Patents by Inventor Kai Wen

Kai Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8890326
    Abstract: A chip assembly includes a PCB, a connecting pad fixed on the PCB, and a chip. The connecting pad defines a through hole. The chip is received in the through hole and fixed on the PCB by an adhesive distributed in the through hole. A thickness of the adhesive is less than that of the connecting pad.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: November 18, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu
  • Patent number: 8887385
    Abstract: A circuit board assembly includes a circuit board, at least one pad formed on the circuit board, and at least one connection line. Each of the at least one connection line includes a connection end connected to a respective one of the at least one pad and has the same resistance value as the respective pad.
    Type: Grant
    Filed: June 27, 2012
    Date of Patent: November 18, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu
  • Publication number: 20140336542
    Abstract: A limb rehabilitation and training system includes a horizontal position adjuster movably mounted at a bottom side of a base, an expansion rotary member mounted at the horizontal position adjuster, a shoulder joint traction mechanism linked to the expansion rotary member through a first arm segment robotic arm and a height adjuster, and an upper-limb rehabilitation device linked to the shoulder joint traction mechanism. The upper-limb rehabilitation device is able to rapidly be adjusted to fit the left arm or right arm through the horizontal position adjuster, the expansion rotary member, the first arm segment robotic arm and a shoulder positioning-lifting rotary member and. Further, by means of the shoulder joint traction mechanism, the user's stiffened shoulder joint can be timely moved for a separation distance, achieving the function of loosening the joint and facilitating performance of successive rehabilitation treatment or training.
    Type: Application
    Filed: November 18, 2013
    Publication date: November 13, 2014
    Applicant: NATIONAL TAIWAN UNIVERSITY
    Inventors: LI-CHEN FU, KAI-WEN LEE, YI-WEN LIAO, WEI-WEN WANG, JIN-SHIN LAI
  • Publication number: 20140321815
    Abstract: A circuit board includes a first circuit substrate configured for mounting a driving chip and a second circuit substrate positioned on and electrical connected to the first circuit substrate. The second circuit substrate comprises two first top pads, and each of the first top pads can be configured for mounting a light emitter. The second circuit substrate is arranged on the first circuit substrate and can be employed to mount the light emitters, which can improve the precision in the process of mounting the light emitters.
    Type: Application
    Filed: April 25, 2014
    Publication date: October 30, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • Publication number: 20140321129
    Abstract: An LED module includes a circuit board with circuit arranged thereon and an LED package mounted on the circuit board via flip-chip mounting. The LED package includes a substrate, a pin structure and a reflector arranged on the substrate, an LED chip disposed on the pin structure and an encapsulation layer covering the LED chip and received in the reflector. A top surface of the encapsulation layer adjacent to the circuit board acts as a light outputting surface. The pin structure extends from the substrate to a top surface of the reflector near the light outputting surface. The pin structure electrically connects the circuit board by conductive adhesive arranged therebetween. The light outputting surface faces a through hole defined in the circuit board. Light emitted from the LED chip travels through the light outputting surface and the through hole in sequence to illuminate.
    Type: Application
    Filed: October 18, 2013
    Publication date: October 30, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • Publication number: 20140321816
    Abstract: Optical connector includes a circuit board, a photoelectric element, a driver chip, a coupler, and a holder. The circuit board includes a substrate including a first surface and a second surface opposite to the first surface and a circuit portion formed on the substrate. The substrate defines a receiving groove in the second surface and a through hole passing through a bottom surface of the receiving groove and the first surface. The photoelectric element and the driver chip are positioned on the bottom surface of the receiving groove, and the photoelectric element is aligned with the through hole. The coupler is positioned on the first surface of the substrate and is aligned with the photoelectric element through the through hole. The holder holds an optical fiber. The holder is supported on the first surface and connected to the coupler. The coupler optically couples the optical fiber with the photoelectric element.
    Type: Application
    Filed: April 29, 2014
    Publication date: October 30, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • Publication number: 20140307231
    Abstract: A laser projection device includes a substrate, three laser diodes mounted on the substrate, and a spectroscope located on light paths of the laser diodes. The laser diodes are arranged along an arc-shaped curve. A sector-shaped region is defined by the three laser diodes and two intersected sides of the substrate. The spectroscope is located at the sector-shaped region. Light emitted from the laser diodes is adjusted by the spectroscope to transmit along a common direction and be mixed with each other.
    Type: Application
    Filed: May 14, 2013
    Publication date: October 16, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • Patent number: 8860219
    Abstract: A chip assembly includes a PCB and a chip positioned on the PCB. The PCB includes a number of first bonding pads. Each bonding pad includes two soldering balls formed thereon. The chip includes a number of second bonding pads, and each second bonding pad corresponds to a respective first bonding pad. The two soldering balls of each first bonding pad are electrically connected to a corresponding second bonding pad via two bonding wires, and the bonding wires are bonded to the second corresponding bonding pad by a wedge bonding manner.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: October 14, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu
  • Patent number: 8859910
    Abstract: A circuit board includes a dielectric layer and a signal routing layer on the dielectric layer. The signal routing layer includes chip traces, connector traces, and signal traces connected with the chip traces and the connector traces. The dielectric layer includes a signal trace area for arraying the signal traces, a chip trace area for arraying the chip traces, and a connector trace area for arraying the connector traces. The dielectric coefficient of the signal trace area is smaller than the dielectric coefficient of the chip trace area and greater than the dielectric coefficient of the connector trace area.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: October 14, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu
  • Publication number: 20140294370
    Abstract: An image blurring avoiding method for a camera includes obtaining a motion data of the camera; and capturing a picture only when the camera is substantially motionless according to the motion data.
    Type: Application
    Filed: June 27, 2013
    Publication date: October 2, 2014
    Inventors: Chia-Ho Lin, Shu-Han Yu, Chih-Chih Huang, Kai-Wen Wang
  • Patent number: 8847147
    Abstract: An optical-electrical module includes a base board, a laser diode, an integrated circuit, and a lens unit. The laser diode and the integrated circuit are both fixed on the base board. The lens unit and the base board cooperatively define a receiving space to receive the laser diode and the integrated circuit. The laser diode has a transmitting window at an end of the laser diode away from the base board. The integrated circuit drives the laser diode to transmit optical signals. The lens unit has an inner surface facing the base board, and the inner surface of the lens unit has a light transmitting area. The lens unit includes a metal film formed on the inner surface of the lens unit except on the light transmitting area.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: September 30, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu
  • Publication number: 20140262441
    Abstract: A circuit board includes a dielectric layer and a signal routing layer on the dielectric layer. The signal routing layer includes connector traces, chip traces, and signal traces connecting the two. A width of the signal traces is greater than a width of the chip traces, which is less than a width of the connector traces. The dielectric layer includes trace areas of different depths for each type of trace to achieve a uniform impedance throughout all traces.
    Type: Application
    Filed: August 30, 2013
    Publication date: September 18, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • Publication number: 20140252513
    Abstract: A Magnetoresistive Tunnel Junction (MTJ) device includes an elongated MTJ structure formed onto a substrate, the MTJ structure including a magnetic reference layer and a tunnel barrier layer. The MTJ device also includes a number of discrete free magnetic regions disposed onto the tunnel barrier layer. The ratio of length to width of the elongated MTJ structure is such that the magnetic field of the magnetic reference layer is pinned in a single direction.
    Type: Application
    Filed: March 9, 2013
    Publication date: September 11, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chwen Yu, Kai-Wen Cheng, Tien-Wei Chiang, Dong Cheng Chen
  • Patent number: 8823117
    Abstract: The present disclosure provides for magnetic devices and methods of fabricating such a device. In one embodiment, a magnetic device includes a first elliptical pillar of first material layers; a second elliptical pillar concentrically disposed over the first elliptical pillar, the second elliptical pillar includes second material layers. The second elliptical pillar is smaller than the first elliptical pillar in size.
