Patents by Inventor Kai Wen

Kai Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • OPTICAL CONNECTOR CONNECTED BETWEEN ELECTRONIC DEVICE AND OPTICAL FIBER
    Publication number: 20140212099
    Abstract: An optical connector includes a substrate, a photoelectric element, and a base. The substrate includes a bearing surface. The photoelectric element includes a base, at least one light emitter, and at least one light receiver. The base is positioned on the bearing surface and includes an installing surface substantially perpendicular to the bearing surface. The light emitters and the light receivers are positioned on the installing surface. The optical element includes at least two first lenses and at least two second lenses aligned with the first lenses. The light emitters and the light receivers are aligned with the first lenses.
    Type: Application
    Filed: June 28, 2013
    Publication date: July 31, 2014
    Inventor: KAI-WEN WU
  • PHOTOELECTRIC COUPLING MODULE
    Publication number: 20140209791
    Abstract: A photoelectric coupling module includes a substrate, a photoelectric unit, and a lens module. The substrate defines a positioning recess. The photoelectric unit is positioned on the substrate. The lens module includes a reflection surface, a plurality of first lenses, and a plurality of second lens. Optical axes of the first lenses cross optical axes of the second lenses on the reflection surface. The lens module further includes a positioning portion extending downward from a bottom surface, and the positioning portion is received in the positioning recess. The first lenses are aligned with the photoelectric unit.
    Type: Application
    Filed: August 22, 2013
    Publication date: July 31, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • PHOTOELECTRIC COUPLING MODULE
    Publication number: 20140209792
    Abstract: A photoelectric coupling module includes a substrate, a photoelectric unit, and a lens module. The substrate carries at least two alignment marks for correct and absolute positioning of the lens module on the substrate. The photoelectric unit is positioned on the substrate. The lens module defines at least two through holes aligned with the alignment marks.
    Type: Application
    Filed: August 30, 2013
    Publication date: July 31, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • ELECTRONIC DEVICE WITH DETACHABLE KEYBOARD
    Publication number: 20140204520
    Abstract: An electronic device includes a base and a keyboard module detachably mounted on the base. The keyboard module includes a first side and a second side. The first side includes a first unit. The second side includes a second unit. The keyboard module is mounted on the base in different directions to expose the first unit or the second unit.
    Type: Application
    Filed: January 3, 2014
    Publication date: July 24, 2014
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., TIANJIN FUNAYUANCHUANG TECHNOLOGY CO.,LTD.
    Inventors: HO-CHIEN WU, KAI-WEN HSUEH
  • QUANTUM COMPUTER AND QUANTUM COMPUTING USING ISING MODEL
    Publication number: 20140200689
    Abstract: For each pair of a plurality of slave lasers B for which injection synchronization is performed by a master laser M, by controlling the intensity of light exchanged between two slave lasers B and an optical path length between the two slave lasers B using a slave-to-laser intensity control unit IA and an inter-slave laser optical path length control unit IP, the magnitude and the sign of pseudo ising interaction Jij between the two slave lasers B are implemented. After the plurality of slave lasers B arrive at a steady state, by measuring relative values of the oscillation phases of the plurality of slave lasers B with respect to the oscillation phase of the master laser M by using an oscillation phase measuring unit PM, pseudo ising spins ?i of the plurality of slave lasers B are measured.
    Type: Application
    Filed: November 7, 2013
    Publication date: July 17, 2014
    Applicants: The Board of Trustees of the Leland Stanford Junior University, Inter-University Research Institute Corporation, Research Organization of Information and Systems
    Inventors: Shoko Utsunomiya, Kenta Takata, Yoshihisa Yamamoto, Kai Wen
  • OPTICAL CONNECTOR WITH PRINTED CIRCUIT BOARD AND LENS ELEMENT BONDED TO EACH OTHER
    Publication number: 20140199033
    Abstract: An optical connector includes a printed circuit board, a photoelectric element, a lens element, and an adhesive. The photoelectric element is positioned on and electrically connected to the printed circuit board. The positioning element is an enclosing wall extending from the printed circuit board and enclosing the photoelectric element. The lens element includes a bottom surface, an internal lens formed on the bottom surface, and a supporting leg, which is an enclosing wall extending from a periphery of the bottom surface. The supporting leg is positioned on the printed circuit boar and fittingly engaged with the positioning element. The adhesive is applied between the supporting leg and the printed circuit board.
