Patents by Inventor Kai Wen

Kai Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140138127
    Abstract: A circuit board includes a dielectric layer and a signal routing layer on the dielectric layer. The signal routing layer includes chip traces, connector traces, and signal traces connected with the chip traces and the connector traces. The dielectric layer includes a signal trace area for arraying the signal traces, a chip trace area for arraying the chip traces, and a connector trace area for arraying the connector traces. The dielectric coefficient of the signal trace area is smaller than the dielectric coefficient of the chip trace area and greater than the dielectric coefficient of the connector trace area.
    Type: Application
    Filed: February 1, 2013
    Publication date: May 22, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • Publication number: 20140140667
    Abstract: A circuit board includes a mounting surface and a number of connecting pads on the mounting surface. Each of the connecting pads defines a mounting area for mounting an element thereon. At least two of the connecting pads are substantially circular-shaped.
    Type: Application
    Filed: April 30, 2013
    Publication date: May 22, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • Publication number: 20140133798
    Abstract: A light source includes a base, a first bonding layer, at least two laser diodes, a second bonding layer, a substrate, and a planer waveguide. The laser diodes are fixed to and are electrically connected to the base using the first bonding layer, and each of the laser diodes includes a side surface for emitting light. The substrate is fixed to the base using the second bonding layer. The waveguide is formed on the substrate and includes an output section including an output end and at least two input branches branching off from an end of the output section opposite to the output end. Each of the input branches includes an input end opposite to the output section and aligning with a respective one of the side surfaces of the at least two laser diodes.
    Type: Application
    Filed: May 24, 2013
    Publication date: May 15, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • Patent number: 8724940
    Abstract: A circuit board assembly includes a first circuit board, and a second circuit board, a first optical transceiver, a number of first light wave guides, a second optical transceiver, and a number of second light wave guides. The first circuit board defines a number of first through holes. The second circuit board defines a number of second and third through holes. Each of the third through holes is aligned with a respective first though hole. The first optical transceiver is optically coupled with the second through holes. The first light wave guides are mounted on one surface of the first circuit board and optically coupled with the second through holes. The second optical transceiver is optically coupled with the third through holes. The second light wave guides are mounted on another surface of the first circuit board and are optically coupled with the first through holes.
    Type: Grant
    Filed: August 2, 2012
    Date of Patent: May 13, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu
  • Patent number: 8724459
    Abstract: The invention discloses a method of establishing an adaptive mobile cluster network. The method comprises the steps of: (a) determining a network service requested by a mobile communication device; (b) according to the requested network service, determining at least one communication parameter needed by the mobile communication device; (c) according to the needed communication parameter, selecting a header device from a plurality of wireless communication devices by the communication device; (d) selecting a plurality of agent devices from the remaining wireless communication devices by the header device; and (e) selecting a plurality of normal devices from the remaining wireless communication devices by the agent devices, so as to establish the adaptive mobile cluster network.
    Type: Grant
    Filed: October 20, 2011
    Date of Patent: May 13, 2014
    Assignee: Quanta Computer Inc.
    Inventors: Jie-Min Chen, Kai-Wen Tien
  • Patent number: 8721189
    Abstract: An optical fiber connector assembly includes a first, and second plug connectors, and a socket connector. The first plug connector includes a first main portion and a first plate with a first front surface defining alignment holes. A first distance is defined between the first front surface and the first main portion. The second plug connector includes a second main portion and a second plate with a second front surface. A second distance is defined between the second front surface and the second main portion. The socket connector includes a side surface defining a recess with a bottom surface. A third distance is defined between the side surface and the bottom surface. Alignment pins extend from the bottom surface. The length of each alignment pin is defined as a fourth distance. The third distance is equal to the first distance and greater than sum of the second and fourth distances.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: May 13, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu
  • Publication number: 20140126566
    Abstract: A data transmission system is utilized in a Mobile Industry Processor Interface (MIPI). A master device includes a control module for generating a control signal according to a feedback signal. A packet encoding module is coupled to the control module for encoding an original packet to be a transmission packet according to the original packet and the control signal to process a transmission operation. A slave device includes a packet decoding module for decoding the transmission packet to be the original packet or a related display device signal corresponding to the original packet to a display device. A feedback module is coupled to the packet decoding module for generating the feedback signal to the control module of the master device according to a decoding condition of the control module, so as to switch a transmission mode of the transmission operation.
    Type: Application
    Filed: March 15, 2013
    Publication date: May 8, 2014
    Applicant: NOVATEK MICROELECTRONICS CORP.