    Type: Grant
    Filed: December 8, 2011
    Date of Patent: September 2, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chewn Yu, Tien-Wei Chiang, Kai-Wen Cheng
  • Publication number: 20140233961
    Abstract: An optical communication module includes a substrate, an optical signal receiving unit, an optical signal emitting unit and a coupler. The substrate includes a first surface and a second surface. The substrate defines through holes passing through the first and second surfaces. The optical signal receiving unit includes optical-electrical signal converters. The optical signal emitting unit includes optical signal generators. Each of the optical-electrical signal converters and the optical signal generators is mounted on the first surface and aligned with a corresponding one of the through holes. The coupler includes coupling lenses. The coupler is fixed to the second surface. Each of the optical-electrical signal converters and the optical signal generators is aligned with a corresponding coupling lens through the corresponding through hole.
    Type: Application
    Filed: August 9, 2012
    Publication date: August 21, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • Patent number: 8807844
    Abstract: An optical fiber coupling assembly includes a first optical fiber connector, a second optical fiber connector, and a cable. The first optical fiber connector defines a number of first blind holes receiving first focus lenses, and first through holes respectively communicating with the first blind holes. The second optical fiber connector defines a number of second blind holes receiving second focus lenses, and second through holes respectively communicating with the second blind holes. The cable includes a number of optical fibers. Each optical fiber includes a first end and a second end, and the first end is received in a corresponding one of the first through holes and aligned with the a corresponding one of the first focus lenses, and the second end is received in a corresponding one of the second through holes and aligned with a corresponding one of the second focus lenses.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: August 19, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu
  • Patent number: 8809976
    Abstract: The present disclosure provides a magnetoresistive random access memory (MRAM) device. The MRAM device includes a magnetic tunnel junction (MTJ) stack on a substrate; and a dual-layer passivation layer disposed around the MTJ stack. The dual-layer passivation layer includes an oxygen-free film formed adjacent sidewalls of the MTJ stack; and a moisture-blocking film formed around the oxygen-free film.
    Type: Grant
    Filed: September 24, 2011
    Date of Patent: August 19, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Ming Chen, Chung-Yi Yu, Cheng-Yuan Tsai, Kai-Wen Cheng
  • Patent number: 8804877
    Abstract: An apparatus for correcting a phase error is provided. The apparatus includes an error estimating module and a correcting module. The error estimating module receives a phase-shift keying signal, and calculates a phase error according to the phase-shift keying signal, a plurality of known candidate signals and Bayesian estimation. The correcting module corrects the phase-shift keying signal according to the phase error.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: August 12, 2014
    Assignee: MStar Semiconductor, Inc.
    Inventors: Kai-Wen Cheng, Yi-Ying Liao, Tung-Sheng Lin, Tai-Lai Tung
  • Publication number: 20140220496
    Abstract: A method for forming a photoresist structure is provided The method includes the step of forming a photoresist layer on a substrate, the step of exposing a portion of the photoresist layer to form an exposed portion of the photoresist layer, and the step of removing the photoresist layer except the exposed portion with a solvent, so as to form the photoresist structure, wherein the photoresist layer has a polymer having a structure represented by formula (I). The method of the present invention can generate a photoresist with an even thickness on devices with complex geometries or three-dimensional substrates. Thus, it can be applied to tissue engineering scaffolds, three-dimensional cell cultivation system and novel bio-microelectromechnical elements.
    Type: Application
    Filed: September 10, 2013
    Publication date: August 7, 2014
    Applicant: NATIONAL TAIWAN UNIVERSITY
    Inventors: Hsien-Yeh Chen, Mu-Gi Wu, Chieh-Chen Hsieh, Hung-Lun Hsu, Kai-Wen Hsiao
  • Patent number: 8796612
    Abstract: An optical fiber connector is positioned on a printed circuit board (PCB) and includes a main body, a number of slots, and a number of optical fibers. The main body includes a number of light transceivers. Each of the light transceivers includes a light transmitting module and a light receiving module adjacent to the light transmitting module. One end of each of the optical fibers is optically coupled to a respective one of the light emitting modules and the light receiving modules, and the other end of each of the optical fibers is mounted on a respective one of the slots.
    Type: Grant
    Filed: June 20, 2012
    Date of Patent: August 5, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu