Abstract: A method of limiting a drive signal is provided. The method includes providing a drive signal for a meter assembly, wherein the meter assembly has a resonance frequency. The method also includes interrupting the drive signal after a first drive time-period, wherein the first drive time-period is based on an expected time for the drive signal to reach the resonance frequency.

Abstract: A system comprising a computer-readable storage medium storing at least one program and a method for determining, tracking, and anticipating risk in a manufacturing facility are presented. In example embodiments, the method includes generating a risk data model for the manufacturing facility based on correlations between historical staffing conditions of the manufacturing facility and deviations from existing manufacturing procedures. The method further includes receiving projected operational data that includes information related to anticipated future staffing conditions of the manufacturing facility. The method further includes calculating a risk score based on the projected operational data using the risk data model. The method further includes causing presentation of a user interface that includes a display of the risk score.

Abstract: A mobile device with edge activation is provided. The mobile device comprises: a housing; a data capture component; an actuator disposed on a side of the housing and configured to activate the data capture component when actuated; a display, disposed within the housing; a touch screen disposed on the display; a tactile indicator at the housing between the actuator and the touch screen; and, an activation area of the touch screen, adjacent the tactile indicator, the activation area configured to initiate a digital location for activating the data capture component when touch input is received at the activation area.

Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.

Abstract: A mobile computing device includes: a device housing including a base, a perimeter wall extending from the base to a perimeter upper edge and having a forward section and a rear section, and a display seat within the forward section of the perimeter wall; a display module including a display assembly supported adjacent to the perimeter upper edge by the display seat, and a display module cover overlaid on the display panel; an external frame member including: (i) a U-shaped wall removably affixed to the forward section of the perimeter wall and terminating at the rear section of the perimeter wall; and (ii) a retaining bezel extending from the U-shaped wall over the perimeter upper edge.

Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. In some embodiments, a ventilation trench and an isolation trench are concurrently within a capping substrate. The isolation trench isolates a silicon region and has a height substantially equal to a height of the ventilation trench. A sealing structure is formed within the ventilation trench and the isolation trench, the sealing structure filing the isolation trench and defining a vent within the ventilation trench. A device substrate is provided and bonded to the capping substrate at a first gas pressure and hermetically sealing a first cavity associated with a first MEMS device and a second cavity associated with a second MEMS device. The capping substrate is thinned to open the vent to adjust a gas pressure of the second cavity.

Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.

Abstract: A method for temperature compensation of a signal in a vibratory meter is provided. The method includes obtaining one or more signals from a meter assembly in the vibratory meter, providing the one or more signals to a meter electronics of the vibratory meter, and compensating the one or more signals with a signal parameter offset, wherein the signal parameter offset is based on a temperature of the meter electronics.

Abstract: A voiceprint certification method is provided. The method is applicable to an electronic device which records a plurality pieces of user information and a plurality of voiceprints of a plurality of verification words corresponding to each piece of user information. The method includes: receiving first user information among the plurality pieces of user information; selecting at least one first verification word from the verification words corresponding to the first user information and generating a random verification sentence including the at least one first verification word, to prompt a user to read the random verification sentence; and certifying the user by comparing a user input sentence with the random verification sentence and by determining whether a voiceprint corresponding to the first verification word in the user input sentence matches the voiceprint of the first verification word corresponding to the first user information recorded in the electronic device.

Abstract: A method of communicating with two or more hosts is provided. The method includes transmitting a first communication between a first host and a meter electronics and transmitting a second communication between a second host and the meter electronics.

Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.

Abstract: A substrate wafer composed of a hexagonal single crystal material including a C crystalline plane, an A crystalline plane, and an M-axis direction includes a top surface is a C-axis plane; a first side connecting to the aforementioned top surface and being substantially a curve line viewing from the direction perpendicular to the aforementioned C crystalline plane and including a curvature center; and a second side connecting to the aforementioned first side; and wherein there is a line segment defined by a shortest distance between the aforementioned second side and the aforementioned curvature center, and the aforementioned line segment is not parallel with the aforementioned M-axis direction.

Abstract: The present disclosure provides a semiconductor device, which includes a first substrate comprising an upper surface and a second substrate disposed over the first substrate. The semiconductor device also includes a first electrode disposed in the second substrate and configured to move in a direction substantially parallel to the upper surface in response to a pressure difference, and a second electrode disposed in the second substrate. The second electrode is configured to provide a capacitance in conjunction with the first electrode.

Abstract: A wire grid polarizer and a display panel using the same are provided. The wire grid polarizer includes a substrate, a plurality of wire grids, a plurality of patterned light absorbing layers, and a surface covering layer. The plurality of wire grids are disposed on the substrate, wherein there are a plurality of gaps between every two wire grids. The plurality of patterned light absorbing layers are disposed corresponding to and overlapping the wire grids respectively, wherein every two of the patterned light absorbing layers have one of the gaps. The surface covering layer is disposed on the patterned light absorbing layers and directly contacts the patterned light absorbing layers.

Abstract: An imprint mold and a method for manufacturing the same are provided. The imprint mold includes a plurality of substantially identical or different mold patterns, wherein there isn't any height difference between the mold patterns.

Abstract: A method of limiting a drive signal is provided. The method includes providing a drive signal for a meter assembly, wherein the meter assembly has a resonance frequency. The method also includes interrupting the drive signal after a first drive time-period, wherein the first drive time-period is based on an expected time for the drive signal to reach the resonance frequency.

Abstract: A method of limiting a current drawn by two or more meter assemblies (10a,10b) is provided. The method includes driving a first meter assembly (10a) with a first drive signal, comparing one or more operating parameters of the first meter assembly (10a) to an operating threshold, and driving a second meter assembly (10b) with a second drive signal based on the comparison to prevent a current drawn by the first meter assembly 10a) and the second meter assembly (10b) from exceeding a current threshold.

Abstract: A meter electronics (100) for two or more meter assemblies (10a, 10b). The meter electronics (100) includes a processor (110) and one or more signal processors (120) communicatively coupled to the processor (110). The one or more signal processors (120) are configured to communicatively couple to a first meter assembly (10a) and a second meter assembly (10b). Accordingly, only one meter electronics can be employed to control the two or more meter assemblies, which may reduce the costs associated with employing two meter electronics.