Patents by Inventor Kai Yi

Kai Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080001136
    Abstract: A memory cell for an electrically writeable and erasable memory medium as well as a memory medium thereof is provided. The memory cell comprises a data recording element, the data recording element has a plurality of multiple-layer structure disposed one on top of another, each the multiple-layer structure comprising a plurality of sequentially disposed individual layers. At least one of the plurality of individual layers is capable of changing phase between a crystalline state and an amorphous state in response to an electrical pulse, one of the plurality of individual layers having at least one atomic element which is absent from other one of the plurality of individual layers, and the plurality of multiple-layer structure is of a superlattice-like structure to lower a heat diffusion out of the data recording element to shorten a phase change time of the respective individual layers.
    Type: Application
    Filed: January 27, 2005
    Publication date: January 3, 2008
    Inventors: Tow Chong, Lu Shi, Rong Zhao, Xiang Miao, Pik Tan, Hao Meng, Kai Yi, Xiang Hu, Ke Li, Ping Luo
  • Publication number: 20070126078
    Abstract: An interdigitized capacitor comprising first and second electrodes. The first electrode comprises two combs symmetrical to a first mirror plane. The fingers of the combs extend toward the first mirror plane. The second electrode comprises two combs and a linear plate. The combs are symmetrical to a second mirror plane and the fingers thereof extend toward the second mirror plane. The linear plate is located at the second mirror plane and connected to one finger of the combs of the second electrode. The first and second mirror planes are orthogonal. The fingers of the combs of the first and second electrodes are interdigitized.
    Type: Application
    Filed: June 1, 2006
    Publication date: June 7, 2007
    Inventors: Kai-Yi Huang, Chia-Jen Hsu, Len-Yi Lu
  • Patent number: 7164339
    Abstract: An integrated transformer with a stack structure comprises a middle dielectric layer, a bottom dielectric layer, a first winding and a second winding. A portion of the first winding is disposed over a surface of the middle dielectric layer and the remaining portion of the first winding is disposed over a surface of the bottom dielectric layer. A portion of the second winding is disposed over the surface of the middle dielectric layer and the remaining portion of the second winding is disposed over the surface of the bottom dielectric layer. The second winding doesn't intersect with the first winding. The portions of the first and second windings over the surface of the middle dielectric layer connect with the remaining portions of the first and second windings over the surface of the bottom dielectric through via plugs.
    Type: Grant
    Filed: February 24, 2005
    Date of Patent: January 16, 2007
    Assignee: Winbond Electronics Corp.
    Inventor: Kai-Yi Huang
  • Publication number: 20060077028
    Abstract: An integrated transformer with a stack structure comprises a middle dielectric layer, a bottom dielectric layer, a first winding and a second winding. A portion of the first winding is disposed over a surface of the middle dielectric layer and the remaining portion of the first winding is disposed over a surface of the bottom dielectric layer. A portion of the second winding is disposed over the surface of the middle dielectric layer and the remaining portion of the second winding is disposed over the surface of the bottom dielectric layer. The second winding doesn't intersect with the first winding. The portions of the first and second windings over the surface of the middle dielectric layer connect with the remaining portions of the first and second windings over the surface of the bottom dielectric through via plugs.
    Type: Application
    Filed: February 24, 2005
    Publication date: April 13, 2006
    Inventor: Kai-Yi Huang