    Type: Application
    Filed: August 9, 2013
    Publication date: July 17, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • Double-sided printed circuit board
    Patent number: 8780574
    Abstract: A double-sided PCB includes a circuit plate, a first chip, and a second chip. The circuit plate includes a spacer layer having a first surface and an opposing second surface, a first multilayer structure, and a second multilayer structure. The first multilayer structure includes a first wire layer, a first middle layer, and a second wire layer having a first grounding portion and first conductive pattern portions, that are stacked on each other on the first surface. The second multilayer structure on the second surface is either a mirror image of the first multilayer structure, or is very similar thereto. The first and second chips are each arranged on a grounding portion and are each electrically connected to their respective conductive pattern portions.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: July 15, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu
  • Technique for smoothing an interface between layers of a semiconductor device
    Patent number: 8772845
    Abstract: The present disclosure provides a semiconductor memory device. The device includes a pinning layer having an anti-ferromagnetic material and disposed over a first electrode; a pinned layer disposed over the pinning layer; a composite layer disposed over the pinned layer, the composite layer having a magnetic material randomly distributed in a non-magnetic material; a barrier layer disposed on the composite layer; a free layer disposed over the barrier layer; and a second electrode disposed over the free layer.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: July 8, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Ming Chen, Cheng-Yuan Tsai, Chung-Yi Yu, Kai-Wen Cheng, Kuo-Ming Wu
  • CIRCUIT BOARD WITH SIGNAL ROUTING LAYER HAVING UNIFORM IMPEDANCE
    Publication number: 20140182902
    Abstract: A circuit board comprises a signal routing layer, a first dielectric layer, a second dielectric layer, a third dielectric layer, a first ground layer, a second ground layer, and a third ground layer. The signal routing layer includes chip traces, connector traces, and signal traces connected to components. The first dielectric layer, the first ground layer, the second dielectric layer, the second ground layer, the third dielectric layer, and the third ground layer, in that order, are located at gradually increasing distances from the signal routing layer. The first ground layer corresponds to the chip traces, the second ground layer corresponds to the signal traces, and the third ground layer corresponds to the connector traces.
    Type: Application
    Filed: April 17, 2013
    Publication date: July 3, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • CIRCUIT BOARD ASSEMBLY EMPLOYED IN OPTICAL CONNECTOR
    Publication number: 20140175266
    Abstract: A circuit board assembly includes a printed circuit board (PCB), at least two laser diodes, a number of first bonding wires, at least two photo diodes and a number of second bonding wires. The PCB includes a mounting surface, a first connecting pad, and a second connecting pad, both the first connecting pad and the second connecting pad are positioned on the mounting surface. The at least two laser diodes and the driving chip mounted on the first connecting pad. The first bonding wires each electrically connects the laser diodes to the driving chip. The photo diodes and the transimpedance amplifier mounted on the second connecting pad. The second bonding wires each electrically connects the photo diodes to the transimpedance amplifier.
    Type: Application
    Filed: February 1, 2013
    Publication date: June 26, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • LASER PROJECTION DEVICE
    Publication number: 20140176913
    Abstract: An exemplary laser projection device includes a substrate, three laser chips mounted on the substrate, and a spectroscope arranged on laser beams paths of the laser chips. Each laser chip is a laser diode. The spectroscope includes a first group of splitters, and a second group of splitters spaced from the first group of splitters. Laser beams emitted from the laser chips are adjusted into the second group of splitters by the first group of splitters. And then, the laser beams adjusted into the second group of splitters are adjusted to be oriented toward the same direction and mixed together to obtain light of a predetermined color.
    Type: Application
    Filed: May 14, 2013
    Publication date: June 26, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • LASER PROJECTION DEVICE
    Publication number: 20140168612
    Abstract: A laser projection device includes three laser chips, a spectroscope arranged on light paths of laser beams emitted from the three laser chips, and a lens mounted between the laser chips and the spectroscope. The lens includes a main body and a bending part bent from the main body. The main body is on the light paths of two of the laser chips. The bending part is on the light path of another laser chip. The laser beams emitted from the corresponding two laser chips are refracted by the main part of the lens. The laser beams emitted from the corresponding another laser chip are refracted by the bending part. The laser beams emitted from the laser chips are converged by the lens to reach the spectroscope and then reflected by the spectroscope to be mixed together.
    Type: Application
    Filed: May 14, 2013
    Publication date: June 19, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • LASER PROJECTOR AND METHOD OF DETECTING SCANNING ANGLE RANGE OF LASER BEAM THEREOF
    Publication number: 20140168619
    Abstract: A method of detecting a scanning angle range of a laser beam of a laser projector is provided. First, a photo sensor is disposed between first and second positions on a projection mirror. Then, a laser beam emitted from the laser projector scans back and forth between the first and second positions, so that the photo sensor receives the laser beam sequentially at first and second scanning time points to generate first and second sensing signals, respectively. If an actual time interval between the first and second sensing signals conforms to an expected time interval, an actual scanning angle range of the laser beam is determined as normal. If the actual time interval does not conform to the expected time interval, the actual scanning angle range of the laser beam is determined as abnormal and the laser projector stops emitting the laser beam. A laser projector is also provided.
