Patents by Inventor Kai Shen
Kai Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240154065Abstract: An optoelectronic device includes a first semiconductor layer, a second semiconductor layer and an active layer between the first semiconductor layer and the second semiconductor layer; a first insulating layer on the second semiconductor layer and including a plurality of first openings exposing the first semiconductor layer, wherein the first openings include a first group and a second group; a third electrode on the first insulating layer and including a first extended portion and a second extended portion, wherein the first extended portion and the second extended portion are respectively electrically connected to the first semiconductor layer through the first group of the first openings and the second group of the first openings, and wherein the number of the first group of the first openings is different from the number of the second group of the first openings; and a plurality of fourth electrodes on the second insulating layer and electrically connected to the second semiconductor layer, wherein in aType: ApplicationFiled: January 11, 2024Publication date: May 9, 2024Inventors: Chao-Hsing CHEN, Jia-Kuen WANG, Chien-Chih LIAO, Tzu-Yao TSENG, Tsun-Kai KO, Chien-Fu SHEN
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Patent number: 11980072Abstract: A display device, including a flexible substrate, multiple lighting units, and multiple signal lines, is provided. The lighting units and the signal lines are located on the flexible substrate, and the signal lines are respectively electrically connected to the lighting units. Each signal line includes multiple first conductive patterns, at least one second conductive pattern, and at least one third conductive pattern. The first conductive patterns are located on the flexible substrate. The second conductive pattern is located on the first conductive patterns, and two ends of each second conductive pattern are respectively connected to two first conductive patterns. In a stretched state, the two first conductive patterns twist the commonly connected second conductive pattern. The third conductive pattern is superimposed on the second conductive pattern.Type: GrantFiled: October 29, 2021Date of Patent: May 7, 2024Assignee: Au Optronics CorporationInventors: Zih-Shuo Huang, Tsung-Ying Ke, Shang-Kai Shen
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Patent number: 11972106Abstract: The present disclosure relates to split screen methods and apparatuses. One example method includes displaying a first interface of a first application on a display, where the first interface includes a first control. A first operation input by a user is detected. Prompt information is displayed in response to the detected first operation, where the prompt information is used to prompt that the first control supports split screen. A second operation input by the user on the first control is detected. A second interface is displayed in response to the detected second operation, where the second interface includes a first window and a second window. A third interface corresponding to the first interface is displayed in the first window, and a second control corresponding to the first control is displayed in the second window.Type: GrantFiled: August 9, 2021Date of Patent: April 30, 2024Assignee: Huawei Technologies Co., Ltd.Inventors: Meng Deng, Jianxun Shen, Kai Li, Kuiquan Sun
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Publication number: 20240113200Abstract: An integrated circuit apparatus includes a substrate and a well contact that is disposed on the substrate. The well contact includes first and second source/drain structures that are disposed on the substrate; a metal vertical portion that contacts the substrate immediately between the first and second source/drain structures; inner spacers that electrically insulate the vertical portion from the adjacent source/drain structures; bottom dielectric isolation that electrically insulates the source/drain structures from the substrate; and a well portion that is embedded into the substrate in registry with the vertical portion. The well portion is doped differently than the substrate.Type: ApplicationFiled: October 4, 2022Publication date: April 4, 2024Inventors: HUIMEI ZHOU, MIAOMIAO WANG, Julien Frougier, Andrew M. Greene, Barry Paul Linder, Kai Zhao, Ruilong Xie, Tian Shen, Veeraraghavan S. Basker
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Publication number: 20240112165Abstract: A rotatable connection assembly for a payment module is disclosed herein. The connection comprising a module sled having a module sled connection; a mobile computer mount having a mobile computer connection; a cable between the module sled connection and the mobile computer connection; a rotatable connection assembly disposed between the module sled and the mobile computer mount such that the module sled rotates with respect to the mobile computer mount between a first position and a second position.Type: ApplicationFiled: September 29, 2022Publication date: April 4, 2024Inventors: Mu-Kai Shen, Chieh Kai Wang, Thomas J. Britts, Kenneth W. Taylor, Robert Peri
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Publication number: 20240088497Abstract: A battery for a mobile device includes: a battery housing including an inner wall, an opposing outer wall, a rear wall, and an opposing forward wall, the rear and forward walls each joining the inner and outer walls; an electrical contact disposed on the inner wall, configured to engage with an electrical interface within a device housing; a seal on the inner wall surrounding the electrical contact and a further portion of the inner wall, and configured to engage a complementary surface within the device housing; a hook extending from the forward wall, configured to engage the device housing to establish a pivot axis of the battery housing during battery insertion and removal; and a latch extending from the rear wall, biased towards an extended position to secure the battery within the device housing, and movable to a retracted position to release the battery from the device housing.Type: ApplicationFiled: November 20, 2023Publication date: March 14, 2024Inventors: Andrew Ellis, Xinghua Shi, Mu-Kai Shen
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Publication number: 20240088354Abstract: A battery electrode includes a first metal foil, a second metal foil, and a thermoplastic polymer layer between the first metal foil and the second metal foil. The battery electrode also includes a first coating adjacent to the first metal foil such that the first metal foil is between the thermoplastic polymer layer and the first coating. The battery electrode also includes a second coating adjacent to the second metal foil such that the second metal foil is between the thermoplastic polymer layer and the second coating.Type: ApplicationFiled: September 9, 2022Publication date: March 14, 2024Inventors: Xiaoyun Yang, Aaron Smith, Wanjie Zhang, Siva Ram Kumar Muthukumar, Kai Yu, Enbang Wang, Yafeng Chen, Rohit Bedida, Xiaoyu Shen, Xingxing Zhang
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Patent number: 11921971Abstract: A live broadcasting recording equipment, a live broadcasting recording system and a live broadcasting recording method are provided. The live broadcasting recording equipment includes a camera, a processing device, and a terminal device. The camera captures images to provide photographic data. The processing device executes background removal processing on the photographic data to generate a person image. The terminal device communicates with the processing device and has a display. The processing device executes multi-layer processing to fuse the person image, a three-dimensional virtual reality background image, an augmented reality object image, and a presentation image, and generate a composite image. After an application gateway of the processing device recognizes a login operation of the terminal device, the processing device outputs the composite image to the terminal device, so that the display of the terminal device displays the composite image.Type: GrantFiled: April 11, 2022Date of Patent: March 5, 2024Assignee: Optoma China Co., LtdInventors: Kai-Ming Guo, Tian-Shen Wang, Zi-Xiang Xiao, Yi-Wei Lee
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Publication number: 20240073981Abstract: The present disclosure provides a control method applied to a first electronic device and a second electronic device in a physical environment. The first electronic device and the second electronic device are configured to communicate with each other through a first wireless connection established between the first electronic device and the second electronic device. The control method includes: by at least one of the first electronic device and the second electronic device, determining whether to update a map of the physical environment; and in response to a determination to update the map of the physical environment, establishing a second wireless connection different from the first wireless connection between the first electronic device and the second electronic device, wherein the second wireless connection is configured to transmit a map updated data, and the map updated data is configured to update the map of the physical environment.Type: ApplicationFiled: August 26, 2022Publication date: February 29, 2024Inventors: Kai-Hsiu CHEN, WeiChih KUO, Wei-Shen OU
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Patent number: 11887012Abstract: A computing device identifies an anomaly among a plurality of observation vectors. An observation vector is projected using a predefined orthogonal complement matrix. The predefined orthogonal complement matrix is determined from a decomposition of a low-rank matrix. The low-rank matrix is computed using a robust principal component analysis algorithm. The projected observation vector is multiplied by a predefined demixing matrix to define a demixed observation vector. The predefined demixing matrix is computed using an independent component analysis algorithm and the predefined orthogonal complement matrix. A detection statistic value is computed from the defined, demixed observation vector. When the computed detection statistic value is greater than or equal to a predefined anomaly threshold value, an indicator is output that the observation vector is an anomaly.Type: GrantFiled: July 19, 2023Date of Patent: January 30, 2024Assignee: SAS Institute Inc.Inventors: Sudipta Kolay, Steven Guanxing Xu, Kai Shen, Zohreh Asgharzadeh Talebi
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Patent number: 11881690Abstract: Provided is an insulating coating device for an electric wire, including a pressing pipe. The pressing pipe includes two first pressing parts which are configured to divide the pressing pipe into two parts along a longitudinal cross section of the pressing pipe, an inner wall of the pressing pipe is provided with an air bag, and the air bag is provided with an air pipe joint which penetrates to an outside of the pressing pipe. In the insulating coating device for the electric wire, a self-curing insulating material is coated on joints of the electric wires, the air bag is used to squeeze the self-curing insulating material such that the self-curing insulating material is shaped and compacted, so that cavities generated in a coating process is reduced, and the self-curing insulating material is uniformly attached to the joints of the electric wires.Type: GrantFiled: January 8, 2021Date of Patent: January 23, 2024Assignee: STATE GRID HUZHOU POWER SUPPLY COMPANYInventors: Zhen Chen, Jing Xu, Wenhui Xu, Weixun Qin, Yongsheng Xu, Zhen Wang, Liupei Wei, Feng Zhou, Xinlong Wu, Xiaobin Shen, Jie Chai, Meng Tang, Kai Shen
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Patent number: 11851318Abstract: A microelectromechanical system device includes a substrate, a dielectric layer, an electrode, a surface modification layer and a membrane. The dielectric layer is formed on the substrate, and is formed with a cavity that is defined by a cavity-defining wall. The electrode is formed in the dielectric layer. The surface modification layer covers the cavity-defining wall, and has a plurality of hydrophobic end groups. The membrane is connected to the dielectric layer, and seals the cavity. The membrane is movable toward or away from the electrode. A method for making a microelectromechanical system device is also provided.Type: GrantFiled: April 22, 2021Date of Patent: December 26, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yi-Chuan Teng, Ching-Kai Shen, Jung-Kuo Tu, Wei-Cheng Shen, Xin-Hua Huang, Wei-Chu Lin