    Inventors: Chien-Yu Chen, Kai-Wen Shao, Feng-Jung Kuo
  • Patent number: 8719617
    Abstract: A method for realizing an Internet protocol (IP) multimedia subsystem (IMS) disaster tolerance includes the steps as follows. An S-CSCF receives a user registration, and backs up necessary data which is required when a user service processing is restored on a storage entity in a network. An I-CSCF of user's home domain receives a service request of the user, and if it is found that the S-CSCF currently providing a service for the user fails, assigns a new S-CSCF to the user, and forwards the service request to the newly assigned S-CSCF. The newly assigned S-CSCF interrogates and acquires subscription data of the user and the necessary data backed up by the original S-CSCF from the storage entity, and then restores the user service processing according to the subscription data and the backup data. A device for realizing an IMS disaster tolerance is also provided.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: May 6, 2014
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Jiongjiong Gu, Kai Wen, Feng Liang, Linfei Shen, Shufeng Shi
  • Publication number: 20140119017
    Abstract: A light source module includes a laser light source, and an optical lens facing the laser light source. The optical lens includes a first light reflecting face, a second light reflecting face facing the first light reflecting face, a light incident face connecting the first light reflecting face and the second light reflecting face, and a light emitting face opposite to the light incident face. Light emitted from the laser light source is firstly reflected to the second reflecting face by the first reflecting face, then reflected to the light incident face by the second reflecting face, and then entered into the optical lens from the light incident face, and transmitted in the optical lens, finally exited from the light emitting face.
    Type: Application
    Filed: August 21, 2013
    Publication date: May 1, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • Patent number: 8709267
    Abstract: Methods for patterning material layers, which may be implemented in forming integrated circuit device features, are disclosed. In an example, a method includes forming a first resist layer over a material layer; forming a second resist layer over the first resist layer; forming an opening that extends through the second resist layer and the first resist layer to expose the material layer, wherein the opening has a substantially constant width in the second resist layer and a tapered width in the first resist layer; and performing a tilt-angle deposition process to form a feature over the exposed material layer.
    Type: Grant
    Filed: July 21, 2011
    Date of Patent: April 29, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chwen Yu, Fei-Gwo Tsai, Kai-Wen Cheng
  • Publication number: 20140081588
    Abstract: A positioning method and an electronic device utilizing the same are disclosed. The positioning method, adopted by an electronic device for positioning a mobile device, includes: determining a preliminary plane location of the mobile device; obtaining a tilt angle of the mobile device; and correcting an error in the preliminary plane location based on the tilt angle, to obtain the correct plane location of the mobile device.
    Type: Application
    Filed: December 12, 2012
    Publication date: March 20, 2014
    Applicant: QUANTA COMPUTER INC.
    Inventors: Kai-Wen Tien, Jie-Min Chen, Chin-Lien Hsu, Tsung-Ying Hsieh
  • Patent number: 8675787
    Abstract: A circuit for detecting a predetermined symbol of a digital data stream includes a frequency shifter, a correlator, a filter and a decision unit. The frequency shifter performs inverse-frequency shifting upon a first data to generate a first frequency-shifted data. The correlator calculates correlation upon the first frequency-shifted data and a second data to generate a correlated data. The filter, coupled to the correlator, filters and the correlated data to generate a filtered correlated data according to a time-domain windowing length. The decision unit, coupled to the filter, determines the predetermined symbol from the digital data stream according to the filtered correlated data.
    Type: Grant
    Filed: March 22, 2010
    Date of Patent: March 18, 2014
    Assignee: MStar Semiconductor, Inc.
    Inventors: Kai-Wen Cheng, Ko-Yin Lai, Yi-Ying Liao, Tai-Lai Tung
  • Patent number: 8659340
    Abstract: A tunable voltage-controlled pseudo-resistor structure, comprising: a symmetric PMOS transistor circuit and an auto-tuning circuit connected in series. Input of the auto-tuning circuit is connected to a central position Vf of the PMOS transistor circuit having its output Vg, with its purpose of keeping Vg?Vf at a constant value. The PMOS transistor circuit may produce body effect through various different bulk voltages. Through the auto-tuning circuit, Vg and Vf are kept constant to make current of transistor to produce compensation effect, such that regardless of Va>Vb or Va<Vb, a large resistance is maintained. Through utilizing the tunable voltage-controlled pseudo-resistor structure, constant resistance can be maintained under high input voltage, hereby reducing drifting of common-mode voltage, in achieving a superior resistance effect.
    Type: Grant
    Filed: March 15, 2012
    Date of Patent: February 25, 2014
    Assignee: National Central University
    Inventors: Muh-Tian Shiue, Kai-Wen Yao, Cihun-Siyong Gong
  • Publication number: 20140048893
    Abstract: The present disclosure provides a semiconductor memory device. The device includes a pinning layer having an anti-ferromagnetic material and disposed over a first electrode; a pinned layer disposed over the pinning layer; a tunneling layer disposed over the pinned layer, a free layer disposed over the tunneling layer and a capping layer disposed over the free layer. The capping layer includes metal-oxide and metal-nitride materials.
    Type: Application
    Filed: August 16, 2012
    Publication date: February 20, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kuo-Ming Wu, Kai-Wen Cheng, Cheng-Yuan Tsai, Chia-Shiung Tsai
  • Patent number: 8644658
    Abstract: A light transmission system includes a light guide support, a first convex lens, an optical waveguide member, and two second convex lenses. The light guide support includes a first surface, a second surface, a hollow space formed between the first surface and the second surface, and an inner reflecting surface forming an angle of 45 degrees relative to the first surface. The first convex lens is formed at the first surface, and configured for converging light to the inner reflecting surface. The optical waveguide member is located at the hollow space, and includes a main section parallel with the first surface, two first branch sections extending from and forming equal angles relative to the main section, and two second branch sections extending from the respective first branch sections. The two second convex lenses are formed at the second surface and aligned with the respective second branch sections.
    Type: Grant
    Filed: October 25, 2012
    Date of Patent: February 4, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu
  • Publication number: 20140011306
    Abstract: An inspecting method and an inspecting equipment including a dividing unit, a determining unit, a transferring unit and an inspecting unit for inspecting a disk are provided. The inspecting method includes the following steps. First, a plane is divided into several zones with equal area. Next, several measuring locations are determined within these zones. Next, these measuring locations are transferred into several sets of measuring locations corresponding to the disk through a coordinate transfer. Then, the disk is inspected according to these sets of measuring locations.
    Type: Application
    Filed: September 16, 2013
    Publication date: January 9, 2014
    Applicant: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Kai-Wen TU, Jen-Hung WANG, Chung-Hsien CHOU, Wen-Sen PAN
  • Publication number: 20140001346
    Abstract: A detection method of an image projection device is disclosed. A projection beam is projected on a plurality of projection regions within a projection range, wherein the projection beam carries different features when the projection beam is projected on different projection regions. A reflected beam from the projection range is received and converted to an electrical signal. The feature existing in the electrical signal is analyzed. The projection region corresponding to the feature is determined to identify which of the projection regions is/are blocked by an object.
    Type: Application
    Filed: November 14, 2012
    Publication date: January 2, 2014
    Applicant: LITE-ON IT CORPORATION
    Inventors: Chun-Hung Chen, Kai-Wen Cheng
  • Patent number: 8614504
    Abstract: A chip package includes a substrate, a pad, a double-sided adhesive tape, a chip, and a sealing member. The pad is arranged on the substrate and has a top surface facing away from the substrate. The double-sided adhesive tape includes a first paste surface and an opposing second paste surface. The first paste surface is attached to the top surface. The chip is attached onto the second paste surface and includes a light emitting surface or a light receiving surface facing away from the second paste surface. The sealing member is formed on the pad and tightly surrounds the chip and the double-sided adhesive.
    Type: Grant
    Filed: October 30, 2011
    Date of Patent: December 24, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu
  • Publication number: 20130330044
    Abstract: An optical connector includes a substrate, a number of light emitters, a number of light receivers, and a lens module. The light emitters and the light receivers are positioned on the substrate. The lens module is positioned on the substrate, and the light emitters and the light receivers are received in the lens module. The lens module includes a reflection surface, a number of first lenses, and a number of second lenses. Optical axes of the first lenses cross optical axes of the second lenses on the reflection surface. The first lenses are aligned with the light emitters and the light receivers.
    Type: Application
    Filed: August 12, 2013
    Publication date: December 12, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • Patent number: 8596880
    Abstract: An optical fiber connector adapter for coupling a first optical fiber connector to a second optical fiber connector includes a lens body. The lens body includes a first surface and an opposite second surface. A positioning hole is defined in the first surface. A lens hole is defined in the first surface and a first lens is formed on a bottom in the lens hole. The first lens is beneath the first surface and adjacent to the positioning hole. A positioning post and a second lens protrude from the second surface. The second lens is aligned with the first lens. An optical fiber connector assembly having the optical fiber connector adapter is also provided.
    Type: Grant
    Filed: June 20, 2012
    Date of Patent: December 3, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu