Patents by Inventor Junwon Lee

Junwon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12648159
    Abstract: A capacitor structure includes a lower electrode structure having a lower electrode on a substrate and an electrode structure including electrode patterns stacked on the lower electrode in a vertical direction substantially perpendicular to an upper surface of the substrate, a dielectric pattern contacting the lower electrode structure, and an upper electrode contacting the dielectric pattern.
    Type: Grant
    Filed: September 12, 2023
    Date of Patent: June 2, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyukwoo Kwon, Munjun Kim, Junwon Lee, Younseok Choi
  • Patent number: D1128621
    Type: Grant
    Filed: August 19, 2024
    Date of Patent: June 2, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungbin Im, Junwon Lee, Jun Kim, Saeyoon Huh, Jin-Hoo Lee, Seonkeun Park, Junghyuck Im, Jaewoong Chung
  • Patent number: D1128622
    Type: Grant
    Filed: August 19, 2024
    Date of Patent: June 2, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungbin Im, Junwon Lee, Jun Kim, Saeyoon Huh, Jin-Hoo Lee, Seonkeun Park, Junghyuck Im, Jaewoong Chung
  • Patent number: D1128623
    Type: Grant
    Filed: August 19, 2024
    Date of Patent: June 2, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungbin Im, Junwon Lee, Jun Kim, Saeyoon Huh, Jin-Hoo Lee, Seonkeun Park, Junghyuck Im, Jaewoong Chung
  • Patent number: D1128624
    Type: Grant
    Filed: August 19, 2024
    Date of Patent: June 2, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungbin Im, Junwon Lee, Jun Kim, Saeyoon Huh, Jin-Hoo Lee, Seonkeun Park, Junghyuck Im, Jaewoong Chung
  • Patent number: D1128625
    Type: Grant
    Filed: August 19, 2024
    Date of Patent: June 2, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungbin Im, Junwon Lee, Jun Kim, Saeyoon Huh, Jin-Hoo Lee, Seonkeun Park, Junghyuck Im, Jaewoong Chung
  • Patent number: D1128626
    Type: Grant
    Filed: August 19, 2024
    Date of Patent: June 2, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungbin Im, Junwon Lee, Jun Kim, Saeyoon Huh, Jin-Hoo Lee, Seonkeun Park, Junghyuck Im, Jaewoong Chung
  • Patent number: D1128627
    Type: Grant
    Filed: August 19, 2024
    Date of Patent: June 2, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungbin Im, Junwon Lee, Jun Kim, Saeyoon Huh, Jin-Hoo Lee, Seonkeun Park, Junghyuck Im, Jaewoong Chung
  • Patent number: D1128628
    Type: Grant
    Filed: August 19, 2024
    Date of Patent: June 2, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungbin Im, Junwon Lee, Jun Kim, Saeyoon Huh, Jin-Hoo Lee, Seonkeun Park, Junghyuck Im, Jaewoong Chung
  • Patent number: D1128629
    Type: Grant
    Filed: August 19, 2024
    Date of Patent: June 2, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungbin Im, Junwon Lee, Jun Kim, Saeyoon Huh, Jin-Hoo Lee, Seonkeun Park, Junghyuck Im, Jaewoong Chung
  • Patent number: D1128630
    Type: Grant
    Filed: August 19, 2024
    Date of Patent: June 2, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungbin Im, Junwon Lee, Jun Kim, Saeyoon Huh, Jin-Hoo Lee, Seonkeun Park, Junghyuck Im, Jaewoong Chung
  • Patent number: D1128631
    Type: Grant
    Filed: August 19, 2024
    Date of Patent: June 2, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungbin Im, Junwon Lee, Jun Kim, Saeyoon Huh, Jin-Hoo Lee, Seonkeun Park, Junghyuck Im, Jaewoong Chung
  • Patent number: D1128632
    Type: Grant
    Filed: August 19, 2024
    Date of Patent: June 2, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungbin Im, Junwon Lee, Jun Kim, Saeyoon Huh, Jin-Hoo Lee, Seonkeun Park, Junghyuck Im, Jaewoong Chung
  • Patent number: D1130350
    Type: Grant
    Filed: August 19, 2024
    Date of Patent: June 16, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungbin Im, Junwon Lee, Jun Kim, Saeyoon Huh, Jin-Hoo Lee, Seonkeun Park, Junghyuck Im, Jaewoong Chung
  • Patent number: D1130351
    Type: Grant
    Filed: August 19, 2024
    Date of Patent: June 16, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungbin Im, Junwon Lee, Jun Kim, Saeyoon Huh, Jin-Hoo Lee, Seonkeun Park, Junghyuck Im, Jaewoong Chung
  • Patent number: D1130352
    Type: Grant
    Filed: August 19, 2024
    Date of Patent: June 16, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungbin Im, Junwon Lee, Jun Kim, Saeyoon Huh, Jin-Hoo Lee, Seonkeun Park, Junghyuck Im, Jaewoong Chung
  • Patent number: D1130353
    Type: Grant
    Filed: August 19, 2024
    Date of Patent: June 16, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungbin Im, Junwon Lee, Jun Kim, Saeyoon Huh, Jin-Hoo Lee, Seonkeun Park, Junghyuck Im, Jaewoong Chung
  • Patent number: D1130354
    Type: Grant
    Filed: August 19, 2024
    Date of Patent: June 16, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungbin Im, Junwon Lee, Jun Kim, Saeyoon Huh, Jin-Hoo Lee, Seonkeun Park, Junghyuck Im, Jaewoong Chung
  • Patent number: D1131431
    Type: Grant
    Filed: August 19, 2024
    Date of Patent: June 23, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungbin Im, Junwon Lee, Jun Kim, Saeyoon Huh, Jin-Hoo Lee, Seonkeun Park, Junghyuck Im, Jaewoong Chung
  • Patent number: D1132899
    Type: Grant
    Filed: January 5, 2026
    Date of Patent: July 7, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dahyun Lee, Jinhoo Lee, Namsu Kim, Junwon Lee, Miri Lee, Jieun Myung, Jiyun Lim