    Type: Application
    Filed: January 22, 2013
    Publication date: June 19, 2014
    Applicant: LITE-ON IT CORPORATION
    Inventors: Chia-Tse Lin, Kai-Wen Cheng
  • LASER PROJECTION DEVICE
    Publication number: 20140168611
    Abstract: A laser projection device includes a blue laser chip, a red laser chip and a green laser chip and a spectroscope arranged on light paths of laser beams emitted from the laser chips. The laser projection device further includes a substrate. The laser chips are mounted on the substrate. The laser beams emitted from the laser chips are converged by a lens to reach the spectroscope and then reflected by the spectroscope to mix together.
    Type: Application
    Filed: April 29, 2013
    Publication date: June 19, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • Method and device for establishing network connection
    Patent number: 8755529
    Abstract: A device for establishing network connection is disclosed, having a transmitting circuit, a receiving circuit, and a controller. The transmitting circuit, comprising a first scrambler having a plurality of first registers, transmits a first data scrambled by the first scrambler to a transmission line according to an oscillating signal generated by an oscillation circuit. The receiving circuit receives a second data scrambled by a second scrambler from the transmission line and comprises a descrambler having a plurality of second registers for descrambling the second data. The first and the second scramblers use the same scrambler generator polynomial. The controller compares at least one of the first data and the value of the first registers and at least one of the second data and the values of the second registers for configuring the oscillation circuit to adjust the frequency of the oscillating signal.
    Type: Grant
    Filed: December 23, 2011
    Date of Patent: June 17, 2014
    Assignee: Realtek Semiconductor Corp.
    Inventors: Liang-Wei Huang, Cheng-Han Lee, Yi-Huei Lei, Kai-Wen Cheng
  • Optical adapter and optical signal transmission device including same
    Patent number: 8750656
    Abstract: An optical adapter includes a loading plate and a coupling lens. The coupling lens includes a main body, a first optical reflector, and a second optical reflector. The first optical reflector is positioned on the loading plate. The main body includes a top plate made of transparent material and spaced a predetermined distance from the loading plate. The second optical reflector is positioned on the first top plate. The first loading plate loads a portion of a planar optical waveguide of an optical printed circuit board. An optical signal from the planar optical waveguide is reflected by the first optical reflector to the second optical reflector, then is reflected by the second optical reflector to the outside of the optical adapter.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: June 10, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu
  • CHANNEL SCANNING METHOD FOR DIGITAL VIDEO BROADCASTING SATELLITE SIGNAL
    Publication number: 20140157331
    Abstract: A channel scanning method for Digital Video Broadcasting—Satellite (DVB-S) signals is provided. The method includes: scanning a radio frequency (RF) signal according to a normal frequency step; when the Nth channel is detected, obtaining a difference between a low boundary of an Nth channel and a high boundary of an (N?1)th channel; and, when the difference is within a predetermined bandwidth range, scanning the RF signal between the high boundary of the (N?1)th channel and the low boundary of the Nth channel according to a narrow frequency step. The normal frequency step is greater than the narrow frequency step.
    Type: Application
    Filed: December 3, 2013
    Publication date: June 5, 2014
    Applicant: MStar Semiconductor, Inc.
    Inventors: Chu-Hsin Chang, Kai-Wen Cheng, Yi-Ying Liao, Tung-Sheng Lin, Tai-Lai Tung
  • OPTICAL COMMUNICATION MODULE
    Publication number: 20140151536
    Abstract: An optical communication module includes a lens unit and an optical-electrical converter. The optical-electrical converter includes a circuit board and the lens unit is fixed on the circuit board. The lens unit has an extension portion, and the extension portion extends outwards from the lens unit and is parallel to the circuit board. Glue is located between the extension portion and the circuit board to secure the lens unit on the circuit board.
    Type: Application
    Filed: April 30, 2013
    Publication date: June 5, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • High-frequency transmission module and optical connector having stacked chips connected via wire bonding
    Patent number: 8740475
    Abstract: A high-frequency transmission module includes a first chip, a second chip, and a conductive wire. The first chip includes a first top surface and a number of pads arranged along a periphery of the first top surface. The pads include a first bonding pad. The second chip includes a second top surface and a second bonding pad on the second top surface. The second chip is positioned on the first top surface such that the pads are uncovered by the second chip and the second bonding pad is mostly closed to the first bonding pad. The conductive wire bonds to the first bonding pad and the second bonding pad to electrically connect the second chip to the first chip and is configured to transmit high-frequency signals between the first chip and the second chip.
    Type: Grant
    Filed: July 22, 2012
    Date of Patent: June 3, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu
  • Chip package and method for assembling chip package
    Patent number: 8736078
    Abstract: A chip package includes a PCB, a connecting pad fixed on a surface of the PCB and a chip fixed on the connecting pad. The connecting pad includes a first metal film on its surface facing away from the PCB. The chip includes a second metal film formed on its surface opposite to the PCB. The first and the second metal are connected to each other via a eutectic manner.
    Type: Grant
    Filed: June 27, 2012
    Date of Patent: May 27, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu