the vehicle compartment at a position close to the eyes of the vehicle driver on the driver's seat. Thus, it is possible to eliminate a blind spot due to the pillar, thereby enhancing safety of driving.
    Type: Grant
    Filed: December 28, 2004
    Date of Patent: April 21, 2009
    Assignee: Kabushiki Kaisha Honda Lock
    Inventors: Yasuyuki Ooba, Junichi Kimura
  • Patent number: 7508760
    Abstract: A radio line is easily influenced in its nature by attenuation or reflection of an electromagnetic wave or the like and the surrounding environment. Due to this fact, a variation of the data transfer speed frequently occurs at the time of image streaming so as to become a hindrance to reproduction of an image at the receiving terminal. A distribution server is provided with a multiplexer for multiplexing information indicating the transmission start time for the image data and a switching unit for switching an image bit rate in response to a request from the receiving terminal. The receiving terminal uses information indicating a transmission start time for the image data, monitors the receiving bit rate and sends out a request for transmission of the most-suitable image bit rate in response to a comparison thereof.
    Type: Grant
    Filed: August 28, 2003
    Date of Patent: March 24, 2009
    Assignee: Hitachi, Ltd.
    Inventors: Yasuhiro Akiyama, Junichi Kimura, Toru Yokoyama
  • Publication number: 20090012939
    Abstract: A method of extracting a keyword in synchronism with a “scene” or “corner” in a TV program that changes in units of second in synchronism with the elapse of time of first content, and an information presentation apparatus to search and display a predetermined form of content, such as a web page, are provided. The information presentation apparatus comprises: an AV content output unit to output AV content (e.g., TV programs and movies); and a web page output unit to output, together with the AV content from the AV content output unit, a web page that corresponds to a keyword related to a scene included in the content being output from the AV content output unit without the user having to take trouble to choose a keyword, the web page output unit being adapted to, when the scene in the content changes, automatically update the web page to one corresponding to the changed scene.
    Type: Application
    Filed: June 25, 2008
    Publication date: January 8, 2009
    Inventors: Masahiro Kato, Junichi Kimura, Nobuhiro Sekimoto, Minako Toba
  • Publication number: 20080317125
    Abstract: A conventional coding method has a problem that for frame-by-frame reverse playback, data must be once decoded in a forward direction and thus a larger volume of data must be processed and a larger volume of memory is required. By recoding a forward predicted picture and a backward predicted picture for a frame in a bit stream, the bit stream can be played back reversely frame by frame easily. By the use of this method for multi-viewpoint video coding, a device that can play back pictures while varying the viewpoint in real time is realized.
    Type: Application
    Filed: August 11, 2004
    Publication date: December 25, 2008
    Inventors: Tomokazu Murakami, Junichi Kimura
  • Patent number: 7447332
    Abstract: It is desirable to distribute a most recently inputted image of merchandise in a shop without showing customers visiting a shop, or to distribute an image showing how crowded a shop is without infringing on the privacy of visitors to the ship. This is achieved by separating areas showing moving objects and areas showing no moving objects of an image and synthesizing an image showing stationary objects only by replacing the moving object area with the corresponding area of an earlier inputted image showing stationary objects only, or by processing the moving object area of an image, for example, by applying a mosaic to such an area, and synthesizing the synthesized image showing stationary objects only. The image in which the moving object area has been processed enables the distribution of an image showing how crowded a shop is without infringing on the privacy of visitors.
    Type: Grant
    Filed: January 19, 2005
    Date of Patent: November 4, 2008
    Assignee: Hitachi, Ltd.
    Inventors: Youichi Horii, Junichi Kimura, Shigeki Nagaya
  • Patent number: 7394029
    Abstract: A module includes a circuit board, a first terminal on a lower surface of the circuit board, a first electronic component on an upper surface of the circuit board, a first cover made of metal covering the first electronic component, a second electronic component on the lower surface of the circuit board, a terminal board provided under the lower surface of the circuit board, a second terminal on an upper surface of the terminal board, a third terminal provided on the lower surface of the terminal board, and a second cover made of metal covering the second electronic component. The second terminal faces the first terminal and is connected to the first terminal. The third terminal is connected to the second terminal. The terminal board has an opening therein surrounding the second electronic component. The second cover includes a top plate portion located under the second electronic component, and a side plate portion extending from the top plate portion toward the lower surface of the circuit board.
    Type: Grant
    Filed: August 28, 2006
    Date of Patent: July 1, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Junichi Kimura
  • Publication number: 20080093739
    Abstract: A semiconductor mounting substrate according to the present invention comprises: a substrate; a semiconductor device, mounted on this substrate; solder bumps, which connect the semiconductor device and the substrate; a first resin, filled in a space between the semiconductor device and the substrate; and electronic components, mounted on a face side of the semiconductor device where the semiconductor device is mounted, wherein bond strength reinforcing resin section is provided at least between a side face in the vicinity of a corner part of the semiconductor device and a substrate surface of the substrate in a position corresponding to the corner part.
    Type: Application
    Filed: October 17, 2007
    Publication date: April 24, 2008
    Inventors: Junichi KIMURA, Hideki Niimi, Yuji Fuwa, Tsuyoshi Sakaue
  • Publication number: 20080073024
    Abstract: A laminated circuit board has electronic components buried therein wherein the laminated circuit board may assure excellent reliability of electrical connections and high mechanical strength even with electronic components mounted in high density. It comprises a substrate on which a land disposed on one main surface thereof is connected and fixed by solder to integrated circuit or the like, and a sheet laminated on the upper surface of the substrate and also provided with a resin fluid filling portion formed by clearance at the outer periphery of integrated circuit or the like, wherein the sheet maintains its shape by woven or non-woven cloth having a hole in which integrated circuit or the like is buried, and the woven or non-woven cloth is impregnated with resin having heat fluidity and is thermally compressed. Thus, the electrical and mechanical connections between the laminated circuit board and electronic component can be enhanced in reliability.
    Type: Application
    Filed: November 20, 2007
    Publication date: March 27, 2008
    Inventors: Junichi Kimura, Toshihiro Nishii, Akio Ochi, Shinji Harada
  • Publication number: 20080056370
    Abstract: A method and apparatus for coding an image includes calculation of motion vectors of vertices of a patch in an image being encoded and transmitting information of horizontal and vertical components of the motion vectors of the vertices and information specifying that values of the horizontal and vertical components of a motion vector for each pixel in the patch are integral multiples of 1/d of a distance between adjacent pixels, where d is an integer not less than 2.
    Type: Application
    Filed: October 23, 2007
    Publication date: March 6, 2008
    Inventors: Yuichiro Nakaya, Junichi Kimura
  • Publication number: 20080049838
    Abstract: A method and apparatus for coding an image includes calculation of motion vectors of vertices of a patch in an image being encoded and transmitting information of horizontal and vertical components of the motion vectors of the vertices and information specifying that values of the horizontal and vertical components of a motion vector for each pixel in the patch are integral multiples of 1/d of a distance between adjacent pixels, where d is an integer not less than 2.
    Type: Application
    Filed: October 23, 2007
    Publication date: February 28, 2008
    Inventors: Yuichiro Nakaya, Junichi Kimura
  • Publication number: 20080049839
    Abstract: A method and apparatus for coding an image includes calculation of motion vectors of vertices of a patch in an image being encoded and transmitting information of horizontal and vertical components of the motion vectors of the vertices and information specifying that values of the horizontal and vertical components of a motion vector for each pixel in the patch are integral multiples of 1/d of a distance between adjacent pixels, where d is an integer not less than 2.
    Type: Application
    Filed: October 23, 2007
    Publication date: February 28, 2008
    Inventors: Yuichiro Nakaya, Junichi Kimura
  • Publication number: 20080049840
    Abstract: A method and apparatus for coding an image includes calculation of motion vectors of vertices of a patch in an image being encoded and transmitting information of horizontal and vertical components of the motion vectors of the vertices and information specifying that values of the horizontal and vertical components of a motion vector for each pixel in the patch are integral multiples of 1/d of a distance between adjacent pixels, where d is an integer not less than 2.
    Type: Application
    Filed: October 23, 2007
    Publication date: February 28, 2008
    Inventors: Yuichiro Nakaya, Junichi Kimura
  • Publication number: 20080017969
    Abstract: A method of manufacturing a module, formed of a semiconductor element flip-chip bonded to a substrate and chip component soldered to the substrate, is disclosed. The method includes a step of mounting the chip component and the semiconductor element to the substrate, a first injection step for injecting first resin from a center of a lateral face of the semiconductor element into a gap between the semiconductor element and the substrate, a second injection step for applying second resin having a greater viscosity than the first resin to corners of the semiconductor element before the first resin reaches the corners, and a curing step for heating the module. This method allows mounting the chip component closer to the semiconductor element, so that the component can be mounted at a higher density on the module.
    Type: Application
    Filed: July 16, 2007
    Publication date: January 24, 2008
    Inventors: Junichi Kimura, Yoshitsugu Uenishi, Masanori Sadano, Yoshihisa Maehata, Nobuhiro Tada
  • Patent number: 7317621
    Abstract: A laminated circuit board with electronic components buried therein comprises a substrate on which a land disposed on one main surface thereof is connected and fixed by solder to an integrated circuit (or the like). A sheet is laminated on the upper surface of the substrate. A filling portion by fluid resin is formed by clearance at the outer periphery of the integrated circuit (or the like). The sheet maintains its shape by woven or non-woven cloth having a hole in which the integrated circuit (or the like) is buried. The woven or non-woven cloth is impregnated with resin having heat fluidity and is thermally compressed. Thus, the electrical and mechanical connections between the laminated circuit board and electronic component can be enhanced in reliability.
    Type: Grant
    Filed: November 18, 2004
    Date of Patent: January 8, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Junichi Kimura, Toshihiro Nishii, Akio Ochi, Shinji Harada
  • Patent number: 7212570
    Abstract: A video converter for converting a coding format of a great deal of video contents has three kinds of conversion modes including a conversion mode for performing conversion in two steps in accordance with the kinds of input pictures so that a converting operation can be completed within a limit time set in advance.
    Type: Grant
    Filed: February 14, 2003
    Date of Patent: May 1, 2007
    Assignee: Hitachi, Ltd.
    Inventors: Yasuhiro Akiyama, Junichi Kimura, Muneaki Yamaguchi
  • Publication number: 20070049122
    Abstract: A module includes a circuit board, a first terminal on a lower surface of the circuit board, a first electronic component on an upper surface of the circuit board, a first cover made of metal covering the first electronic component, a second electronic component on the lower surface of the circuit board, a terminal board provided under the lower surface of the circuit board, a second terminal on an upper surface of the terminal board, a third terminal provided on the lower surface of the terminal board, and a second cover made of metal covering the second electronic component. The second terminal faces the first terminal and is connected to the first terminal. The third terminal is connected to the second terminal. The terminal board has an opening therein surrounding the second electronic component. The second cover includes a top plate portion located under the second electronic component, and a side plate portion extending from the top plate portion toward the lower surface of the circuit board.
    Type: Application
    Filed: August 28, 2006
    Publication date: March 1, 2007
    Inventor: Junichi Kimura
  • Patent number: 7183498
    Abstract: A high-frequency module has an attached shield case. Barrier 36 of the shield case has wall 37 provided by being bent from ceiling section 32; wall 38 that is opposed to wall 37 and that is provided by being bent from ceiling section 32; and linkage section 39 for linking the tip end of wall 38 to the tip end of wall 37. The shield case further has: a crossing section at which wall 37 crosses ceiling section 32 and side plate 33; notches 43 respectively provided at the crossing sections at which wall 38, ceiling section 32 and side plate 33 cross one another; and division section 44 extending downward from notches 43 for segmentalizing side plate 33. A boundary between circuit block 4 and circuit block 5 is provided at a position corresponding to barrier 36. Connection section 34 is connected to the ground of circuit block 4 or circuit block 5. As a result, a module having a superior shielding performance can be provided to prevent leakage of a signal from a circuit provided on the printed circuit board.
    Type: Grant
    Filed: October 4, 2005
    Date of Patent: February 27, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tomohide Ogura, Junichi Kimura, Noriharu Esaki, Tatuya Okamoto
  • Patent number: 7161241
    Abstract: A multi-layer board includes a ceramic layer and plural resin layers which are stacked together. The ceramic layer is provided with an impedance element formed thereon, and the uppermost resin layer is provided with an electronic component mounted thereon. The multi-layer board is stable against a temperature change.
    Type: Grant
    Filed: March 8, 2002
    Date of Patent: January 9, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Junichi Kimura