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Publication number: 20230399226Abstract: The present disclosure relates to an integrated chip including a semiconductor device substrate and a plurality of semiconductor devices arranged along the semiconductor device substrate. A micro-electromechanical system (MEMS) layer overlies the semiconductor device substrate. The MEMS layer includes a first moveable mass and a second moveable mass. A capping layer overlies the MEMS layer. The capping layer has a first lower surface directly over the first moveable mass and a second lower surface directly over the second moveable mass. An outgas layer is on the first lower surface and directly between the first pair of sidewalls. A lower surface of the outgas layer delimits a first cavity in which the first moveable mass is arranged. The second lower surface of the capping layer delimits a second cavity in which the second moveable mass is arranged.Type: ApplicationFiled: June 8, 2022Publication date: December 14, 2023Inventors: Fan Hu, Wen-Chuan Tai, Li-Chun Peng, Hsiang-Fu Chen, Ching-Kai Shen, Hung-Wei Liang, Jung-Kuo Tu
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Publication number: 20230382719Abstract: The present disclosure provides a method for fabricating a semiconductor structure, including bonding a capping substrate over a sensing substrate, forming a through hole traversing the capping substrate, forming a dielectric layer over the capping substrate under a first vacuum level, and forming a metal layer over the dielectric layer under a second vacuum level, wherein the second vacuum level is higher than the first vacuum level.Type: ApplicationFiled: July 27, 2023Publication date: November 30, 2023Inventors: CHING-KAI SHEN, YI-CHUAN TENG, WEI-CHU LIN, HUNG-WEI LIANG, JUNG-KUO TU
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Publication number: 20230382718Abstract: A method for manufacturing a semiconductor structure is provided. The method includes the operations as follows. A first substrate having a top surface is received. A semiconductor layer is formed over the first substrate. A cavity is formed at the top surface of the semiconductor layer. A second substrate is bonded over the first substrate to cover the semiconductor layer. The second substrate has a through hole connected to the cavity of the semiconductor layer. A eutectic sealing structure is formed on the second substrate to cover the through hole. The eutectic sealing structure includes a first metal layer and a second metal layer eutectically bonded on the first metal layer.Type: ApplicationFiled: July 27, 2023Publication date: November 30, 2023Inventors: YI-CHUAN TENG, CHING-KAI SHEN, JUNG-KUO TU
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Patent number: 11822204Abstract: An electronic paper package structure, including a substrate, an electronic ink layer, a cover plate, a water vapor barrier film and an adhesive layer, is provided. The electronic ink layer is disposed on the substrate. The cover plate covers the electronic ink layer. The water vapor barrier film covers the substrate and the electronic ink layer. The adhesive layer is directly bonded between the cover plate and the water vapor barrier film to seal the substrate and the electronic ink layer. The adhesive layer is not bonded between the cover plate and the electronic ink layer.Type: GrantFiled: March 9, 2021Date of Patent: November 21, 2023Assignee: E INK HOLDINGS INC.Inventors: Jen-Shiun Huang, Huang-Kai Shen, Ko-Fan Tu
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Patent number: 11824215Abstract: A battery for a mobile device includes: a battery housing including an inner wall, an opposing outer wall, a rear wall, and an opposing forward wall, the rear and forward walls each joining the inner and outer walls; an electrical contact disposed on the inner wall, configured to engage with an electrical interface within a device housing; a seal on the inner wall surrounding the electrical contact and a further portion of the inner wall, and configured to engage a complementary surface within the device housing; a hook extending from the forward wall, configured to engage the device housing to establish a pivot axis of the battery housing during battery insertion and removal; and a latch extending from the rear wall, biased towards an extended position to secure the battery within the device housing, and movable to a retracted position to release the battery from the device housing.Type: GrantFiled: September 14, 2020Date of Patent: November 21, 2023Assignee: Zebra Technologies CorporationInventors: Andrew Ellis, Xinghua Shi, Mu-Kai Shen
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Patent number: 11807520Abstract: A semiconductor structure is provided. The semiconductor structure includes a first substrate, a semiconductor layer, a second substrate, and a eutectic sealing structure. The semiconductor layer is over the first substrate. The semiconductor layer has a cavity at least partially through the semiconductor layer. The second substrate is over the semiconductor layer. The second substrate has a through hole. The eutectic sealing structure is on the second substrate and covers the through hole. The eutectic sealing structure comprises a first metal layer and a second metal layer eutectically bonded on the first metal layer. A method for manufacturing a semiconductor structure is also provided.Type: GrantFiled: June 23, 2021Date of Patent: November 7, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Yi-Chuan Teng, Ching-Kai Shen, Jung-Kuo Tu
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Patent number: D1012935Type: GrantFiled: January 19, 2022Date of Patent: January 30, 2024Assignee: Zebra Technologies CorporationInventors: Mu-Kai Shen, Huang Chih Huang, Chandra M. Nair, Mark Thomas Fountain
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Patent number: D1026247Type: GrantFiled: March 28, 2023Date of Patent: May 7, 2024Assignee: ZHEJINAG DOUXBEBE TECHNOLOGIES CO., LTDInventors: Zhuo Shen, Zhenhai Hu, Kai Xu