Abstract: The disclosure is a network interface controller (NIC) capable of sharing buffers, which is coupled to a host and a network to make the network connection. The NIC includes a transmitting buffer, a transmitting controller, a receiving buffer, and a receiving controller. The transmitting controller controls the transmitting buffer to transmit the transmission data provided by the host to the network. The receiving controller controls the receiving buffer to transmit the reception data received from the network to the host, and determines a storage capacity of the receiving buffer. When the storage capacity is smaller than a set value, the receiving controller transmits a request signal to the transmitting controller, the transmitting controller generates a response signal according to the request signal and a status signal corresponding to the transmitting buffer, and the receiving controller controls whether reception data is stored in the transmitting buffer according to the response signal.

Abstract: A laser emitting chip package includes a circuit board, a laser emitting chip, and at least three gold balls. The circuit board includes at least two substrate-pad areas. The laser emitting chip includes at least two chip-pad areas. Each of the chip-pad areas spatially corresponds to a respective one of the substrate-pad areas. The at least three gold balls are explanted on the at least two chip-pad areas. The laser emitting chip is supported on the circuit board by the at least three gold balls in a triangular or square arrangement between the chip-pad areas and the substrate-pad areas. The laser emitting chip is electrically connected to the circuit board through the gold balls.

Abstract: A high-frequency transmission module includes a first chip, a second chip, and a conductive wire. The first chip includes a first top surface and a number of pads arranged along a periphery of the first top surface. The pads include a first bonding pad. The second chip includes a second top surface and a second bonding pad on the second top surface. The second chip is positioned on the first top surface such that the pads are uncovered by the second chip and the second bonding pad is mostly closed to the first bonding pad. The conductive wire bonds to the first bonding pad and the second bonding pad to electrically connect the second chip to the first chip and is configured to transmit high-frequency signals between the first chip and the second chip.

Abstract: A signal processing apparatus for receiving a spectral line of an original signal includes a starting point determining module, a searching module and a symbol rate determining module. The starting point determining module finds a maximum energy in the spectral line and determines at least one search starting point according to the maximum energy. From the at least one search starting point, the searching module searches along the spectral line towards a region with a lower energy for at least one minimum energy satisfying a predetermined condition. The symbol rate determining module determines a symbol rate of the original signal according to the at least one minimum energy.

Abstract: A circuit for detecting a digital data stream includes a first detecting circuit, a second detecting circuit and a decision unit. The digital data stream includes a predetermined symbol having a first data and a second data. The first detecting circuit detects a correlation between the second data and a first frequency-shifted data to generate a first correlated data; and the second detecting circuit detects a correlation between the second data and a second frequency-shifted data to generate a first correlated data, where the first frequency-shifted data and the second frequency-shifted data are generated by performing first frequency-shifting and second frequency-shifting upon the first data, respectively. The decision unit determines a signal status of the digital data stream according to the first and second correlated data.

Abstract: The invention discloses an intelligent navigation method comprising the following steps of: (a) defining a system circle based on a current position and a target position; (b) searching a plurality of paths between the current position and the target position from the system circle; (c) for each path, calculating a total of directional paths and a total of path-influenced factors; (d) summing up the total of directional paths and the total of path-influenced factors for each path to obtain a plurality of summations; and (e) selecting a path corresponding to the minimum of all summations to be the optimal path.

Abstract: A chip assembly includes a PCB and a chip positioned on the PCB. The PCB includes a number of first bonding pads. Each bonding pad includes two first soldering balls formed thereon. The chip includes a number of second bonding pads each corresponding to a first bonding pad. Each second bonding pad includes a second soldering ball. The two first soldering balls of a first bonding pad are electrically connected to the second soldering ball of a corresponding second bonding pad via two bonding wires.

Abstract: Methods and apparatuses for a magnetic tunnel junction (MTJ) which can be used in as a magnetic random access memory cell are disclosed. The MTJ comprises a free layer and an insulator layer. The MTJ further comprises a pinned layer with a first region, a second region, and a third region. The second region is of a first length and of a first thickness, and the first region and the third region are of a second length and of a second thickness. A ratio of the first thickness to the second thickness may be larger than 1.2. A ratio of the second length to the first length is larger than 0.5. The first thickness may be larger than a spin diffusion length of a material for the pinned layer. So formed MTJ results in increased tunneling magnetic resistance ratio and reduced critical switch current of the MTJ.

Abstract: An optical coupler includes a male port and a female port. The male port includes a first main body, a first optical fiber, and a male port lens unit. The male port lens unit includes a first base body, a first male port lens coupling with the first optical fiber, and a second male port lens. The first base body includes a male port reflecting sidewall. The female port includes a second main body, a second optical fiber, and a female port lens unit. The female port lens unit includes a second base body, a first female port lens coupling with the second optical fiber, and a second female port lens coupling with the second male port lens. The second base body includes a female port reflecting surface parallel with the male port reflecting sidewall.

Abstract: An optical fiber coupler includes a male port and a female port. The male port includes a main body, the male transmission lens and the male receiving lens positioned on the main body, and a male optical wave guide assembly. The male base board includes at least one male optical wave guide. Each male optical wave guide includes a male first alignment portion and a male second alignment portion. The male first alignment portion is optically coupled with one male receiving lens; and a male second alignment portion has a greater width than that of the male first alignment portion. The structure of the female port is similar to the male port.

Abstract: An optical fiber coupler includes two insertion ports inserted into each other. Each insertion port includes a main body having a connecting wall, at least two lenses positioned adjacent to the connecting wall, and at least two optical fibers coupled with the at least two lenses. While the connecting wall has an axis of symmetry, one insertion port acts as a male port, and the other insertion port acts as a female port. A positioning post protrudes from the connecting wall. A guiding hole is formed on the connecting wall. The projections of the positioning post and the guiding hole on the connecting wall are symmetrical around the longitudinal center axis of the optical fiber coupler, respectively. The lenses are symmetrical around the longitudinal center of axis.

Abstract: The present disclosure provides for magnetic logic devices and methods of operating such a device. In one embodiment, the device includes a bottom electrode configured to receive a first input current and a second input current, a bottom magnetic layer disposed over the bottom electrode, a nonmagnetic layer disposed over the bottom magnetic layer, a top magnetic layer disposed over the nonmagnetic layer, and a top electrode disposed over the top magnetic layer, the top electrode and the bottom electrode configured to provide an output voltage which is dependent on the first and second input currents and which follows an AND gate logic or an OR gate logic.

Abstract: An optical-electrical module includes a base board and an optical transmitting unit fixed on the base board. The optical transmitting unit includes an edge-emitting laser transmitting optical signals parallel to the base board, a driving integrated circuit for driving the edge-emitting laser to transmit optical signals, and a first lens unit for transmitting and converging the optical signals. Furthermore, the optical-electrical module can also include an optical receiving unit used to receive the optical signals transmitted by the optical transmitting unit and convert the optical signals into electrical signals. The optical receiving unit includes a photo diode, a transimpedance amplifier, and a second lens unit.

Abstract: An optical-electrical module includes a base board, a laser diode, an integrated circuit, and a lens unit. The laser diode and the integrated circuit are both fixed on the base board. The lens unit and the base board cooperatively define a receiving space to receive the laser diode and the integrated circuit. The laser diode has a transmitting window at an end of the laser diode away from the base board. The integrated circuit drives the laser diode to transmit optical signals. The lens unit has an inner surface facing the base board, and the inner surface of the lens unit has a light transmitting area. The lens unit includes a metal film formed on the inner surface of the lens unit except on the light transmitting area.

Abstract: The present disclosure provides for magnetic devices and methods of fabricating such a device. In one embodiment, a magnetic device includes a first elliptical pillar of first material layers; a second elliptical pillar concentrically disposed over the first elliptical pillar, the second elliptical pillar includes second material layers. The second elliptical pillar is smaller than the first elliptical pillar in size.

Abstract: An optical fiber coupling assembly includes a first optical fiber connector and a second optical fiber connector. The first optical fiber connector includes a first body having a first light incident surface, first optical lenses, first plugs, and second plugs. The first optical lenses, the first plugs, and the second plugs are formed on the first light incident surface. The first optical lenses are positioned between the first plugs, and the first plugs are positioned between the second plugs. The second plugs are longer than the first plugs. The second optical fiber connector includes a second body having a second light incident surface and second optical lenses formed on the second light incident surface. First engaging holes and second engaging holes are defined in the second light incident surface. The first plugs are inserted into the first engaging holes, and the second plugs are inserted into the second engaging holes.

Abstract: An optical element package includes an optical wave guide array, at least one optical assembly and at least one optical transmission member. The optical wave guide array has a reflection groove. The reflection groove includes a reflection surface. The at least one optical assembly is positioned on the optical wave guide array adjacent to the reflection surface. The at least one optical transmission member is positioned on the optical wave guide array, and is optically coupled with the reflection surface. The optical signals emitted by the at least one optical assembly are reflected by the reflection surface and then reaching the at least one optical transmission member for transmission.

Abstract: A chip package includes a substrate, an electrical module, an optical module and a transmission module. The electrical module and the optical module are positioned on the substrate and electrically connect with each other. The optical module is used for converting optical signals to electrical signals, and vice versa. The optical module includes an optical emitting element and optical receiving element. The transmission module is positioned on the substrate. The transmission module includes an optical wave guide array having a reflection surface and a plurality of optical fibers that are optically coupled with the optical wave guide array. The optical signals emitted by the optical module are reflected by the reflection surface and reach the optical fibers to be transmitted; the optical module is capable of receiving optical signals from the optical fibers.

Abstract: An optical fiber coupling assembly includes a first optical fiber connector, a second optical fiber connector, and a cable. The first optical fiber connector defines a number of first blind holes receiving first focus lenses, and first through holes respectively communicating with the first blind holes. The second optical fiber connector defines a number of second blind holes receiving second focus lenses, and second through holes respectively communicating with the second blind holes. The cable includes a number of optical fibers. Each optical fiber includes a first end and a second end, and the first end is received in a corresponding one of the first through holes and aligned with the a corresponding one of the first focus lenses, and the second end is received in a corresponding one of the second through holes and aligned with a corresponding one of the second focus lenses.

Abstract: An optical fiber transmitting system including a first Optical/Electrical (O/E) module, a first interface, a second interface, a fiber cable and a second Optical/Electrical (O/E) module is provided. The first O/E module includes a laser diode (LD) configured to emit laser optical signals. The fiber cable includes two pieces of optical fiber and a third piece of optical fiber for transmitting the laser optical signals to the second O/E module via the first interface and the second interface. The second O/E module includes a photo-detector (PD) configured to convert the laser optical signals into electronic signals to supply power energy to a peripheral device.